Semiconductor light emitting device including a fluorescent material

ABSTRACT

A light emitting device or image display includes a fluorescent material as a wavelength converter for converting a wavelength into another. The fluorescent material is disposed in a predetermined positional relation, to prevent external leakage of primary light and to extract secondary light made by wavelength-converting the primary light with a very high efficiency. By using a semiconductor light emitting element for ultraviolet emission and combining it with a fluorescent material or any other appropriate material having a wavelength converting function, various kinds of applications, such as illuminator, having a remarkably long-life light source can be made. The semiconductor light emitting element preferably has a emission wavelength near 330 nm, and preferably uses BGaN in its light emitting layer.

This is a continuation of application Ser. No. 09/143,905 filed Aug. 31,1998 now U.S. Pat. No. 6,340,824, which application is herebyincorporated by reference in its entirety.

BACKGROUND OF THE INVENTION

This invention relates to a semiconductor light emitting element,semiconductor light emitting device, image display device, and so on.More specifically, the invention relates to a semiconductor lightemitting element, semiconductor light emitting device, image displaydevice, and any other elements and devices configured to preventexternal leakage of primary light emitted from a light emitting layerand to thereby waveform-convert it into secondary light and extract itwith a remarkably high efficiency.

Semiconductor light emitting elements and various types of semiconductorlight emitting devices using same have various advantages, such ascompactness, low power consumption and high reliability, and are used inprogressively wider applications, such as indoor and outdoor displaypanels, railway and traffic signals, car-borne signal illuminators,which are required to be highly luminous and highly reliable.

Among these semiconductor light emitting elements, those using galliumnitride compound semiconductors are being remarked recently. Galliumnitride compound semiconductors are direct-transitional III-V compoundsemiconductors which can efficiently emit light in relatively shortwavelength ranges.

Throughout the present application, the “gallium nitride compoundsemiconductor” pertain to III-V compound semiconductors expressed byB_(x)In_(y)Al_(z)Ga_((1-x-y-z))N (0≦x≦1, 0≦y≦1, 0≦z≦1) and to any mixedcrystal which includes phosphorus (P) or arsenic (As), for example, asgroup V species in addition to N in the above-mentioned chemicalformula.

Gallium nitride compound semiconductors are remarked as hopefulmaterials of LEDs (light emitting diodes) and semiconductor lasersbecause the band gap can be changed from 1.89 to 6.2 eV by controllingthe mole fractions x, y and z in the above-mentioned chemical formula.If highly luminous emission is realized in short wavelength ranges ofblue and ultraviolet, the recording capacities of all kinds of opticaldiscs will be doubled, and full color images will be realized on displaydevices. Under such and other prospects, short wavelength light emittingelements using gallium nitride compound semiconductors are under rapiddevelopments toward improvements in their initial characteristics andreliability.

Structures of conventional light emitting elements using gallium nitridecompound semiconductors are disclosed in, for example, Jpn. J. Appl.Phys., 28 (1989) p.L2112; Jpn. J. Appl. Phys., 32(1993) p.L8; andJapanese Patent Laid-Open Publication No. 5-291621.

FIG. 141 is a cross-sectional view schematically showing a conventionalsemiconductor light emitting element. The semiconductor light emittingelement 6100 shown here is a gallium nitride semiconductor lightemitting element. The light emitting element 6100 has a multi-layeredstructure of semiconductors stacked on a sapphire substrate 6120,namely, a buffer layer 6140, n-type contact layer 6160, n-type claddinglayer 6118, light emitting layer 6120, p-type cladding layer 6122 andp-type contact layer 6124 which are stacked in this order on thesapphire substrate 6120.

The buffer layer 6140 may be made of n-type GaN, for example. The n-typecontact layer 6160 has a high n-type carrier concentration to ensureohmic contact with the n-side electrode 6134, and its material may beGaN, for example. The n-type cladding layer 6118 and the p-type claddinglayer 6122 function to confine carriers within the light emitting layer6120, and their refractive index must be lower than that of the lightemitting layer 6120. The light emitting layer 6120 is a layer in whichemission occurs due to recombination of electric charges injected as acurrent into the light emitting element.

The light emitting layer 6120 may be made of undoped InGaN, for example,and the cladding layers 6118 and 6122 may be made of AlGaN having alarger band gap than the light emitting layer 6120. The p-type contactlayer 6124 has a high p-type carrier concentration to ensure ohmiccontact with the p-side electrode 6126, and its material may be GaN, forexample.

Stacked on the p-type contact layer 6124 is the p-side electrode 6126which is transparent to the emitted light. Stacked on the n-type contactlayer 6160 is the n-side electrode 6134. Bonding pads 6132 of Au arestacked on these electrodes, respectively, so that wires (not shown) forsupplying a operating current to the element be bonded. The surface ofthe element is covered by the protective films 6130 and 6145 of siliconoxide, for example.

The conventional light emitting element 6100 is so configured that lightemitted from the light emitting layer be directly extracted externally,and involved the problems indicated below.

One of the problems lies in variable emission wavelengths caused bystructural varieties of light emitting elements. That is, semiconductorlight emitting elements, even when manufactured under the sameconditions, are liable to vary in quantity of impurities and inthicknesses of respective layers, which results in variety in emissionwavelength.

Another problem lies in chances in emission wavelength depending uponthe operating current. That is, emission wavelength of a semiconductorlight emitting element may change depending upon the quantity ofelectric current supplied thereto, and it was difficult to control theemission luminance and emission wavelength independently.

Another problem lies in changes in emission wavelength depending uponthe temperature. That is, when the temperature of a semiconductor lightemitting element, particularly of its light emitting layer, chances, theeffective band gap of the light emitting layer also changes, and causesan instablility of the emission wavelength.

As explained above, in conventional semiconductor light emittingelements, it was difficult to entirely control varieties in structure,temperature and electric current and to thereby limit changes inemission wavelength within a predetermined range, such as several nm(nanometers).

Conventional semiconductor light emitting devices involved an additionalproblem, namely, materials and structures of semiconductor lightemitting elements used therein had to be determined and changedappropriately in accordance with desired emission wavelengths, such asselecting AlGaAs materials for emission of red light, GaAsP or InGaAlPmaterials for yellow light, GaP or InGaAlP materials for green light andInGaN materials for blue light.

SUMMARY OF THE INVENTION

It is therefore an object of the invention to provide a semiconductorlight emitting element and a semiconductor light emitting device whichare highly stable in emission wavelength and can wavelength-convertlight with a high conversion efficiency in a wide wavelength range fromvisible light to infrared band.

According to the first aspect of the invention, there is provided asemiconductor light emitting element and a light emitting devicecomprising a wavelength converter located adjacent to a light extractionend of the light emitting layer to absorb the primary light emitted fromthe light emitting layer and to release secondary light of a secondwavelength different from the first wavelength.

The first aspect of the present invention is embodied in theabove-mentioned mode, and attains the effects explained below.

Light from the light emitting layer is not extracted directly butconverted in wavelength by a fluorescent material. Therefore, it isprevented that the emission wavelength varies with varieties ofmanufacturing parameters of the semiconductor light emitting elements,drive current, temperature and other inevitable factors. That is, theinvention realizes remarkable stability of emission wavelengths andmakes it possible to control the emission luminance and the emissionwavelength independently.

The fluorescent material may include a plurality of different materialsto obtain a plurality of different emission wavelengths. For example, byappropriately mixing different fluorescent materials for red (R), green(G) and blue (B) to form the fluorescent material in each light emittingelement, emission of white light can be obtained easily.

The material and the structure of the semiconductor light emittingelements used in a device need not be changed depending on the desiredemission wavelength of the device. That is, in conventional techniques,optimum materials had to be selected to form semiconductor lightemitting elements in accordance with desired emission wavelengths, suchas selecting AlGaAs materials for emission of red light, GaP materialsfor yellow light, InGaAlP materials for green light and InGaN materialsfor blue light. However, according to the invention, it is sufficient toselect appropriate fluorescent materials, and the material of thesemiconductor light emitting element need not be changed.

Even when a device needs an arrangement of a plurality of semiconductorlight emitting elements having different emission colors, such elementsfor different emission colors can be made only by changing the materialof the fluorescent member, and all of the semiconductor light emittingelements may be common in materials and structure. This contributes tosimplification of the structure of the light emitting device, remarkablereduction of the manufacturing cost and higher reliability.Additionally, by uniforming the drive current, supplied voltage or thesize of the elements, its application can be extended remarkably.

According to the second aspect of the invention, there is provided asemiconductor light emitting element, a light emitting device and aimage display device comprising a light emitting layer for emittingprimary light of a first wavelength, a wavelength converter locatedadjacent to a light extraction end of the light emitting layer to absorbthe primary light emitted from the light emitting layer and to releasesecondary light of a second wavelength different from the firstwavelength, and a first optical reflector located adjacent to a lightrelease end of the wavelength converter and having a lower reflectancefor the secondary light released from the wavelength converter and ahigher reflectance for the primary light passing through the wavelengthconverter.

Since the optical reflector RE1 is provided, the primary light havingleaked through the wavelength converter FL can be reflected with a highefficiency and can be returned back to the wavelength converter FL. Theprimary light returned back in this manner is wavelength-converted bythe wavelength converter FL, and passes through the optical reflectorRE1 as secondary light. That is, the optical reflector RE1 locatedadjacent to the emission end of the wavelength converter FL preventsleakage of primary light by returning part of the primary light passingthrough the wavelength converter FL back to it for wavelength conversionthereby. Therefore, the primary light can be wavelength-converted with ahigh efficiency. Additionally, the wavelength converter FL is preventedfrom being exited by outer turbulent light and from emitting undesiredlight.

The semiconductor light emitting element may include an optical absorberAB. In this case, the optical absorber absorbs primary light passingthrough the optical reflector RE1 and prevents external leakage thereof.The light absorber AB also functions to adjust the spectrum of theextracted light and to improve the chromatic pureness. Additionally,since the light absorber AB absorbs ultraviolet rays entering from theexterior, it is prevented that such external turbulent light undesirablyexcites the wavelength converter FL and causes undesired emission.

The semiconductor light emitting element may further include a reflectorRE2 to reflect primary light back into the wavelength converter FL. As aresult, primary light can be wavelength-converted and extracted with ahigher efficiency.

The semiconductor light emitting element may further includes an opticalreflector RE3 for greater improvement of the wavelength conversionefficiency. In this case, not only the primary light but also thesecondary light or any other optical component different in wavelengthfrom the primary light can be prevented from external leakage. Theoptical reflector RE3 has a limitative aperture so that light can exitonly through the aperture. By decreasing the size of the aperture, alight emitting element as a point-sized light source can be made easily.Such a point-sized light source enables effective collection of light bylenses or other optical elements, and it is therefore practicallyadvantageous in most cases.

The semiconductor light emitting element may further include an opticalreflector RE4 to more efficiently extract secondary light by reflectingit after wavelength conversion by the wavelength converter FL.

According to the invention, it is also possible to realize an imagedisplay device with a low power consumption, long life, highreliability, quick rising and good mechanical reliability.

As explained above, the invention provides a semiconductor lightemitting element, semiconductor light emitting device and image displaydevice which are simple in structure, stable in emission wavelength,excellent in emission efficiency, and capable of highly luminousemission in a wide wavelength range from visible light to infraredbands, and the invention promises great industrial contribution.

Moreover, the invention can provide various applications of thesemiconductor light emitting element or device, such as illuminators,which are more efficient, lower in power consumption and longer in lifethan conventional fluorescent lamps and bulbs.

The illuminator according to the invention comprises: a semiconductorlight emitting element for emitting ultraviolet rays; and a fluorescentelement for absorbing said ultraviolet rays emitted from saidsemiconductor light emitting element and for releasing secondary lighthaving a longer wavelength than said ultraviolet rays.

Said semiconductor light emitting element preferably contains galliumnitride compound semiconductor in a light emitting layer thereof.

Preferably, said secondary light is substantially a visible light.

Preferably, a predetermined number of said semiconductor light emittingelements are serially connected to form a unit, and a plurality of saidunits are connected in parallel.

The illuminator preferably further comprises a converter circuit forconverting a high frequency voltage into a d.c voltage so that saidsemiconductor light emitting elements be driven when connected to apower source of a fluorescent lamp.

The illuminator preferably further comprises a first optical reflectionfilm located between said semiconductor light emitting element and saidfluorescent element, and having a wavelength selectivity to pass saidultraviolet rays and to reflect said secondary light released from saidfluorescent element.

The illuminator preferably further comprises a second optical reflectionfilm located on one side of said fluorescent element opposite from saidsemiconductor light emitting element, and having a wavelengthselectivity to reflect said ultraviolet rays and to pass said secondarylight released from said fluorescent element.

The illuminator preferably further comprises a light absorber located onone side of said fluorescent element opposite from said semiconductorlight emitting element, and having a wavelength selectivity to absorbsaid ultraviolet rays and to pass said secondary light released fromsaid fluorescent element.

The illuminator preferably comprises a wiring board; light emittingdevices supported on said wiring board; and a translucent outer shellencapsulating said wiring board, each said semiconductor light emittingdevice including: said semiconductor light emitting element; and saidfluorescent element.

The illuminator preferably comprises a wiring board; a plurality ofsemiconductor light emitting elements supported on said wiring boards;and a translucent outer shell encapsulating said wiring board, saidouter shell having a fluorescent element on the inner wall surfacethereof.

The illuminator preferably further comprises a pulse generator forsupplying a pulsating operating current to said semiconductor lightemitting element.

The illuminator preferably further comprises a concave mirror forreflecting said visible light to orient it in a predetermined direction.

Preferably, the emission wavelength of said semiconductor light emittingelement is approximately 330 nm.

A read-out device according to the invention comprises:

a semiconductor light emitting element for emitting ultraviolet rays; afluorescent element for absorbing said ultraviolet rays emitted fromsaid semiconductor light emitting element and for releasing light havinga longer wavelength than said ultraviolet rays; and a photodetector fordetecting said light with the longer wavelength reflected in theexterior, said light emitted released from said fluorescent elementbeing irradiated onto a manuscript to read out information therefrom.

Preferably, said semiconductor light emitting element contains a galliumnitride compound semiconductor in a light emitting layer thereof.

A projector according to the invention for projecting a profile on atranslucent medium in an enlarged scale, comprises: a semiconductorlight emitting element for emitting ultraviolet rays; a fluorescentelement for absorbing said ultraviolet rays emitted from saidsemiconductor light emitting element and for releasing visible light;and an optical system for collecting said visible light to direct itonto a screen.

Preferably, said semiconductor light emitting element contains a galliumnitride compound semiconductor in a light emitting layer thereof.

A purifier according to the invention comprises:

a purifying circuit for passing a liquid or a gas therethrough; and asemiconductor light emitting element located along said purifyingcircuit to emit ultraviolet rays.

Preferably, said semiconductor light emitting element contains a galliumnitride compound semiconductor in a light emitting layer thereof.

The purifier preferably further comprises an ozone generator along saidpurifying circuit so that said ultraviolet rays are irradiated to aliquid containing ozone generated by said ozone generator.

The purifier preferably further comprises a heater along said purifyingcircuit a gas purified by said purifying circuit be discharged afterbeing heated.

Preferably the emission wavelength of said semiconductor light emittingelement is approximately 330 nm.

A display device according to the invention comprises: a semiconductorlight emitting element for releasing ultraviolet rays; and a displaypanel having stacked a fluorescent element for absorbing saidultraviolet rays released from said semiconductor light emitting elementand for releasing visible light.

Preferably, said semiconductor light emitting element contains a galliumnitride compound semiconductor in a light emitting layer thereof.

Illuminators according to the invention have high mechanical strengthsagainst impulses or vibrations.

Light from the light emitting layer is not extracted directly butconverted in wavelength by a fluorescent material. Therefore, it isprevented that the emission wavelength varies with varieties ofmanufacturing parameters of the semiconductor light emitting elements,drive current, temperature and other inevitable factors. That is, theinvention realizes remarkable stability of emission wavelengths andmakes it possible to control the emission luminance and the emissionwavelength independently.

The fluorescent material may include a plurality of different materialsto obtain a plurality of different emission wavelengths. For example, byappropriately mixing different fluorescent materials for red (R), green(G) and blue (B) to form the fluorescent material in each light emittingelement, emission of white light can be obtained easily.

The light emitting layer may be made of GaN containing boron. In thiscase, ultraviolet rays near 330 nm which efficiently excites thefluorescent member can be obtained and enhanced.

Efficiency of the wavelength conversion can be enhanced to moreeffectively extract the secondary light by reflecting and confiningultraviolet rays emitted from the semiconductor light emitting elementand by reflecting and externally guiding the secondary light emittedfrom the fluorescent member.

The material and the structure of the semiconductor light emittingelements used in a device need not be changed depending on the desiredemission wavelength of the device. That is, in conventional techniques,optimum materials had to be selected to form semiconductor lightemitting elements in accordance with desired emission wavelengths, suchas selecting AlGaAs materials for emission of red light, GaAsP materialsfor yellow light, InGaAlP or GaP materials for green light and InGaNmaterials for blue light. However, according to the invention, it issufficient to select appropriate fluorescent materials, and the materialof the semiconductor light emitting element need not be changed.

Even when a device needs an arrangement of a plurality of semiconductorlight emitting elements having different emission colors, such elementsfor different emission colors can be made only by changing the materialof the fluorescent member, and all of the semiconductor light emittingelements may be common in materials and structure. This contributes tosimplification of the structure of the light emitting device, remarkablereduction of the manufacturing cost and higher reliability.Additionally, by uniforming the drive current, supplied voltage or thesize of the elements, its application can be extended remarkably.

As explained above, the invention provides an illuminator and othervarious kind of applications which are simple in structure, stable inemission wavelength, and capable of highly luminous emission in a widewavelength range from visible light to infrared bands, and the inventionpromises great industrial contribution.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention kill be understood more fully from the detaileddescription given herebelow and from the accompanying drawings of thepreferred embodiments of the invention. However, the drawings are notintended to imply limitation of the invention to a specific embodiment,but are for explanation and understanding only.

In the drawings:

FIG. 1 is a cross-sectional view schematically showing a semiconductorlight emitting element taken as the first embodiment of the invention,

FIG. 2 is a cross-sectional view schematically showing the secondsemiconductor light emitting element of the invention,

FIG. 3 is a roughly illustrated cross-sectional view of a light emittingdevice according to the invention,

FIG. 4 is a roughly illustrated cross-sectional view of a light emittingdevice according to the invention,

FIG. 5 is a roughly illustrated cross-sectional view of a third exampleof the light emitting device according to the invention,

FIG. 6 is a roughly illustrated cross-sectional view of a forth exampleof the light emitting device according to the invention,

FIG. 7 is a roughly illustrated cross-sectional view of a fifth exampleof the light emitting device according to the invention,

FIG. 8 is a roughly illustrated cross-sectional view of a sixth exampleof the light emitting device according to the invention,

FIG. 9A is a roughly illustrated plan view and

FIG. 9B is a roughly illustrated cross-sectional view of a seventhexample of the light emitting device according to the invention,

FIGS. 10A through 10D are roughly illustrated views of the eighthexample of the light emitting devices according to the invention,

FIG. 10A is a perspective view and

FIG. 10B is a partially enlarged perspective view in a partiallysee-through mode, and the substrate type includes a cavity type as shownin FIG. 10C as the cross sectional view and a resin mold type as shownin FIG. 10D as the cross sectional view,

FIG. 11 is a roughly illustrated cross sectional view of the ninthexample of the light emitting device according to the invention,

FIG. 12A is a roughly illustrated plan view and

FIG. 12B is a roughly illustrated cross-sectional view of a tenthexample of the light emitting device according to the invention,

FIG. 13A is a roughly illustrated perspective view and

FIG. 13B is a roughly illustrated cross-sectional view of a eleventhexample of the light emitting device according to the invention,

FIG. 14 is a roughly illustrated perspective view of a twelfth exampleof the light emitting device according to the invention,

FIG. 15 is a roughly illustrated cross sectional view of a thirtiethexample of the light emitting device according to the invention,

FIG. 16 is a roughly illustrated cross sectional view of a example ofthe light emitting device according to the embodiment,

FIG. 17 is a roughly illustrated cross-sectional view of a lightemitting device according to the invention,

FIG. 18 is a roughly illustrated cross-sectional view of a third exampleof the light emitting device according to the invention,

FIG. 19 is a roughly illustrated cross-sectional view of a forth exampleof the light emitting device according to the invention,

FIG. 20 is a roughly illustrated cross-sectional view of a fifth exampleof the light emitting device according to the invention,

FIG. 21 is a roughly illustrated cross-sectional view of a sixth exampleof the light emitting device according to the invention,

FIG. 22A is a roughly illustrated plan view and FIG. 22B is a roughlyillustrated cross-sectional view of a seventh example of the lightemitting device according to the invention,

FIGS. 23A and 23B are roughly illustrated cross sectional views of theeighth example of the light emitting devices according to the invention,

FIG. 24 is a roughly illustrated cross sectional view of the ninthexample of the light emitting device according to the invention,

FIG. 25 is a roughly illustrated cross-sectional view of a tenth exampleof the light emitting device according to the invention,

FIG. 26 is a roughly illustrated cross sectional view of a eleventhexample of the light emitting device according to the invention,

FIGS. 27A through 27C are a roughly illustrated cross sectional view ofa example of the light emitting device according to the embodiment,

FIGS. 28A through 28C are roughly illustrated cross-sectional views of asecond examples of the light emitting device according to theembodiment,

FIGS. 29A through 29C are roughly illustrated cross-sectional views ofthird examples of the light emitting device according to the embodiment,

FIGS. 30A through 30C are roughly illustrated cross-sectional views of aforth examples of the light emitting device according to the embodiment,

FIGS. 31A through 31C are roughly illustrated cross-sectional views offifth examples of the light emitting device according to the embodiment,

FIGS. 32A through 32C are roughly illustrated cross-sectional views ofthe sixth examples of the light emitting devices according to theembodiment,

FIGS. 33A through 33C are roughly illustrated cross-sectional views ofthe seventh examples of the light emitting device according to theembodiment,

FIGS. 34A through 34C are roughly illustrated cross-sectional views ofeighth examples of the light emitting device according to theembodiment,

FIG. 35 is a roughly illustrated cross-sectional view of a example ofthe light emitting device according to the embodiment,

FIG. 36 is a roughly illustrated cross-sectional view of a lightemitting device according to the embodiment,

FIG. 37 is a roughly illustrated cross-sectional view of a third exampleof the light emitting device according to the embodiment,

FIG. 38 is a roughly illustrated cross-sectional view of a forth exampleof the light emitting device according to the embodiment,

FIG. 39 is a roughly illustrated cross-sectional view of a fifth exampleof the light emitting device according to the embodiment,

FIG. 40 is a roughly illustrated cross-sectional view of a sixth exampleof the light emitting device according to the embodiment,

FIG. 41 is a roughly illustrated cross-sectional view of a example ofthe light emitting device according to the embodiment,

FIG. 42 is a roughly illustrated cross-sectional view of a lightemitting device according to the embodiment,

FIG. 43 is a roughly illustrated cross-sectional view of a third exampleof the light emitting device according to the embodiment,

FIG. 44 is a roughly illustrated cross-sectional view of a forth exampleof the light emitting device according to the embodiment,

FIG. 45 is a roughly illustrated cross-sectional view of a fifth exampleof the light emitting device according to the embodiment,

FIG. 46 is a roughly illustrated cross-sectional view of a sixth exampleof the light emitting device according to the embodiment,

FIG. 47 is a roughly illustrated cross-sectional view of a example ofthe light emitting device according to the embodiment,

FIG. 48 is a roughly illustrated cross-sectional view of a lightemitting device according to the embodiment,

FIG. 49 is a roughly illustrated cross-sectional view of a third exampleof the light emitting device according to the embodiment,

FIG. 50 is a roughly illustrated cross-sectional view of a forth exampleof the light emitting device according to the embodiment,

FIG. 51 is a roughly illustrated cross-sectional view of a fifth exampleof the light emitting device according to the embodiment,

FIG. 52 is a roughly illustrated cross-sectional view of a sixth exampleof the light emitting device according to the embodiment,

FIG. 53 is a roughly illustrated cross-sectional view of a example ofthe light emitting device according to the embodiment,

FIG. 54 is a roughly illustrated cross-sectional view of a lightemitting device according to the embodiment,

FIG. 55 is a roughly illustrated cross-sectional view of a third exampleof the light emitting device according to the embodiment,

FIG. 56 s a roughly illustrated cross-sectional view of a forth exampleof the light emitting device according to the embodiment,

FIG. 57 is a roughly illustrated cross-sectional view of a fifth exampleof the light emitting device according to the embodiment,

FIG. 58 is a roughly illustrated cross-sectional view of a sixth exampleof the light emitting device according to the embodiment,

FIGS. 59A and 59B are a roughly illustrated view and a cross-sectionalview of a seventh example of the light emitting device according to theembodiment respectively,

FIG. 60 is a roughly illustrated cross-sectional view of a eighthexample of the light emitting device according to the embodiment,

FIG. 61 is a roughly illustrated cross-sectional view of a ninth exampleof the light emitting device according to the embodiment,

FIG. 62 is a roughly illustrated cross-sectional view of a tenth exampleof the light emitting device according to the embodiment,

FIG. 63 is a roughly illustrated cross-sectional view of a eleventhexample of the light emitting device according to the embodiment,

FIG. 64 is a roughly illustrated cross-sectional view of a twelfthexample of the light emitting device according to the embodiment,

FIG. 65 is a roughly illustrated cross-sectional view of a example ofthe light emitting device according to the embodiment,

FIG. 66 is a roughly illustrated cross-sectional view of a lightemitting device according to the embodiment,

FIG. 67 is a roughly illustrated cross-sectional view of a third exampleof the light emitting device according to the embodiment,

FIG. 68 is a roughly illustrated cross-sectional view of a forth exampleof the light emitting device according to the embodiment,

FIG. 69 is a roughly illustrated cross-sectional view of a fifth exampleof the light emitting device according to the embodiment,

FIG. 70 is a roughly illustrated cross-sectional view of a sixth exampleof the light emitting device according to the embodiment,

FIGS. 71A and 71B are a roughly illustrated plan view and across-sectional view of a seventh example of the light emitting deviceaccording to the embodiment respectively,

FIG. 72 is a roughly illustrated cross-sectional view of a eighthexample of the light emitting device according to the embodiment,

FIG. 73 is a roughly illustrated cross-sectional view of a ninth exampleof the light emitting device according to the embodiment,

FIG. 74 is a roughly illustrated cross-sectional view of a tenth exampleof the light emitting device according to the embodiment,

FIG. 75 is a roughly illustrated cross-sectional view of a eleventhexample of the light emitting device according to the embodiment,

FIG. 76 is a roughly illustrated cross-sectional view of a twelfthexample of the light emitting device according to the embodiment,

FIG. 77 is a roughly illustrated cross-sectional view of a example ofthe light emitting device according to the embodiment,

FIG. 78 is a roughly illustrated cross-sectional view of a lightemitting device according to the embodiment,

FIG. 79 is a roughly illustrated cross-sectional view of a third exampleof the light emitting device according to the embodiment,

FIG. 80 is a roughly illustrated cross-sectional view of a forth exampleof the light emitting device according to the embodiment,

FIG. 81 is a roughly illustrated cross-sectional view of a fifth exampleof the light emitting device according to the embodiment,

FIG. 82 is a roughly illustrated cross-sectional view of a sixth exampleof the light emitting device according to the embodiment,

FIGS. 83A and 83B are a roughly illustrated plan view and across-sectional view of a seventh example of the light emitting deviceaccording to the embodiment respectively,

FIG. 84 is a roughly illustrated cross-sectional view of a eighthexample of the light emitting device according to the embodiment,

FIG. 85 is a roughly illustrated cross-sectional view of a ninth exampleof the light emitting device according to the embodiment,

FIG. 86 is a roughly illustrated cross-sectional view of a tenth exampleof the light emitting device according to the embodiment,

FIG. 87 is a roughly illustrated cross-sectional view of a eleventhexample of the light emitting device according to the embodiment,

FIG. 88 is a roughly illustrated cross-sectional view of a twelfthexample of the light emitting device according to the embodiment,

FIG. 89 is a roughly illustrated cross-sectional view of an example ofthe light emitting device according to the embodiment.

FIGS. 90A and 90B are a roughly illustrated plan view and across-sectional view of a second example of the light emitting deviceaccording to the embodiment respectively,

FIG. 91 is a roughly illustrated cross-sectional view of a third exampleof the light emitting device according to the embodiment,

FIG. 92 is a roughly illustrated cross-sectional view of a forth exampleof the light emitting device according to the embodiment,

FIG. 93 is a roughly illustrated cross-sectional view of a fifth exampleof the light emitting device according to the embodiment,

FIG. 94 is a roughly illustrated cross-sectional view of a sixth exampleof the light emitting device according to the embodiment,

FIG. 95 is a roughly illustrated cross-sectional view of a seventhexample of the light emitting device according to the embodiment,

FIG. 96A is a roughly illustrated cross-sectional view of a example ofthe light emitting device according to the embodiment,

FIG. 96B is a roughly illustrated cross-sectional view of a secondexample of the light emitting device according to the embodiment,

FIG. 97 is a cross-sectional view schematically showing a semiconductorlight emitting element taken as the thirtieth embodiment of theinvention,

FIG. 98 is a cross-sectional view schematically showing thesemiconductor light emitting element according to the fortiethembodiment,

FIG. 99 is a cross-sectional view schematically showing thesemiconductor light emitting element according to the fiftiethembodiment,

FIG. 100 is a cross-sectional view schematically showing thesemiconductor light emitting element according to the sixtiethembodiment,

FIG. 101 is a cross-sectional view schematically showing thesemiconductor light emitting element according to the seventiethembodiment,

FIG. 102 is a cross-sectional view schematically showing thesemiconductor light emitting element according to the eightiethembodiment,

FIG. 103 is a roughly illustrated cross-sectional view of asemiconductor device according to the invention,

FIG. 104 is a roughly illustrated cross-sectional view of asemiconductor device according to the invention,

FIG. 105 is a roughly illustrated cross-sectional view of asemiconductor device according to the invention,

FIG. 106 is a roughly illustrated cross-sectional view of asemiconductor device according to the invention,

FIG. 107 is a roughly illustrated cross-sectional view of asemiconductor device according to the invention,

FIG. 108 is a roughly illustrated cross-sectional view of asemiconductor device according to the invention,

FIG. 109 is a roughly illustrated cross-sectional view of asemiconductor device according to the invention,

FIG. 110 is a roughly illustrated cross-sectional view of asemiconductor device according to the invention,

FIG. 111 is a roughly illustrated cross-sectional view of asemiconductor device according to the invention,

FIG. 112 is a roughly illustrated cross-sectional view of asemiconductor device according to the invention,

FIG. 113 is a roughly illustrated cross-sectional view of asemiconductor device according to the twenty-ninth embodiment of theinvention,

FIG. 114 is a cross-sectional schematic view of the second semiconductorlight emitting device according to the present embodiment,

FIG. 115 is a cross-sectional schematic view of the third semiconductorlight emitting device according to the present embodiment,

FIG. 116 is a cross-sectional schematic view of the fourth semiconductorlight emitting device according to the present embodiment,

FIG. 117 is a schematic view of the fifth semiconductor light emittingdevice according to the present embodiment,

FIG. 118 is a schematic view of the sixth semiconductor light emittingdevice according to the present embodiment,

FIG. 119 is a schematic view of the seventh semiconductor light emittingdevice according to the present embodiment,

FIG. 120 is a schematic view of the eighth semiconductor light emittingdevice according to the present embodiment,

FIG. 121 is a schematic cross-sectional view showing the semiconductorlight emitting device according to the thirtieth embodiment of theinvention,

FIG. 122 is a schematic cross-sectional view of the semiconductor lightemitting device according to the thirty-first embodiment,

FIG. 123 is a schematic cross-sectional view of the semiconductor lightemitting device according to the thirty-second embodiment,

FIG. 124 is a schematic cross-sectional view of an exemplary structureof the image display device according to the embodiment,

FIG. 125 is a schematic cross-sectional view of the modified imagedisplay device according to the thirty-forth embodiment of theinvention,

FIG. 126A is a perspective view of the entirely of the illuminator 4100,

FIG. 126B is a cross-sectional view, and

FIG. 126C is a schematic plan view of a plan view of a wiring board usedtherein, and

FIG. 126D is a schematic diagram showing the electrical circuit of theilluminator 4100,

FIG. 127 is a schematic diagram showing a conventional fluorescent lampsystem,

FIG. 128 is a schematic cross-sectional view of a semiconductor lightemitting device 4130 suitable for use in the present embodiment,

FIG. 129 is a schematic diagram showing a flashing device for a cameraaccording to the invention,

FIG. 130 is a schematic diagram showing a lamp according to theinvention,

FIG. 131 is a schematic diagram showing a read-out device according tothe invention,

FIG. 132 is a schematic diagram showing a projector according to theinvention,

FIG. 133 is a schematic diagram showing a purifier according to theinvention,

FIG. 134 is a schematic diagram of a ultraviolet irradiator according tothe seventh embodiment of the invention,

FIG. 135 is a schematic diagram showing a display device according tothe invention,

FIG. 136 is a schematic diagram showing a semiconductor light emittingdevice according to the invention,

FIG. 137 is a schematic diagram showing a cross-sectional aspect of thesemiconductor light emitting element 4132 suitable for use in theinvention,

FIG. 138 is a graph showing the relation between concentration ofsilicon and photoluminescence (PL) emission intensity when silicon (Si)is doped into BGaN,

FIG. 139 is a diagram showing a schematic cross-sectional aspect ofultraviolet emission type semiconductor light emitting element accordingto another embodiment of the invention,

FIG. 140 is a cross-sectional schematic view showing a modified versionof the semiconductor light emitting element 4132B shown in FIG. 139, and

FIG. 141 is a cross-sectional view schematically showing a conventionalsemiconductor light emitting element.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Explained below some embodiments of the invention with reference to thedrawings.

FIG. 1 is a cross-sectional view schematically showing a semiconductorlight emitting element taken as the first embodiment of the invention.The semiconductor light emitting element 10 shown here is a galliumnitride semiconductor light emitting element. The light emitting element10 has a multi-layered structure of semiconductors stacked on a sapphiresubstrate 12, namely, a buffer layer 14, n-type contact layer 16, n-typecladding layer 18, light emitting layer 20, p-type cladding layer 22 andp-type contact layer 24 which are stacked in this order on the sapphiresubstrate 12.

The buffer layer 14 may be made of n-type GaN, for example. The n-typecontact layer 16 has a high n-type carrier concentration to ensure ohmiccontact with the n-side electrode 34, and its material may be GaN, forexample. The n-type cladding layer 18 and the p-type cladding layer 22function to confine carriers within the light emitting layer 20. Thelight emitting layer 20 is a layer in which emission occurs due torecombination of electric charges injected as a current into the lightemitting element.

The light emitting layer 20 may be made of undoped InGaN, for example,and the cladding layers 18 and 22 may be made of AlGaN having a largerband gap than the light emitting layer 20. The p-type contact layer 24has a high p-type carrier concentration to ensure ohmic contact with thep-side electrode 26, and its material may be GaN, for example.

Stacked on the p-type contact layer 24 is the p-side electrode 26 whichis transparent to the emitted light. Stacked on the n-type contact layer18 is the n-side electrode 34. Bonding pads 32 of Au are stacked onthese electrodes, respectively, so that wires (not shown) for supplyinga operating current to the element be bonded. The surface of the elementis covered by the protective films 30 and 45 of silicon oxide, forexample.

According to the embodiment, the fluorescent material is mixed in ordeposited on either part of the element 10. Appropriate fluorescentmaterials being efficiently excited by a light in the ultraviolet bandare, for example, Y₂O₂S:Eu or La₂O₂S:(Eu,Sm) for mission of red light,(Sr, Ca, Ba, Eu)₁₀(PO₁)₆·Cl₂ for emission of blue light, and 3(Ba, Mg,Eu, Mn)0·8Al₂O₃ for emission of green light. By mixing these fluorescentmaterials in the appropriate ratio, almost all colors in the visiblewavelength range can be realized.

Most of these fluorescent materials have their absorption peaks in thewavelength band of about 300 to 380 nm. Therefore, in order to ensureefficient wavelength conversion by the flourescent materials, the lightemitting element 20 is preferably configured to emit ultraviolet rays inthe wavelength band below 380 nm. For maximizing the conversionefficiency by the fluorescent materials, the light emitting element ismore preferably configured to emit ultraviolet rays of a wavelength near330 nm.

The fluorescent material may be mixed in the p-side electrode 26. Italso may be mixed in at least either of the protective films 30 and 45.It also may be mixed in at least either of the semiconductor layers 14through 24 or substrate 12.

In order to mix the fluorescent material into the p-side electrode 26, asputter deposition or a vacuum deposition, for example, can be used.When the p-side electrode 26 is formed by these method, the fluorescentmaterial may be added. As for the protective films 30 and 45, the samemethod may be used to incorporate the fluorescent material. A chemicalvapor deposition (CVD) may be also usable to incorporate the fluorescentmaterial.

The fluorescent material may be incorporated into the any one of thesemiconductor layers 14 through 24 during the crystal growth process. Itmay also be incorporated into the semiconductor layer by using the ionimplantation after growing the layers. The ion implantation is alsousable to incorporate the fluorescent material into the substrate 12.

The fluorescent material may also be deposited either on the surface ofthe element 10 or between the any adjacent layers thereof. That is, itmay be deposited between any adjacent layers of substrate 12 throughp-type contact layer 24, between the semiconductor layer and theprotective film 30, between the semiconductor layer and the electrode 26or 34, on the surface of the film 45, or on the surface of the electrode26 or 34. As the deposition method of the fluorescent material, forexample, electron beam vacuum deposition, sputtering deposition, andcoating method may be employed. The fluorescent material may be formedon the p-type contact layer 24 as a insulating layer, which functions asa current blocking layer.

In order to deposit the fluorescent material onto the surface of thelight emitting element, one can disperse the fluorescent material intothe appropriate solvent, coat it onto the light emitting element andharden it up. As the solvent to disperse the fluorescent material, forexample, alkalic silicate solution, silicate colloid aqua-solution,phosphate aqua-solution, organic solvent containing silicate compound,organic solvent containing rubber and natural glue aqua-solution may beused. Instead of dispersing the fluorescent material into these solventand coating, it on the light emitting element, one can coat thesesolvent without dispersing the fluorescent material then scatter orspray the fluorescent material on the coated solvent layer to depositit, for example.

According to the invention, by incorporating or depositing thefluorescent material on any part of the light emitting element, thelight emitted from the light emitting layer is efficiently convertedinto the secondary light having a longer wavelength.

For example, in the case that the light emitting layer 20 of the elementis made of GaN, the emitted primary light is a ultraviolet ray having awavelength of 360 to 380 nanometers. The ultraviolet ray is converted bythe fluorescent material into a visible or infrared light having adesired wavelength and the secondary light is extracted.

In the case that the light emitting layer 20 is made of InGaN, a bluelight can be obtained depending on the mole fraction of indium (In)thereof. In that case, the fluorescent material which absorbs the bluelight and converts it into a light having a longer wavelength can beemployed. As such a fluorescent material, for example, organicfluorescent may be used in addition to the inorganic fluorescentexplained above. As such a organic fluorescent, rhodamine B for emissionof red light, brilliantsulfoflavine FF for emission of green light maybe used.

According to the embodiment, instead of extracting the primary lightfrom the light emitting layer, the primary light is converted by thefluorescent material. Therefore, the fluctuation of the emissionwavelength caused by the change in process parameters, operating currentor temperature is dispelled. That is, according to the invention, theemission power and the emission wavelength can be independentlycontrolled.

Besides, according to the invention, by mixing the fluorescent materialsaforementioned, a multi-wavelength emission is easily realized. Forexample, by mixing the fluorescent materials, emitting red (R), green(G) and blue (B) respectively, in an appropriate ratio, and byincorporating them into the light emitting element, a white light isreadily realized.

In FIG. 1, the gallium nitride compound semiconductor light emittingelement formed on the sapphire substrate is exemplary shown. However,the invention is not limited to the specific example, and applicable tothe any gallium nitride semiconductor light emitting elements formed onthe substrate made of SiC, GaN, spinel, ZnO, Si or GaAs, for example.

As for the structure of the light emitting element, the invention is notlimited to the exemplary double-heterostructure and applicable tovarious structures such as the single heterostructure or multiquantumwell structure.

Explained next is a second light emitting element according to theinvention.

FIG. 2 is a cross-sectional view schematically showing the secondsemiconductor light emitting element of the invention. The semiconductorlight emitting element 50 shown here is a zinc selenide (ZnSe)semiconductor light emitting element which has a multi-layered structureof semiconductors, namely, a buffer layer 54, n-type cladding layer 58,light emitting layer 60, p-type cladding layer 62 and transparentconductive layer 64 which are stacked in this order on a GaAs substrate52.

The buffer layer 54 may be made of n-type ZnSe, for example. The n-typecladding layer 58 and the p-type cladding layer 62 function to confinecarriers within the light emitting layer 60. These cladding layers maybe made of ZnSSe having a larger band gap than the light emitting layer60. The light emitting layer 60 is a layer in which emission occurs dueto recombination of electric charges injected as a current into thelight emitting element. The light emitting layer 60 may be made ofundoped ZnSe, for example. The transparent conductive layer 64 is aelectrically conductive layer having a high optical transparency, whichmay be made of indium tin oxide, for example.

Stacked on the conductive layer 64 is the p-side electrode 66 which maybe made of a metal such as gold (Au). On the bottom surface of thesubstrate 52, the n-side electrode 68 is formed. The surface of theelement is covered by the protective films 70 made of silicon oxide, forexample.

The ZnSe light emitting element 50 emits the light having a wavelengthof blue or blue-violet from its light emitting layer 60. This blueemission is converted by the fluorescent material into a visible orinfrared light having a longer wavelength which is extracted outside.

The fluorescent material can be incorporated into various part of theelement 50 as explained with reference to the element 10. For example,it is incorporated into the p-side electrode 66, the transparentconductive layer 64, any one of the semiconductor layers 54 through 62or substrate 52.

In order to mix the fluorescent material into the p-side electrode 66 orconductive layer 64, a sputter deposition or a vacuum deposition, forexample, can be used. When the conductive layer 64 or electrode 66 isformed by these method, the fluorescent material may be added. As forthe protective film 70, the same method may be used to incorporate thefluorescent material. A chemical vapor deposition (CVD) may be alsousable to incorporate the fluorescent material.

The fluorescent material may be incorporated into the any one of thesemiconductor layers Z4 through 62 during the crystal growth process. Itmay also be incorporated into the semiconductor layer by using the ionimplantation after growing the layers. The ion implantation is alsousable to incorporate the fluorescent material into the substrate 52.

The fluorescent material may also be deposited either on the surface ofthe element 50 or between the any adjacent layers thereof. That is, itmay be deposited between any adjacent layers of substrate 52 throughconductive layer 64, between the semiconductor layer and the protectivefilm 70, between the semiconductor layer and the electrode 66 or 68, onthe surface of the film 70, or on the surface of the electrode 66 or 68.As the deposition method of the fluorescent material, for example,electron beam vacuum deposition, sputtering deposition, and coatingmethod may be employed. The fluorescent material may be formed on theconductive layer 64 as a insulating layer, which functions as a currentblocking layer.

Although the ZnSe light emitting element is exemplary shown in FIG. 2,the invention is not limited to the specific example. The invention isalso applicable to any other light emitting element made of SiC, ZnS orBN, for example. These light emitting elements are capable of emitting ashort wavelength emission such as blue with a high efficiency. The shortwavelength emission is converted into the visible or infrared light bythe fluorescent material and extracted.

Next explained are 13 examples of the light emitting devices mountedwith the semiconductor light emitting element explained with referenceto FIGS. 1 and 2.

FIG. 3 is a roughly illustrated cross-sectional view of a light emittingdevice according to the invention. The light emitting device 100A shownhere is a device called “LED (light emitting diode) lamp” of a so-called“lead frame type”. The device 100A includes a semiconductor lightemitting element 10 or 50 mounted on the bottom of a cup of a lead frame110. The p-side electrode and the n-side electrode of the light emittingelement are connected to lead frames 110 and 120 by wires 130, 130,respectively. Inner lead parts of the lead frames are protected by aresin 140.

According to the invention, the light emitting device 100A can beassembled by the same procedure as the conventional devices whichinclude no fluorescent material because the light emitting elementitself includes the fluorescent material. Besides, the durability ofdevice against the change in temperature is not degraded because theresin does not include the fluorescent material. Therefore, thereliability is improved as compared to the devices which includefluorescent material in their resin.

According to the invention, even if the emission from the light emittinglayer of the light emitting element is a ultraviolet ray whosewavelength is shorter than 380 nanometers, the resin or other part ofthe device is not damaged by the ultraviolet emission because theemission is converted into the longer wavelength light before it goesout from the light emitting element. The above mentioned advantagesabout the productivity and the reliability are good as well if asemiconductor laser is employed as the light emitting element. Also thedevice is easy to assemble because the cup enclosure to fill the resincontaining the fluorescent material is not necessary.

FIG. 4 is a roughly illustrated cross-sectional view of a light emittingdevice according to the invention. The light emitting device 200A shownhere is a device called “LED (light emitting diode) lamp” of a so-called“stem type”. The stem 210 includes the lead pins 222 and 226 which arepartially molded in the insulator 220. As the material of the insulator220, ceramics or resin can be used. The lead pins 222 and 226 have theouter lead part 224 and 228 extending to the outside. The element 10 or50 is mounted onto the top of the lead pin 222 and the resin 240 ismolded to protect the element. The one electrode of the light emittingelement is connected to the pin 226 by a wire 230.

By mounting with the light emitting element 10 or 50, the LED lamp ofthe stem type as shown in FIG. 4 also has various advantages asexplained with reference to FIG. 3.

FIG. 5 is a roughly illustrated cross-sectional view of a third exampleof the light emitting device according to the invention. The lightemitting device 250A shown here is a device called “SMD (surface mounteddevice) lamp” of a so-called “substrate type”. The SMD lamp 250A has asubstrate 260 which has electrode patterns 272 and 274. On one of theelectrode patterns, the light emitting element 10 or 50 is mounted. Asthe material of the substrate, a resin such as epoxy, or ceramics suchas alumina or glass may be employed. The electrode of the light emittingelement is connected to the pattern 274 by a wire 280. The lightemitting element is protected by the resin 290.

By mounting with the light emitting element 10 or 50, the LED lamp ofthe stem type as shown in FIG. 5 also has various advantages asexplained with reference to FIG. 3.

FIG. 6 is a roughly illustrated cross-sectional view of a forth exampleof the light emitting device according to the invention. The lightemitting device 300A shown here is a device called “SMD (surface mounteddevice) lamp” of a so-called “lead frame type”. The SMD lamp 300A has alead frame 310 on which the light emitting element 10 or 50 is mounted.As the material of the lead frame 310, a metal such ion coated by tin isemployed. The electrode of the light emitting element is connected tothe lead pin of the lead frame 310. The light emitting element isprotected by the resin 340.

By mounting with the light emitting element 10 or 50, the LED lamp ofthe lead frame type as shown in FIG. 6 also has various advantages asexplained with reference to FIG. 3.

FIG. 7 is a roughly illustrated cross-sectional view of a fifth exampleof the light emitting device according to the invention. The lightemitting device 350A shown here is a device called “planer emissiontype”. The planer emission type device 350A has lead frames 360 and 362on which the light emitting elements 10 or 50 are mounted respectively.Each element is electrically connected to the lead frames by wire 380.The light emitting elements in the cup part of the reflector 370 areprotected by the resin 390. The emission from each element is reflectedby the reflector 370 and form a planer light which is extracted.

By mounting with the light emitting element 10 or 50, the light emittingdevice of the planer emission type as shown in FIG. 7 also has variousadvantages as explained with reference to FIG. 3.

FIG. 8 is a roughly illustrated cross-sectional view of a sixth exampleof the light emitting device according to the invention. The lightemitting device 400A shown here is a device called “dome type”. The dometype device 400A has a lead frame 410 on which a plurality (five to ten,for example) of the light emitting elements 10 or 50 are mountedperipherally. Each element is electrically connected to thecorresponding terminal pin of the lead frame 410 by wire (not shown).The light emitting elements are protected by the resin 440. The dometype light emitting device 400A can emit highly luminous and uniformlight because it has a many light emitting elements.

By mounting with the light emitting element 10 or 50, the light emittingdevice of the dome type 400A as shown in FIG. 8 also has variousadvantages as explained with reference to FIG. 3.

FIG. 9A is a roughly illustrated plan view and FIG. 9B is a roughlyillustrated cross-sectional view of a seventh example of the lightemitting device according to the invention. The light emitting device450A shown here is a device called “meter needle tape”. The device ofthis type is used for a self-illuminating needle of a meter such as aspeed meter of a vehicle. The light emitting device 450A has a substrateor a lead frame 460 on which a plurality (five to twenty, for example)of the light emitting elements 10 or 50 are mounted at certainintervals. Each element is electrically connected to the correspondingterminal pin by a wire (not shown). The light emitting elements areprotected by the resin 490. The meter needle type device 450A is mountedto a flange 466 and fixed to the axis of a speed meter, for example.

The meter needle type device 450A is compact and light-weight, and iscapable of emitting a highly luminous and uniform light because itincludes many light emitting elements.

By mounting with the light emitting elements 10 or 50, the lightemitting device of the meter needle type 450A as shown in FIG. 9 alsohas various advantages as explained with reference to FIG. 3.

Besides, emission color can be easily changed along the needle byarranging light emitting elements having a different emission color.According to the invention, it is easily realized only by changing thefluorescent material which is incorporated into the light emittingelement. The other materials and the basic structure of the lightemitting elements are the same each other. Therefore, the operatingcurrent and the voltage can be advantageously the same for all the lightemitting elements.

FIGS. 10A through 10D are roughly illustrated views of the eighthexample of the light emitting devices according to the invention. Thelight emitting devices 500A shown here are devices called “seven segmenttype” among which so-called “substrate type” is specifically shown inthe figure. The light emitting device of this type is used to indicate acharacter such as a digit or an alphabet. FIG. 10A is a perspective viewand FIG. 10B is a partially enlarged perspective view in a partiallysee-through mode. The substrate type includes a cavity type as shown inFIG. 10C as the cross sectional view and a resin mold type as shown inFIG. 10D as the cross sectional view. The light emitting element 10 or50 is electrically connected to the corresponding terminal pin by a wire530. The light emitted from the element is reflected by the reflector520 and extracted. At the aperture, a color filter 544 and/or adiffusing film 548 is arranged.

By mounting with the a light emitting element 10 or 50, the lightemitting devices of the seven segment type 500A as shown in FIGS. 10Athrough 10D also have various advantages as explained with reference toFIG. 3.

FIG. 11 is a roughly illustrated cross sectional view of the ninthexample of the light emitting device according to the invention. Thelight emitting device 550A shown here is also a device called “sevensegment type” among which so-called “lead frame type” is specificallyshown in the figure. The light emitting element 10 or 50 according tothe invention is mounted on the lead frame 560 and is electricallyconnected to the corresponding terminal by a wire 580. The lightemitting element is molded by the resin 590. The light emitted from theelement is reflected by the reflector 570 and extracted.

By mounting with the a light emitting element 10 or 50, the lightemitting device of the seven segment type 550A as shown in FIG. 11 alsohas various advantages as explained with reference to FIG. 3.

FIG. 12A is a roughly illustrated plan view and FIG. 12B is a roughlyillustrated cross-sectional view of a tenth example of the lightemitting device according to the invention. The light emitting device600A shown here is a device called “level meter type”. The device ofthis type is used as the level meter to indicate speed of a vehicle orrotation of an engine, for example. The level meter type device 600A hasa flange 602, and a substrate or a lead frame 610 on which a plurality(ten to thirty, for example) of the light emitting elements 10 or 50 aremounted at certain intervals. In many case, the elements are selectedand mounted so that the emission color changes continuously or stepwisealong the line. Each element is connected to the corresponding terminalpin by a wire (not shown). The light emitting elements are protected bythe resin 640.

By mounting with the light emitting elements 10 or 50, the lightemitting device of the level meter type 600A as shown in FIGS. 12A and12B also have various advantages as explained with reference to FIG. 3.

In many case, such a light emitting device of the level meter type needto have light emitting elements having different emission color.According to the invention, the emission color of each element can beeasily changed only by changing the fluorescent material which isincorporated into the light emitting element. The other materials andthe basic structure of the light emitting elements remain the same eachother. Therefore, the operating current and the voltage can beadvantageously the same for all the light emitting elements.

FIG. 13A is a roughly illustrated perspective view and FIG. 13B is aroughly illustrated cross-sectional view of a eleventh example of thelight emitting device according to the invention. The light emittingdevice 650A shown here is a device called “matrix type”. The device ofthis type has a plurality of emission spot 652 which is arranged in agrid pattern, and is used to indicate characters, symbols or figures.

As shown in FIG. 13B, the device 650A has a substrate 660 on which aplurality of the light emitting elements 10 or 50 are mounted at certainintervals. Each element is connected to the corresponding terminal by awire (not shown). The light emitting elements are protected by the resin690. The emission from the element is reflected by the reflector 670 andextracted. A color filter 692 and/or diffusing film 694 may be arrangedif necessary.

By mounting with the light emitting elements 10 or 50, the lightemitting device of the matrix type 650A as shown in FIGS. 13A and 13Balso have various advantages as explained with reference to FIG. 3.

If the device 650A needs to have more than two kinds of emission colors,the emission color of each emission spot 692 can be easily changed onlyby changing the fluorescent material of the corresponding element. Thematerials and the basic structure of the each light emitting elementremain the same each other. Therefore, the operating current and thevoltage of the each light emitting element can remain advantageously thesame. Besides, the fluctuation of the emission color is fairly small.

FIG. 14 is a roughly illustrated perspective view of a twelfth exampleof the light emitting device according to the invention. The lightemitting device 700A shown here is a device called “array type” which isused as a light source of a facsimile or a image scanner. The device ofthis type has a rail-like reflector 722 which is fixed to the substrate720. A plurality of light emitting elements 10 or 50 according to theinvention are mounted on the reflector 722. Between each of theelements, a separator 724 is located. A rod lens 740 is arranged abovethe light emitting elements and converge the emission from the element.

By mounting with the light emitting elements 10 or 50, the lightemitting device of the array type 700A as shown in FIG. 14 also hasvarious advantages as explained with reference to FIG. 3. Besides, thefluctuation of the emission color is fairly small.

If the device 700A needs to have more than two kinds of emission colors,the emission color of each element can be easily changed only bychanging the fluorescent material thereof. The materials and the basicstructure of the each light emitting element remain the same each other.Therefore, the operating current, the voltage and the size of the eachlight emitting element can remain advantageously the same.

FIG. 15 is a roughly illustrated cross sectional view of a thirteenthexample of the light emitting device according to the invention. Thelight emitting device 750A shown here is a semiconductor laser devicecalled “can type”. The device of this type has a stem 770 on which asemiconductor laser elements 10 or 50 according to the invention ismounted. On the backside of the element, a photodetector 775 is arrangedto monitor the output of the element 10 or 50. The head of the stem 770is sealed by the can 790. The laser beam emitted from the element isextracted through the window.

By mounting with the light emitting elements 10 or 50, the lightemitting device of the can type 750A as shown in FIG. 15 also hasvarious advantages as explained with reference to FIG. 3.

Next explained is a third embodiment of the invention.

FIG. 16 is a roughly illustrated cross sectional view of a example ofthe light emitting device according to the embodiment. The lightemitting device 100B shown here is a LED lamp of the lead frame type.According to the embodiment, the semiconductor light emitting element990 is mounted on the lead frame 110 then the fluorescent material isdeposited on the surface of the element 990 to from the fluorescentlayer FL.

In the embodiment, the element 990 need not to include a fluorescentmaterial. However, the element preferably have a luminous emission inthe wavelength range of blue or ultraviolet in order to obtain a highconversion yield by using the fluorescent materials which are easilyavailable. As such a element having a light emitting layer made of, forexample, gallium nitride, zinc selenide, silicon carbide or boronnitride may be employed.

In order to deposit the fluorescent material, first, the fluorescentmaterial is dispersed into an appropriate solvent, then, it is coated onthe surface of the element 990 and finally, it is dried up. Another wayto form the fluorescent layer is, first, coat an appropriate solvent onthe surface of the element 990, then, scatter or spray the fluorescentmaterial onto the solvent, finally, harden it up.

The solvent is preferably adhesive. The examples of the solvent are theones including an inorganic polymer as a main component. The onesincluding a rubber material, farinaceous material or protein as a maincomponent are also usable as the solvent. If the inorganic solvent isused, the product advantageously becomes highly durable against the heatand chemicals and becomes flame-retardant. If the rubber material, thefarinaceous material or the protein is used, the residual stress of thedried product is relaxed. Therefore, the problems caused by the stresssuch as deterioration of the device or the breakage of the wire areadvantageously prevented. The farinaceous material and the protein arealso easy to handle because they are water-soluble.

The specific examples of the solvent are the alkalic silicate solution,the silicate colloid aqua-solution, the phosphate aqua-solution, theorganic solvent containing silicate compound, the organic solventcontaining rubber and the natural glue aqua-solution.

The refractive index of the dried product of the solvent may bepreferably between the refractive index of the surface of light emittingelement and the refractive index of its outside. For example, if thelight emitting element is molded by a resin, the refractive index of thedried product of the solvent preferably between the surface of lightemitting element and the refractive index of the resin. Thisrelationship in the refractive indices prevents the total reflection atthe emission edge of the element so that the external quantum efficiencyis improved.

As the fluorescent material of the embodiment, the inorganic materialsor organic materials explained with reference to the first embodimentmay be used as well. The material should be selected so that a highconversion efficiency is obtained for the given wavelength ofsemiconductor element and the desired wavelength of the secondary light.

According to the embodiment, the fluorescent material FL is deposited atthe emission surface of the light emitting element 990. Therefore,almost 100% of the primary light emitted from the element is absorbedand successfully converted by the fluorescent material. The embodimentis especially advantageous, if the emission wavelength is theultraviolet having a wavelength shorter than 380 nanometers.

Besides, according to the embodiment, the light source is limited to thevicinity of the emission edge of the light emitting element. Therefore,the optical path of the primary light in the fluorescent layer FLbecomes uniform and independent to the direction. This solves theproblem that the wavelength of the secondary light varies depending tothe direction of the light.

Further, according to the embodiment, the secondary light can be easilyconverged by using lenses or reflector, because the light source islimited to the vicinity of the emission edge of the light emittingelement. Therefore, the light emitting device having a high emissiondensity is realized. The inorganic polymer, the rubber material, thefarinaceous material or the protein have large volume contraction ratioswhen they dries up. Therefore, if any of these materials is used as amain component of a solvent to disperse the fluorescent material, thefluorescent material can be easily limited to the vicinity of theemission edge of the light emitting element. This makes theabove-mentioned advantages successfully realized.

Further according to the invention, by selecting the solvent so that therefractive index thereof is between the refractive index of the lightemitting element and the refractive index of its adjacent layer,external quantum efficiency is further improved and high power lightemitting device is realized.

Next explained are specific examples of the embodiment. In theexplanation of these examples, the same components as those of the lightemitting device shown in FIGS. 1 through 16 are labeled with commonreference numerals, and their detailed explanation is omitted. FIG. 17is a roughly illustrated cross-sectional view of a light emitting deviceaccording to the invention. The light emitting device 200B shown here isa LED lamp of a stem type. The element 990 is mounted onto the top ofthe lead pin 222. The fluorescent layer FL is formed by any method asexplained above. In order to deposit the fluorescent layer FL, thefluorescent material may be dispersed in the solvent before it is coatedon the surface of the element or it may be sprayed after the solvent iscoated on the element.

FIG. 18 is a roughly illustrated cross-sectional view of a third exampleof the light emitting device according to the invention. The lightemitting device 250B shown here is an SMD lamp of a substrate type. Thelight emitting element 10 or 50 is mounted on the substrate 260 and thefluorescent layer FL is formed on it by any method as explained above.

FIG. 19 is a roughly illustrated cross-sectional view of a forth exampleof the light emitting device according to the invention. The lightemitting device 300B shown here is an SMD lamp of a lead frame type. Thelight emitting element 990 is mounted on the lead frame 310, on whichthe fluorescent layer FL is formed by any method as explained above.

FIG. 20 is a roughly illustrated cross-sectional view of a fifth exampleof the light emitting device according to the invention. The lightemitting device 3503B shown here is a device of planer emission type.The light emitting elements 990 are mounted on the lead frames 360 and362 respectively, on which the fluorescent layers FL is formed by anymethod as explained above.

FIG. 21 is a roughly illustrated cross-sectional view of a sixth exampleof the light emitting device according to the invention. The lightemitting device 400B shown here is a device of the dome type. The lightemitting elements 990 are mounted on the lead frame, on which thefluorescent layers FL is formed by any method as explained above.

FIG. 22A is a roughly illustrated plan view and FIG. 22B is a roughlyillustrated cross-sectional view of a seventh example of the lightemitting device according to the invention. The light emitting device450B shown here is a device of a meter needle type. The light emittingelements 990 are mounted in the lead frame 460, on which the fluorescentlayers FL is formed by any method as explained above.

FIGS. 23A and 23B are roughly illustrated cross sectional views of theeighth example of the light emitting devices according to the invention.The light emitting devices 500B shown here are devices of seven segmenttype of a substrate type. The cavity type is shown in FIG. 23A and theresin mold type is shown in FIG. 23B.

The light emitting element 990 is mounted on the substrate 510, on whichthe fluorescent layers FL is formed by any method as explained above.

FIG. 24 is a roughly illustrated cross sectional view of the ninthexample of the light emitting device according to the invention. Thelight emitting device 550B shown here is also a device of seven segmenttype among which the lead frame type is specifically shown in thefigure. The light emitting element 990 is mounted on the lead frame 560,on which the fluorescent layers FL is formed by any method as explainedabove.

FIG. 25 is a roughly illustrated cross-sectional view of a tenth exampleof the light emitting device according to the invention. The lightemitting device 650B shown here is a device of the matrix type. Aplurality of the light emitting elements 990 are mounted on thesubstrate 660, on which the fluorescent layers FL is formed by anymethod as explained above.

FIG. 26 is a roughly illustrated cross sectional view of a eleventhexample of the light emitting device according to the invention. Thelight emitting device 750B shown here is a semiconductor laser device ofthe can type. The light emitting element 990, which is a laser diode inthis specific case, is mounted on the stem 770, on which the fluorescentlayers FL is formed by any method as explained above.

The above explained specific examples shown in FIG. 17 through 26 alsohave various advantages as explained with reference to FIG. 16.

Next explained is a forth embodiment of the invention. In the followingexplanations, the same components as those of the light emitting deviceshown in FIGS. 1 through 26 are labeled with common reference numerals,and their detailed explanation is omitted.

FIGS. 27A through 27C are a roughly illustrated cross sectional view ofa example of the light emitting device according to the embodiment. Thelight emitting devices 250C shown here are SMD lamps of the substratetype. In the example shown in FIG. 27A, a fluorescent material isuniformly incorporated into resin 290.

In the example shown FIG. 27B, a fluorescent material is incorporatedwith a high concentration at the surface region 290A of the resin 290.By precipitating the dispersed fluorescent material before the resin 290is cured while keeping the device upside down, the high concentrationlayer 290A of the fluorescent material is formed near the surface of theresin 290. By adjusting the degree of the precipitation, thedistribution of the fluorescent material can be controlled. If thefluorescent material is completely precipitated, thin fluorescent layeris formed on the surface of the resin 290, which is substantially thesame as coating the fluorescent material on the surface of the resin290.

In the example shown in FIG. 27C, a layer 290B including the fluorescentmaterial is coated uniformly on the surface of the resin 290. By coatinga resin including the fluorescent material after the resin 290 is moldedand cured, the uniform layer 290B including the fluorescent material canbe formed. Alternatively, by molding the second resin including thefluorescent material on the surface of the first resin 290 after theresin 290 is molded and cured, the uniform layer 290B including thefluorescent material can also be formed.

In the present embodiment, the element 990 need not to include afluorescent material. However, the element preferably have a luminousemission in the wavelength range of blue or ultraviolet in order toobtain a high conversion yield by using the fluorescent materials whichare easily available. As such a element having a light emitting layermade of, for example, gallium nitride, zinc selenide, silicon carbide orboron nitride may be employed.

As the fluorescent material of the embodiment, the inorganic materialsor organic materials explained with reference to the first embodimentmay be used as well. The material should be selected so that a highconversion efficiency is obtained for the given wavelength ofsemiconductor element and the desired wavelength of the secondary light.

According to the embodiment, the fluorescent material is incorporated inthe resin by the unique technique. Therefore, it is easy to get amulti-color emission, to prevent the fluctuation of the emissionwavelength and to prevent the chance in the emission wavelength causedby the increase in temperature. The embodiment is especiallyadvantageous, if the emission wavelength is the ultraviolet having awavelength shorter than 380 nanometers.

The SMD lamp of the embodiment is very compact and easy to mount, andcan emit a white light. The conventional SMD lamp need to include alight scattering material in its resin to improve the uniformity of theemission. However, the light scattering material cause the decrease inintensity of the light output because it absorbs the emission. Incontrast to this, the SMD lamp of the embodiment emits a uniformluminous light because the incorporated fluorescent material alsofunctions as the light scattering material.

The SMD lamp shown in FIGS. 27B and 27C can convert the primary emissionuniformly with a high efficiency because the fluorescent material islocated densely at the surface of the resin.

Next explained are specific examples of the embodiment. In theexplanation of these examples, the same components as those of the lightemitting device shown in FIGS. 1 through 27C are labeled with commonreference numerals, and their detailed explanation is omitted.

FIGS. 28A through 28C are roughly illustrated cross-sectional views of asecond examples of the light emitting device according to theembodiment. The light emitting devices 300C shown here are SMD lamps ofa lead frame type.

In the example shown in FIG. 28A, a fluorescent material is uniformlyincorporated into resin 340.

In the example shown in FIG. 28B, a fluorescent material is incorporatedwith a high concentration at the surface region 340A of the resin 340.By precipitating the dispersed fluorescent material before the resin 340is cured while keeping the device upside down, the high concentrationlayer 340A of the fluorescent material is formed near the surface of theresin 340.

In the example shown in FIG. 28C, a layer 340B including the fluorescentmaterial is coated uniformly on the surface of the resin 340. By coatingthe second resin including the fluorescent material after the firstresin 340 is molded and cured, the uniform layer 340B including thefluorescent material can be formed. Alternatively, by molding the secondresin including the fluorescent material on the surface of first resin340 after the resin is molded and cured, the uniform layer 340Bincluding the fluorescent material can also be formed.

FIGS. 29A through 29C are roughly illustrated cross-sectional views ofthird examples of the light emitting device according to the embodiment.The light emitting device 350C shown here is a device of the planeremission type.

In the example shown in FIG. 29A, a fluorescent material is uniformlyincorporated into resin 390. In the example shown in FIG. 29B, afluorescent material is incorporated with a high concentration at thesurface region 390A of the resin 390. In the example shown in FIG. 29C,a layer including the fluorescent material is formed uniformly on thesurface of the resin 390. The fluorescent material can be incorporatedby the same way as explained with reference to the FIGS. 27A through27C.

According to the embodiment, a luminous uniform white emission isavailable.

FIGS. 30A through 30C are roughly illustrated cross-sectional views of aforth examples of the light emitting device according to the embodiment.The light emitting devices 400C shown here are of the dome type.

In the example shown in FIG. 30A, a fluorescent material is uniformlyincorporated into resin 440. In the example shown in FIG. 30B, afluorescent material is incorporated with a high concentration at thesurface region 440A of the resin 440. In the example shown in FIG. 30C,a layer 440B including the fluorescent material is coated uniformly onthe surface of the resin 440. The fluorescent material can beincorporated as explained with reference to the FIGS. 27A through 27C.

According to the embodiment, a dome type device having a luminousuniform white emission is available.

FIGS. 31A through 31C are roughly illustrated cross-sectional views offifth examples of the light emitting device according to the embodiment.The light emitting devices 450C shown here are devices of the meterneedle type.

In the example shown in FIG. 31A, a fluorescent material is uniformlyincorporated into resin 490. In the example shown in FIG. 31B, afluorescent material is incorporated with a high concentration at thesurface region 490A of the resin 490. In the example shown in FIG. 31C,a layer 490B including the fluorescent material is coated uniformly onthe surface of the resin 490. The fluorescent material can beincorporated as explained with reference to the FIGS. 27A through 27C.

According to the embodiment, a meter needle type device having aluminous uniform white emission is available. Especially, if used on theblack meter panel, the meter needle according to the embodiment has amuch improved contrast compared to the conventional red or greenneedles, which makes the driving of the vehicles much safer.

FIGS. 32A through 32C are roughly illustrated cross-sectional views ofthe sixth examples of the light emitting devices according to theembodiment. The light emitting devices ZOOC shown here are devices ofthe seven segment of the substrate type.

In the example shown in FIG. 32A, a fluorescent material is uniformlyincorporated into resin 540. In the example shown in FIG. 32B, afluorescent material is incorporated with a high concentration at thesurface region 540A of the resin 540. In the example shown in FIG. 32C,a layer 540B including the fluorescent material is coated uniformly onthe surface of the resin 540. The fluorescent material can beincorporated as explained with reference to the FIGS. 27A through 27C.

According to the embodiment, a seven segment type device having aluminous uniform white emission is available.

FIGS. 33A through 33C are roughly illustrated cross-sectional views ofthe seventh examples of the light emitting device according to theembodiment. The light emitting devices 550C shown here are also devicesof seven segment type of lead frame type.

In the example shown in FIG. 33A, a fluorescent material is uniformlyincorporated into resin 590. In the example shown in FIG. 33B, afluorescent material is incorporated with a high concentration at thesurface region 590A of the resin 590. In the example shown in FIG. 33C,a layer 590B including the fluorescent material is coated uniformly onthe surface of the resin 590. The fluorescent material can beincorporated as explained with reference to the FIGS. 27A through 27C.

According to the embodiment, a seven segment type device having aluminous uniform white emission is available. Besides, the viewing anglebecomes much wider compared to the conventional device because theprimary emission is converted into the secondary light near the surfaceof the device.

FIGS. 34A through 34C are roughly illustrated cross-sectional views ofeighth examples of the light emitting device according to theembodiment. The light emitting device 600C shown here is a device of thematrix type.

In the example shown in FIG. 34A, a fluorescent material is uniformlyincorporated into resin 690. In the example shown in FIG. 34B, afluorescent material is incorporated with a high concentration at thesurface region 690A of the resin 690. In the example shown in FIG. 34C,a layer 690B including the fluorescent material is coated uniformly onthe surface of the resin 690. The fluorescent material can beincorporated as explained with reference to the FIGS. 27A through 27C.

According to the embodiment, a dot matrix type device having a luminousuniform white emission is available. Besides, a full-color display iseasily realized simply by using light emitting elements having aultraviolet emission and by arranging the appropriate fluorescentmaterial at the appropriate pixel to convert the primary ultravioletemission into red, green or blue light. When the light emitting elementsare densely integrated, the calorific amount increases. However, thewavelength of the secondary emission does not change because theconversion function of the fluorescent material is stable. Besides, theviewing angle becomes much wider compared to the conventional devicebecause the primary emission is converted into the secondary light nearthe surface of the device.

The above explained specific examples of the forth embodiment of theinvention shown in FIGS. 28A through 34C also have various advantages asexplained with reference to FIGS. 27A through 27C.

Next explained is a fifth embodiment of the invention.

FIG. 35 is a roughly illustrated cross-sectional view of a example ofthe light emitting device according to the embodiment. The lightemitting device 100D shown here is a LED lamp of the lead frame type.The semiconductor light emitting element 990 is mounted on the leadframe 110 then molded by the resin 140D. According to the embodiment, acavity 142 is formed inside the resin 140D. The deposited layer FL ofthe fluorescent material is formed on the inner wall of the cavity 142.

In the embodiment, the element 990 need not to include a fluorescentmaterial. However, the element preferably have a luminous emission inthe wavelength range of blue or ultraviolet in order to obtain a highconversion yield by using the fluorescent materials which are easilyavailable. As such a element having a light emitting layer made of, forexample, gallium nitride, zinc selenide, silicon carbide or boronnitride may be employed.

As the fluorescent material of the embodiment, the inorganic materialsor organic materials explained with reference to the first embodimentmay be used as well. The material should be selected so that a highconversion efficiency is obtained for the given wavelength ofsemiconductor element and the desired wavelength of the secondary light.Also the fluorescent material preferably should be excited by theultraviolet lights. Because if the fluorescent materials is excited bythe visible lights, a cross-talk may occur between the adjacent devices.That is, the fluorescent material of one device is unnecessarily excitedby the emission from another device.

According to the embodiment, the fluorescent material FL is uniformlydeposited at the emission surface of the light emitting element 990.Therefore, almost 100% of the primary light emitted from the element isabsorbed and uniformly converted by the fluorescent material. Theembodiment is especially advantageous, if the emission wavelength is theultraviolet having a wavelength shorter than 380 nanometers.

Besides, according to the embodiment, the light source is limited to thevicinity of the emission point of the light emitting element. Therefore,the optical path of the primary light in the fluorescent layer FLbecomes uniform and independent to the direction. This solves theproblem that the wavelength of the secondary light varies depending tothe direction of the light.

Further, according to the embodiment, the light source is limited to thevicinity of the emission point of the light emitting element. Therefore,the secondary light is easily converged by the lens effect of the resin140D, which realizes the luminous output. This is especiallyadvantageous for the application of traffic signals and the outdoordisplays. If the cavity 142 is made big, the spot size of the lightbecomes larger, which is advantageous for the indicators.

Next explained are specific examples of the embodiment. In theexplanation of these examples, the same components as those of the lightemitting device shown in FIGS. 1 through 35 are labeled with commonreference numerals, and their detailed explanation is omitted. FIG. 36is a roughly illustrated cross-sectional view of a light emitting deviceaccording to the embodiment. The light emitting device 200D shown hereis a LED lamp of a stem type. A cavity 242 is formed in the resin 240D.The deposited layer FL of the fluorescent material is formed on theinner wall of the cavity 242.

FIG. 37 is a roughly illustrated cross-sectional view of a third exampleof the light emitting device according to the embodiment. The lightemitting device 250D shown here is an SMD lamp of a substrate type. Acavity 292 is formed in the resin 290D. The deposited layer FL of thefluorescent material is formed on the inner wall of the cavity 292.

FIG. 38 is a roughly illustrated cross-sectional view of a forth exampleof the light emitting device according to the embodiment. The lightemitting device 350D shown here is a device of a planar emission type. Acavity 392 is formed in the resin 390D. The deposited layer FL of thefluorescent material is formed on the inner wall of the cavity 392.

FIG. 39 is a roughly illustrated cross-sectional view of a fifth exampleof the light emitting device according to the embodiment. The lightemitting device 400D shown here is a device of a dome type. A cavity 442is formed in the resin 440D. The deposited layer FL of the fluorescentmaterial is formed on the inner wall of the cavity 442.

FIG. 40 is a roughly illustrated cross-sectional view of a sixth exampleof the light emitting device according to the embodiment. The lightemitting device 500D shown here is a device of a seven segment type of asubstrate type. A cavity 542 is formed in the resin 540D. The depositedlayer FL of the fluorescent material is formed on the inner wall of thecavity 542.

The above explained specific examples shown in FIG. 36 through 40 alsohave various advantages as explained with reference to FIG. 35.

Next explained is a sixth embodiment of the invention. In the followingexplanations, the same components as those of the light emitting deviceshown in FIGS. 1 through 40 are labeled with common reference numerals,and their detailed explanation is omitted.

FIG. 41 is a roughly illustrated cross-sectional view of a example ofthe light emitting device according to the embodiment. The lightemitting device 100E shown here is a LED lamp of the lead frame type.The semiconductor light emitting element 990 is mounted on the leadframe 110 then the resin 140E is molded. According to the embodiment, adipping resin 142E is formed inside the molded resin 140E. The resin142E contains the fluorescent material. The resin called hereafter“dipping resin” is a resin formed without using a mold. The “dippingresin” is formed by dripping the resin material from a dispenser ontothe element or by dipping the element in the resin material. The resinmaterial contains the resin in a appropriate solvent. According to theembodiment, the element 990 is first sealed by the dipping resin 142Ewhich contains the fluorescent material, then the molded resin 140E isformed.

In the embodiment, the element 990 need not to include a fluorescentmaterial. However, the element preferably have a luminous emission inthe wavelength range of blue or ultraviolet in order to obtain a highconversion yield by using the fluorescent materials which are easilyavailable. As such a element having a light emitting layer made of, forexample, gallium nitride, zinc selenide, silicon carbide or boronnitride may be employed.

As the fluorescent material of the embodiment, the inorganic materialsor organic materials explained with reference to the first embodimentmay be used as well. The material should be selected so that a highconversion efficiency is obtained for the given wavelength ofsemiconductor element and the desired wavelength of the secondary light.Also the fluorescent material preferably should be excited by theultraviolet lights. Because if the fluorescent materials is excited bythe visible lights, a cross-talk may occur between the adjacent devices.That is, the fluorescent material of one device is unnecessarily excitedby the emission from another device.

According to the embodiment, the fluorescent material FL is uniformlylocated around the light emitting element 990. Therefore, almost 100% ofthe primary light emitted from the element is absorbed and uniformlyconverted by the fluorescent material. The embodiment is especiallyadvantageous, if the emission wavelength is the ultraviolet having awavelength shorter than 380 nanometers.

Also, the emission wavelength becomes fairly stabilized because theprimary light from the element is converted into the secondary light.The wavelength of the resultant secondary light is not affected by thefluctuation of the wavelength of the primary emission. Accordingly, thewavelength of the secondary light is independent to the operatingcurrent or voltage applied to the element.

Further, according to the embodiment, the light source is limited to thevicinity of the emission point of the light emitting element. Therefore,the secondary light is easily converged by the lens effect of the resin140E, which realizes the luminous output. This is especiallyadvantageous for the application of traffic signals and the outdoordisplays. If the dipping resin 142E is made big, the spot size of thelight becomes larger, which is advantageous for the indicators.

Next explained are specific examples of the embodiment. In theexplanation of these examples, the same components as those of the lightemitting device shown in FIGS. 1 through 41 are labeled with commonreference numerals, and their detailed explanation is omitted. FIG. 42is a roughly illustrated cross-sectional view of a light emitting deviceaccording to the embodiment. The light emitting device 200E shown hereis a LED lamp of a stem type. A dipping resin 242E is formed in thedipped resin 240E. The dipping resin 242E contains the fluorescentmaterial.

FIG. 43 is a roughly illustrated cross-sectional view of a third exampleof the light emitting device according to the embodiment. The lightemitting device 250E shown here is an SMD lamp of a substrate type. Adipping resin 292E is formed in the molded resin 290E. The dipping resin292E contains the fluorescent material.

FIG. 44 is a roughly illustrated cross-sectional view of a forth exampleof the light emitting device according to the embodiment. The lightemitting device 350E shown here is a device of a planar emission type. Adipping resin 392E is formed in the molded resin 390E. The dipping resin392E contains the fluorescent material.

FIG. 45 is a roughly illustrated cross-sectional view of a fifth exampleof the light emitting device according to the embodiment. The lightemitting device 400E shown here is a device of a dome type. A dippingresin 442E is formed in the molded resin 440E. The dipping resin 442Econtains the fluorescent material.

FIG. 46 is a roughly illustrated cross-sectional view of a sixth exampleof the light emitting device according to the embodiment. The lightemitting device 500E shown here is a device of a seven segment type of asubstrate type. A dipping resin 542E is formed under the molded resin540E. The dipping resin 542E contains the fluorescent material.

The above explained specific examples shown in FIG. 42 through 46 alsohave various advantages as explained with reference to FIG. 41.

Next explained is a seventh embodiment of the invention. In thefollowing explanations, the same components as those of the lightemitting device shown in FIGS. 1 through 46 are labeled with commonreference numerals, and their detailed explanation is omitted.

FIG. 47 is a roughly illustrated cross-sectional view of a example ofthe light emitting device according to the embodiment. The lightemitting device 100F shown here is a LED lamp of the lead frame type.The semiconductor light emitting element 990 is mounted on the leadframe 110 then the resin 140F is molded. According to the embodiment, adipping resin 142F is formed inside the molded resin 140F. The layer FLof the fluorescent material is formed on the surface of the dippingresin 142F. The element 990 is first sealed by the dipping resin 142F.Then the fluorescent material with an appropriate medium is coated onthe surface of the dipping resin 142F. Finally, the resin 140F ismolded.

In order to form the layer FL containing the fluorescent material,first, the methods as explained with reference to FIG. 16 can be used aswell. That is, the fluorescent material is dispersed into an appropriatesolvent, then, it is coated on the surface of the element 990 andfinally, it is dried up. Another way to form the fluorescent layer is,first, coat an appropriate solvent on the surface of the element 990,then, scatter or spray the fluorescent material onto the solvent,finally, harden it up.

The solvent is preferably adhesive. The examples of the solvent are theones including an inorganic polymer as a main component. The onesincluding a rubber material, farinaceous material or protein as a maincomponent are also usable as the solvent. If the inorganic solvent isused, the product advantageously becomes highly durable against the heatand chemicals and becomes flame-retardant. If the rubber material, thefarinaceous material or the protein is used, the residual stress of thedried product is relaxed. The farinaceous material and the protein arealso easy to handle because they are water-soluble. The specificexamples of the solvent are the alkalic silicate solution, the silicatecolloid aqua-solution, the phosphate aqua-solution, the organic solventcontaining silicate compound, the organic solvent containing rubber andthe natural glue aqua-solution.

In the embodiment, the element 990 need not to include a fluorescentmaterial. However, the element preferably have a luminous emission inthe wavelength range of blue or ultraviolet in order to obtain a highconversion yield by using the fluorescent materials which are easilyavailable. As such a element having a light emitting layer made of, forexample, gallium nitride, zinc selenide, silicon carbide or boronnitride may be employed.

As the fluorescent material of the embodiment, the inorganic materialsor organic materials explained with reference to the first embodimentmay be used as well. The material should be selected so that a highconversion efficiency is obtained for the given wavelength ofsemiconductor element and the desired wavelength of the secondary light.Also the fluorescent material preferably should be excited by theultraviolet lights. Because if the fluorescent materials is excited bythe visible lights, a cross-talk may occur between the adjacent devices.That is, the fluorescent material of one device is unnecessarily excitedby the emission from another device.

According to the embodiment, the fluorescent material FL is uniformlylocated around the light emitting element 990. Therefore, almost 100% ofthe primary light emitted from the element is absorbed and uniformlyconverted by the fluorescent material. The embodiment is especiallyadvantageous, if the emission wavelength is the ultraviolet having awavelength shorter than 380 nanometers.

Also, the emission wavelength becomes fairly stabilized because theprimary light from the element is converted into the secondary light.The wavelength of the resultant secondary light is not affected by thefluctuation of the wavelength of the primary emission. Accordingly, thewavelength of the secondary light is independent to the operatingcurrent or voltage applied to the element.

Further, according to the embodiment, the light source is limited to thevicinity of the emission point of the light emitting element. Therefore,the secondary light is easily converged by the lens effect of the resin140F, which realizes the luminous output. This is especiallyadvantageous for the application of traffic signals and the outdoordisplays. If the dipping resin 142F is made big, the spot size of thelight becomes larger, which is advantageous for the indicators.

Next explained are specific examples of the embodiment. In theexplanation of these examples, the same components as those of the lightemitting device shown in FIGS. 1 through 47 are labeled with commonreference numerals, and their detailed explanation is omitted. FIG. 48is a roughly illustrated cross-sectional view of a light emitting deviceaccording to the embodiment. The light emitting device 200F shown hereis a LED lamp of a stem type. A dipping resin 242F is formed in thedipped resin 240F. The layer FL containing the fluorescent material isformed on the dipping resin 242F.

FIG. 49 is a roughly illustrated cross-sectional view of a third exampleof the light emitting device according to the embodiment. The lightemitting device 250F shown here is an SMD lamp of a substrate type. Adipping resin 292F is formed in the molded resin 290F. The layer FLcontaining the fluorescent material is formed on the dipping resin 292F.

FIG. 50 is a roughly illustrated cross-sectional view of a forth exampleof the light emitting device according to the embodiment. The lightemitting device 350F shown here is a device of a planar emission type. Adipping resins 392F are formed in the molded resin 390F. The layers FLcontaining the fluorescent material are formed on the dipping resins392F.

FIG. 51 is a roughly illustrated cross-sectional view of a fifth exampleof the light emitting device according to the embodiment. The lightemitting device 400F shown here is a device of a dome type. A dippingresin 442F is formed in the molded resin 440F. The layer FL containingthe fluorescent material is formed on the dipping resin 442F.

FIG. 52 is a roughly illustrated cross-sectional view of a sixth exampleof the light emitting device according to the embodiment. The lightemitting device 500F shown here is a device of a seven segment type of asubstrate type. A dipping resin 542F is formed under the molded resin540F. The layer FL containing the fluorescent material is formed on thedipping resin 542F.

The above explained specific examples shown in FIGS. 48 through 52 alsohave various advantages as explained with reference to FIG. 47.

Next explained is a eighth embodiment of the invention. In the followingexplanations, the same components as those of the light emitting deviceshown in FIGS. 1 through 52 are labeled with common reference numerals,and their detailed explanation is omitted.

FIG. 53 is a roughly illustrated cross-sectional view of a example ofthe light emitting device according to the embodiment. The lightemitting device 100G shown here is a LED lamp of the lead frame type.The semiconductor light emitting element 990 is mounted on the leadframe 110G then the resin 140 is molded. According to the embodiment,the lead frame 110G and 120G contains the fluorescent material whichabsorbs the primary light emitted from the element 990 and emits thesecondary light.

In the embodiment, the element 990 also need not to include afluorescent material. However, the element preferably have a luminousemission in the wavelength range of blue or ultraviolet in order toobtain a high conversion yield by using the fluorescent materials whichare easily available. As such a element having a light emitting layermade of, for example, gallium nitride, zinc selenide, silicon carbide orboron nitride may be employed.

As the fluorescent material of the embodiment, the inorganic materialsor organic materials explained with reference to the first embodimentmay be used as well. The material should be selected so that a highconversion efficiency is obtained for the given wavelength ofsemiconductor element and the desired wavelength of the secondary light.Also the fluorescent material preferably should be excited by theultraviolet lights. Because if the fluorescent materials is excited bythe visible lights, a cross-talk may occur between the adjacent devices.That is, the fluorescent material of one device is unnecessarily excitedby the emission from another device.

According to the embodiment, the emission wavelength becomes fairlystabilized because the primary light from the element is converted intothe secondary light. The wavelength of the resultant secondary light isnot affected by the fluctuation of the wavelength of the primaryemission. Accordingly, the wavelength of the secondary light isindependent to the operating current or voltage applied to the element.

Next explained are specific examples of the embodiment. In theexplanation of these examples, the same components as those of the lightemitting device shown in FIGS. 1 through 53 are labeled with commonreference numerals, and their detailed explanation is omitted. FIG. 54is a roughly illustrated cross-sectional view of a light emitting deviceaccording to the embodiment. The light emitting device 200G shown hereis a LED lamp of a stem type. The fluorescent material is incorporatedin the insulative part 220G of the stem 210G.

FIG. 55 is a roughly illustrated cross-sectional view of a third exampleof the light emitting device according to the embodiment. The lightemitting device 250G shown here is an SMD lamp of a substrate type. Thefluorescent material is incorporated in the substrate 260G.

FIG. 56 s a roughly illustrated cross-sectional view of a forth exampleof the light emitting device according to the embodiment. The lightemitting device 300G shown here is an SMD lamp of a lead frame type. Thefluorescent material is incorporated in the lead frame 310G.

FIG. 57 is a roughly illustrated cross-sectional view of a fifth exampleof the light emitting device according, to the embodiment. The lightemitting device 350G shown here is a device of a planar emission type.The fluorescent material is incorporated in the lead frame 360G and362G.

FIG. 58 is a roughly illustrated cross-sectional view of a sixth exampleof the light emitting device according to the embodiment. The lightemitting device 400G shown here is a device of a dome type. Thefluorescent material is incorporated in the lead frame 410G.

FIGS. 59A and 59B are a roughly illustrated view and a cross-sectionalview of a seventh example of the light emitting device according to theembodiment respectively. The light emitting device 450G shown here is adevice of a meter needle type. The fluorescent material is incorporatedin the substrate 460G.

FIG. 60 is a roughly illustrated cross-sectional view of a eighthexample of the light emitting device according to the embodiment. Thelight emitting device 500G shown here is a device of a seven segmenttype of a substrate type. The fluorescent material is incorporated inthe substrate 510G. The embodiment is also applied to the device of aresin mold type in addition to the illustrated cavity type in thefigure.

FIG. 61 is a roughly illustrated cross-sectional view of a ninth exampleof the light emitting device according to the embodiment. The lightemitting device 500G shown here is a device of a seven segment type of alead frame type. The fluorescent material is incorporated in the leadframe 560G.

FIG. 62 is a roughly illustrated cross-sectional view of a tenth exampleof the light emitting device according to the embodiment. The lightemitting device 650G shown here is a device of a matrix type. Thefluorescent material is incorporated in the substrate 660G. FIG. 63 is aroughly illustrated cross-sectional view of a eleventh example of thelight emitting device according to the embodiment. The light emittingdevice 700G shown here is a device of an array type. The fluorescentmaterial is incorporated in the substrate 720G or the reflector 722G.

FIG. 64 is a roughly illustrated cross-sectional view of a twelfthexample of the light emitting device according to the embodiment. Thelight emitting device 750G shown here is a laser device of a can type.The fluorescent material is incorporated in the stem 770G.

The above explained specific examples shown in FIG. 54 through 64 alsohave various advantages as explained with reference to FIG. 53.

Next explained is a ninth embodiment of the invention. According to theembodiment, the fluorescent material is located under the light emittingelement. More specifically, the fluorescent material is placed at themounting part of the lead frame, stem or substrate, on which the elementis mounted.

In the following explanations, the same components as those of the lightemitting device shown in FIGS. 1 through 64 are labeled with commonreference numerals, and their detailed explanation is omitted.

FIG. 65 is a roughly illustrated cross-sectional view of a example ofthe light emitting device according to the embodiment. The lightemitting device 100H shown here is a LED lamp of the lead frame type.The semiconductor light emitting element 990 is mounted on the leadframe 110 then the resin 140 is molded. According to the embodiment, thelayer FL containing the fluorescent material is placed between the leadframe 110 and the light emitting element 990. The fluorescent materialin the layer FL absorbs the primary light emitted from the element 990and emits the secondary light.

The one method to form the layer FL is to incorporate the fluorescentmaterial into the adhesive which is used to fix the element 990 onto thelead frame. As such a adhesive, for example, resin materials, rubbermaterials, organic materials, inorganic materials, farinaceousmaterials, protein materials, tar materials or metal solders can beused. If the inorganic material is used, the product advantageouslybecomes highly durable against the heat and chemicals and becomesflame-retardant. If any of the rubber materials, organic materials, thefarinaceous materials or the protein materials is used, the residualstress of the dried product is relaxed. Therefore, the problems causedby the stress such as deterioration of the device or the breakage of thewire are advantageously prevented. The farinaceous materials and theprotein materials are also easy to handle because they arewater-soluble.

According to the embodiment, the fluorescent material is dispersed inthe adhesive and coated onto the lead frame to from the layer FL.

The another method to form the layer FL is to coat the fluorescentmaterial on the mounting surface of the lead frame first, then to mountthe element 990 by using a adhesive. As the solvent to disperse thefluorescent materials, the one as explained with reference to FIG. 16can be used as well.

The third method to form the layer FL is to use a preformed tablet ofthe layer FL including the fluorescent material. That is, fix thepreform onto the mounting surface of the lead frame, then mount thelight emitting element 990 on the tablet.

In the embodiment, the element 990 also need not to include afluorescent material. However, the element preferably have a luminousemission in the wavelength range of blue or ultraviolet in order toobtain a high conversion yield by using the fluorescent materials whichare easily available. As such a element having a light emitting layermade of, for example, gallium nitride, zinc selenide, silicon carbide orboron nitride may be employed.

As the fluorescent material of the embodiment, the inorganic materialsor organic materials explained with reference to the first embodimentmay be used as well. The material should be selected so that a highconversion efficiency is obtained for the given wavelength ofsemiconductor element and the desired wavelength of the secondary light.Also the fluorescent material preferably should be excited by theultraviolet lights. Because if the fluorescent materials is excited bythe visible lights, a cross-talk may occur between the adjacent devices.That is, the fluorescent material of one device is unnecessarily excitedby the emission from another device.

According to the embodiment, the emission wavelength becomes fairlystabilized because the primary light from the element is converted intothe secondary light. The wavelength of the resultant secondary light isnot affected by the fluctuation of the wavelength of the primaryemission. Accordingly, the wavelength of the secondary light isindependent to the operating current or voltage applied to the element.

Next explained are specific examples of the embodiment.

In the explanation of these examples, the same components as those ofthe light emitting device shown in FIGS. 1 through 65 are labeled withcommon reference numerals, and their detailed explanation is omitted.FIG. 66 is a roughly illustrated cross-sectional view of a lightemitting device according to the embodiment. The light emitting device200H shown here is a LED lamp of a stem type. The layer FL including thefluorescent material is placed between the stem 210 and the lightemitting element 990 by one of any method as explained above.

FIG. 67 is a roughly illustrated cross-sectional view of a third exampleof the light emitting device according to the embodiment. The lightemitting device 250H shown here is an SMD lamp of a substrate type. Thelayer FL including the fluorescent material is placed between thesubstrate 260 and the light emitting element 990.

FIG. 68 is a roughly illustrated cross-sectional view of a forth exampleof the light emitting device according to the embodiment. The lightemitting device 300H shown here is an SMD lamp of a lead frame type. Thelayer FL including the fluorescent material is placed between the leadframe 310 and the light emitting element 990.

FIG. 69 is a roughly illustrated cross-sectional view of a fifth exampleof the light emitting device according to the embodiment. The lightemitting device 350H shown here is a device of a planar emission type.The layers FL including the fluorescent material are placed between thelead frames 360, 362 and the light emitting element 990.

FIG. 70 is a roughly illustrated cross-sectional view of a sixth exampleof the light emitting device according to the embodiment. The lightemitting device 400H shown here is a device of a dome type. The layer FLincluding the fluorescent material is placed between the lead frames 410and the light emitting element 990.

FIGS. 71A and 71B are a roughly illustrated plan view and across-sectional view of a seventh example of the light emitting deviceaccording to the embodiment respectively. The light emitting device 450Hshown here is a device of a meter needle type. The layer FL includingthe fluorescent material is placed between the substrate 460 and thelight emitting element 990.

FIG. 72 is a roughly illustrated cross-sectional view of a eighthexample of the light emitting device according to the embodiment. Thelight emitting device 500H shown here is a device of a seven segmenttype of a substrate type. The layer FL including the fluorescentmaterial is placed between the substrate 510 and the light emittingelement 990. The embodiment is also applied to the device of a resinmold type in addition to the cavity type illustrated in the figure.

FIG. 73 is a roughly illustrated cross-sectional view of a ninth exampleof the light emitting device according to the embodiment. The lightemitting device 550H shown here is a device of a seven segment type of alead frame type. The layer FL including the fluorescent material isplaced between the lead frame 560 and the light emitting element 990.

FIG. 74 is a roughly illustrated cross-sectional view of a tenth exampleof the light emitting device according to the embodiment. The lightemitting device 650H shown here is a device of a matrix type. The layerFL including the fluorescent material is placed between the substrate660 and the light emitting element 990.

FIG. 75 is a roughly illustrated cross-sectional view of a eleventhexample of the light emitting device according to the embodiment. Thelight emitting device 700H shown here is a device of an array type. Thelayer FL including the fluorescent material is placed between thereflector 722 and the light emitting element 990.

FIG. 76 is a roughly illustrated cross-sectional view of a twelfthexample of the light emitting device according to the embodiment. Thelight emitting device 750H shown here is a laser device of a can type.The layer FL including the fluorescent material is placed between thestem 770 and the light emitting element 990.

The above explained specific examples shown in FIG. 66 through 76 alsohave various advantages as explained with reference to FIG. 65.

Next explained is a tenth embodiment of the invention. According to theembodiment, the fluorescent material is coated onto the reflectivesurface, such as the upper surface of a lead frame, of the lightemitting device.

In the following explanations, the same components as those of the lightemitting device shown in FIGS. 1 through 76 are labeled with commonreference numerals, and their detailed explanation is omitted.

FIG. 77 is a roughly illustrated cross-sectional view of a example ofthe light emitting device according to the embodiment. The lightemitting device 1001 shown here is a LED lamp of the lead frame type.The semiconductor light emitting element 990 is mounted on the leadframe 110 then the resin 140 is molded. According to the embodiment, thelayer FL containing the fluorescent material is formed on the reflectivesurface of the lead frame 110, which absorbs the primary light emittedfrom the element 990 and emits the secondary light.

According to the embodiment, the fluorescent material is dispersed in anappropriate medium or solvent and coated onto the lead frame, then it isdried up. As such a medium or a solvent, for example, resin materials,rubber materials, organic materials, inorganic materials, farinaceousmaterials, protein materials, tar materials or metal solders can beused. If the inorganic material is used, the product advantageouslybecomes highly durable against the heat and chemicals and becomesflame-retardant. If any of the rubber materials, organic materials, thefarinaceous materials or the protein materials is used, the residualstress of the dried product is relaxed. Therefore, the problems causedby the stress such as deterioration of the device or the breakage of thewire are advantageously prevented. The farinaceous materials and theprotein materials are also easy to handle because they arewater-soluble.

In the embodiment, the element 990 also need not to include afluorescent material. However, the element preferably have a luminousemission in the wavelength range of blue or ultraviolet in order toobtain a high conversion yield by using the fluorescent materials whichare easily available. As such a element having a light emitting layermade of, for example, gallium nitride, zinc selenide, silicon carbide orboron nitride may be employed.

As the fluorescent material of the embodiment, the inorganic materialsor organic materials explained with reference to the first embodimentmay be used as well. The material should be selected so that a highconversion efficiency is obtained for the given wavelength ofsemiconductor element and the desired wavelength of the secondary light.Also the fluorescent material preferably should be excited by theultraviolet lights. Because if the fluorescent materials is excited bythe visible lights, a cross-talk may occur between the adjacent devices.That is, the fluorescent material of one device is unnecessarily excitedby the emission from another device.

According to the embodiment, the emission wavelength becomes fairlystabilized because the primary light from the element is converted intothe secondary light. The wavelength of the resultant secondary light isnot affected by the fluctuation of the wavelength of the primaryemission. Accordingly, the wavelength of the secondary light isindependent to the operating current or voltage applied to the element.

Next explained are specific examples of the embodiment. In theexplanation of these examples, the same components as those of the lightemitting device shown in FIGS. 1 through 77 are labeled with commonreference numerals, and their detailed explanation is omitted. FIG. 78is a roughly illustrated cross-sectional view of a light emitting deviceaccording to the embodiment. The light emitting device 2001 shown hereis a LED lamp of a stem type. The layer FL including the fluorescentmaterial is formed on the reflective surface of the stem 210.

FIG. 79 is a roughly illustrated cross-sectional view of a third exampleof the light emitting device according to the embodiment. The lightemitting device 2501 shown here is an SMD lamp of a substrate type. Thelayer FL including the fluorescent material is formed on the reflectivesurface of the substrate 260.

FIG. 80 is a roughly illustrated cross-sectional view of a forth exampleof the light emitting device according to the embodiment. The lightemitting device 3001 shown here is an SMD lamp of a lead frame type. Thelayer FL including the fluorescent material is formed on the reflectivesurface of the lead frame 310.

FIG. 81 is a roughly illustrated cross-sectional view of a fifth exampleof the light emitting device according to the embodiment. The lightemitting device 350I shown here is a device of a planar emission type.The layer FL including the fluorescent material is formed on thereflector 370.

FIG. 82 is a roughly illustrated cross-sectional view of a sixth exampleof the light emitting device according to the embodiment. The lightemitting device 4001 shown here is a device of a dome type. The layer FLincluding the fluorescent material is formed in the reflective surfaceof the lead frame 410.

FIGS. 83A and 83B are a roughly illustrated plan view and across-sectional view of a seventh example of the light emitting deviceaccording to the embodiment respectively. The light emitting device 4501shown here is a device of a meter needle type. The layer FL includingthe fluorescent material is formed on the reflective surface of thesubstrate 460.

FIG. 84 is a roughly illustrated cross-sectional view of a eighthexample of the light emitting device according to the embodiment. Thelight emitting device 500I shown here is a device of a seven segmenttype of a substrate type. The layer FL including the fluorescentmaterial is formed on the reflector 520. The embodiment is also appliedto the device of a resin mold type in addition to the cavity typeillustrated in the figure.

FIG. 85 is a roughly illustrated cross-sectional view of a ninth exampleof the light emitting device according to the embodiment. The lightemitting device 5501 shown here is a device of a seven segment type of alead frame type. The layer EL including the fluorescent material isformed on the reflector 570.

FIG. 86 is a roughly illustrated cross-sectional view of a tenth exampleof the light emitting device according to the embodiment. The lightemitting device 6501 shown here is a device of a matrix type. The layerFL including the fluorescent material is placed on the reflector 670.

FIG. 87 is a roughly illustrated cross-sectional view of a eleventhexample of the light emitting device according to the embodiment. Thelight emitting device 7001 shown here is a device of an array type. Thelayer FL including the fluorescent material is formed on the reflector722 and/or on the separator 724.

FIG. 88 is a roughly illustrated cross-sectional view of a twelfthexample of the light emitting device according to the embodiment. Thelight emitting device 7501 shown here is a laser device of a can type.The layer FL including the fluorescent material is formed on thereflective surface of the stem 770.

The above explained specific examples shown in FIGS. 78 through 88 alsohave various advantages as explained with reference to FIG. 77.

Next explained is a eleventh embodiment of the invention. According tothe embodiment, the fluorescent material is located at the lightextraction part, such as the surface of the resin, the lens, or thewindow, of the light emitting devices.

In the following explanations, the same components as those of the lightemitting device shown in FIGS. 1 through 88 are labeled with commonreference numerals, and their detailed explanation is omitted.

FIG. 89 is a roughly illustrated cross-sectional view of a example ofthe light emitting device according to the embodiment. The lightemitting device 350J shown here is a light emitting device of the planeremission type. The layer FL containing the fluorescent material isformed on the window, i.e. the resin 390, which absorbs the primarylight emitted from the element 990 and emits the secondary light.

In order to from the layer FL, the fluorescent material can also bedispersed in an appropriate medium or solvent and coated onto the leadframe, then dried up. As such a medium or a solvent, for example, resinmaterials, rubber materials, organic materials, inorganic materials,farinaceous materials, protein materials, tar materials or metal solderscan be used. If the inorganic material is used, the productadvantageously becomes highly durable against the heat and chemicals andbecomes flame-retardant. If any of the rubber materials, organicmaterials, the farinaceous materials or the protein materials is used,the residual stress of the dried product is relaxed. Therefore, theproblems caused by the stress such as a crack of the layer areadvantageously prevented. The farinaceous materials and the proteinmaterials are also easy to handle because they are water-soluble.

Alternatively, a light transmissive film can be employed to form thelayer FL. The fluorescent material can be coated on the surface of thefilm or dispersed in the film.

In the case of the device having a lens, the fluorescent material can becoated on the surface of the lens of dispersed in the lens.

According to the embodiment, the light emitting element 990 also neednot to include a fluorescent material. However, the element preferablyhave a luminous emission in the wavelength range of blue or ultravioletin order to obtain a high conversion yield by using the fluorescentmaterials which are easily available. As such a element having a lightemitting layer made of, for example, gallium nitride, zinc selenide,silicon carbide or boron nitride may be employed.

As the fluorescent material of the embodiment, the inorganic materialsor organic materials explained with reference to the first embodimentmay be used as well. The material should be selected so that a highconversion efficiency is obtained for the given wavelength ofsemiconductor element and the desired wavelength of the secondary light.Also the fluorescent material preferably should be excited by theultraviolet lights. Because if the fluorescent materials is excited bythe visible lights, a cross-talk may occur between the adjacent devices.That is, the fluorescent material of one device is unnecessarily excitedby the emission from another device.

According to the embodiment, the emission wavelength becomes fairlystabilized because the primary light from the element is converted intothe secondary light. The wavelength of the resultant secondary light isnot affected by the fluctuation of the wavelength of the primaryemission. Accordingly, the wavelength of the secondary light isindependent to the operating current or voltage applied to the element.

Next explained are specific examples of the embodiment. In theexplanation of these examples, the same components as those of the lightemitting device shown in FIGS. 1 through 89 are labeled with commonreference numerals, and their detailed explanation is omitted.

FIGS. 90A and 90B are a roughly illustrated plan view and across-sectional view of a second example of the light emitting deviceaccording to the embodiment respectively. The light emitting device 450Jshown here is a device of a meter needle type. The layer FL includingthe fluorescent material is formed on the light extraction part of thedevice by any method as described above.

FIG. 91 is a roughly illustrated cross-sectional view of a third exampleof the light emitting device according to the embodiment. The lightemitting device 500J shown here is a device of a seven segment type of asubstrate type. The layer FL including the fluorescent material isformed on the light extraction part of the device by any method asdescribed above. The embodiment can also be applied to the device of aresin mold type in addition to the cavity type illustrated in thefigure.

FIG. 92 is a roughly illustrated cross-sectional view of a forth exampleof the light emitting device according to the embodiment. The lightemitting device 500J shown here is a device of a seven segment type of alead frame type. The layer FL including the fluorescent material isformed on the light extraction part of the device by any method asdescribed above.

FIG. 93 is a roughly illustrated cross-sectional view of a fifth exampleof the light emitting device according to the embodiment. The lightemitting device 650J shown here is a device of a matrix type. The layerFL including the fluorescent material is formed on the light extractionpart of the device by any method as described above.

FIG. 94 is a roughly illustrated cross-sectional view of a sixth exampleof the light emitting device according to the embodiment. The lightemitting device 700J shown here is a device of an array type. The layerFL including the fluorescent material is dispersed in the rod lens 740.Alternatively, the layer FL can be coated on the surface of the lens740, a film including the fluorescent material can be sticked on thelens 740.

FIG. 95 is a roughly illustrated cross-sectional view of a seventhexample of the light emitting device according to the embodiment. Thelight emitting device 750J shown here is a laser device of a can type.The layer FL including the fluorescent material is formed on the lightextraction part, i.e. the window of the cap, of the device by any methodas described above.

The above explained specific examples shown in FIGS. 90 through 95 alsohave various advantages as explained with reference to FIG. 89.

Next explained is a twelfth embodiment of the invention. According tothe embodiment, a piece including the fluorescent material is placednear the light extraction part of the light emitting element.

In the following explanations, the same components as those of the lightemitting device shown in FIGS. 1 through 95 are labeled with commonreference numerals, and their detailed explanation is omitted.

FIG. 96A is a roughly illustrated cross-sectional view of a example ofthe light emitting device according to the embodiment. The lightemitting device 100K shown here is an LED lamp of the lead frame type.According to the embodiment, a planar piece FL including the fluorescentmaterial is place above the light extraction part of the light emittingelement 990, which absorbs the primary light emitted from the element990 and emits the secondary light.

FIG. 96B is a roughly illustrated cross-sectional view of a secondexample of the light emitting device according to the embodiment. Thelight emitting device 100L shown here is also an LED lamp of the leadframe type. In the example, a planar piece FL1 including the fluorescentmaterial is place above the light extraction part of the light emittingelement 990. Besides, another piece FL2 is placed to enclose the spacebetween the element 990 and the piece FL1. The piece FL2 also includesthe fluorescent material and has a cylindlycal shape with a hollow, forexample.

The pieces FL, FL1 and FL2 according to the embodiment can be formed bysintering a mixed material consisting an appropriate medium and thefluorescent material. As such a medium, organic material or inorganicmaterial can be used. The fluorescent material is dispersed in themedium. The shapes and the locations of the pieces FL, FL1 and FL2 maybe appropriately decided depending to the construction of the lightemitting device. These pieces FL, FL1 and FL2 also absorb the primarylight emitted from the element 990 and emit the secondary light.Accordingly, the same advantages as explained with reference to theabove embodiments can be obtained as well.

In the above-explained first through twelfth embodiments with referenceto FIGS. 1 through 96B, the light emitting elements and the lightemitting devices including a fluorescent material as a wavelengthconverter are disclosed.

Next explained are further advanced elements and devices. In thefollowing explanation of thirtieth through twenty-sixth embodiments withreference to FIGS. 97 through 125, various elements and devices having alight absorber and/or a optical reflector in addition to the wavelengthconverter will be disclosed.

FIG. 97 is a cross-sectional view schematically showing a semiconductorlight emitting element taken as the thirtieth embodiment of theinvention. The semiconductor light emitting element 2010A shown here isa semiconductor light emitting element including a wavelength converterFL and light absorber AB aligned along the path for extracting thelight. The light emitting layer employed here may be of any kind ofmaterial which can emit a primary light having desired wavelength forthe wavelength converter FL. For example, gallium nitride, siliconcarbide (SiC) or zinc selenide (ZnSe) may be employed as the material ofthe light emitting layer to obtain the primary light of blue or violetwavelength range. The following description shows exemplary cases havinga gallium nitride light emitting layer.

The light emitting element 2010A may have a multi-layered structure ofsemiconductors stacked on a sapphire substrate 2012, namely, a bufferlayer 2014, n-type contact layer 2016, n-type cladding layer 2018, lightemitting layer 2020, p-type cladding layer 2022 and p-type contact layer2024 which are stacked in this order on the sapphire substrate 2012.These layers may be grown by MOCVD (metal-organic chemical vapordeposition).

The buffer layer 2014 may be made of n-type GaN, for example. The n-typecontact layer 2016 has a high n-type carrier concentration to ensureohmic contact with the n-side electrode 2034, and its material may beGaN, for example. The n-type cladding layer 2018 and the p-type claddinglayer 2022 function to confine carriers within the light emitting layer2020. The light emitting layer 2020 is a layer in which emission occursdue to recombination of electric charges injected as a current into thelight emitting element. The light emitting layer 2020 may be made ofundoped InGaN, for example, and the cladding layers 2018 and 2022 may bemade of AlGaN having a larger band gap than the light emitting layer2020. The p-type contact layer 2024 has a high p-type carrierconcentration to ensure ohmic contact with the p-side electrode 2026,and its material may be GaN, for example.

Stacked on the p-type contact layer 2024 is the p-side electrode 2026which is transparent to light. Stacked on the n-type contact layer 2018is the n-side electrode 2034. Bonding pads 2032 of Au (gold) are stackedon these electrodes, respectively, so that the wires (not shown) forsupplying a operating current to the element be bonded. The surface ofthe element is covered by a passivating film 2030 of silicon oxide, forexample.

Stacked on the p-side electrode 2026 are the wavelength converter FL andlight absorber AB, in this order. The wavelength converter FL, amongthese elements, is explained first.

The wavelength converter FL functions to absorb the primary lightemitted from the light emitting layer 2020 and to emit secondary lighthaving a longer wavelength. The wavelength converter FL may be a layermade of a predetermined medium containing a fluorescent material. Thefluorescent material absorbs the primary light emitted from the lightemitting layer 2020 and is excited thereby to release a secondary lightwith a predetermined wavelength. For example, if the primary lightemitted from the light emitting layer 2020 is the ultraviolet rayshaving the wavelength of about 330 nm, the wavelength converter FL maybe configured so that the secondary light wavelength-converted by thefluorescent material has a predetermined wavelength in the visible bandor infrared band. The wavelength of the secondary light can be adjustedby selecting an appropriate fluorescent material. Appropriatefluorescent materials absorbing the primary light in the ultravioletband and efficiently emitting the secondary light are, for example,Y₂O₂S:Eu or La₂O₂S:(Eu,Sm) for mission of red light, (Sr, Ca, Ba,Eu)₁₀(PO₄)₆·Cl₂ for emission of blue light, and 3(Ba, Mg, Eu,Mn)O·8Al₂O₃ for emission of green light. By mixing these fluorescentmaterials by an appropriate ratio, substantially all colors in thevisible band can be expressed.

Most of these fluorescent materials have their absorption peaks in thewavelength band of about 300 to 380 nm. Therefore, in order to ensureefficient wavelength conversion by the flourescent materials, the lightemitting layer 2020 is preferably designed to emit ultraviolet rays inthe wavelength band below 380 nm. For maximizing the conversionefficiency by the fluorescent materials, the light emitting layer ismore preferably designed to emit ultraviolet rays of a wavelength near330 nm.

Next explained is the light absorber AB. The light absorber AB has awavelength selectivity to absorb the primary light with a highefficiency and to pass secondary light. That is, the light absorber ABhas absorption characteristics in which the absorptance is high to thelight with the wavelength of the primary light, and low to the lightwith the wavelength of the secondary light. The light absorber AB withsuch characteristics can be made of an absorber dispersed in atranslucent medium. Absorbers usable here are, for example,benzotriazole and cyanoacrylate. P-amino benzoic acid, benzophenone andcinnamic acid may also be usable as the absorber having the similarcharacteristics. Besides, among the dye materials, cadmium red or redoxide is usable for red secondary light, and cobalt blue or ultramarineblue is usable for blue secondary light.

By using the light absorber AB, part of the primary light passingthrough the wavelength converter FL1 is absorbed and prevented fromleakage to the exterior. At the same time, the spectrum of extractedlight can be adjusted to improve the chromatic pureness. Additionally,the light absorber AB absorbs ultraviolet rays entering from the outsideof the element and prevents that such external turbulent lightunnecessarily excites the wavelength converter FL into undesiredemission.

Next explained is a semiconductor light emitting element according tothe fortieth embodiment of the invention.

FIG. 98 is a cross-sectional view schematically showing thesemiconductor light emitting element according to the fortiethembodiment. Also the semiconductor light emitting element 2010B shownhere may have a gallium nitride compound semiconductor light emittinglayer. In this embodiment, the element has a wavelength converter FL andoptical reflector RE1 along the path for extracting light. The samecomponents as those of the light emitting element shown in FIG. 97 arelabeled with common reference numerals, and their explanation isomitted.

The embodiment is different from the aforementioned embodiment forhaving the optical reflector RE1 instead of the light absorber AB. Theoptical reflector RE1 is a reflector having a wavelength selectivity,and functions to reflect the primary light and pass the secondary lightin the light. That is, the optical reflector RE1 functions as a cut-offfilter or a band-pass filter which reflects light with the wavelength ofthe primary light and passes light with the wavelength of the secondarylight.

If the primary light is of the ultraviolet wavelength range, titaniumoxide (TiO_(x)) or zinc oxide (ZnO_(x)) may be employed to form the RE1.By dispersing these materials in an appropriate solvent and by coatingit on the wavelength converter FL, the optical reflector RE1 is formed.

A Bragg reflecting mirror, which can be made by alternately stacking twokinds of thin films different in refractive index to form a reelectingmirror having a high reflectance against light in a specific wavelengthband, may be employed as the optical reflector RE1. If the wavelength ofthe primary light is λ and the optical refractive index of the thin filmlayer is n, a reflecting mirror exhibiting a very high reflectance tothe primary light can be made by alternately stacking two kinds of thinfilms each having the thickness of λ/(4n). These two kinds of thin filmspreferably have a large difference in optical refractive index.Appropriate combinations are, for example, silicon oxide (SiO₂) andtitanium oxide (TiO₂); aluminum nitride (AIN) and indium nitride (InN);and a thin film made of any one of these materials and a thin film ofaluminum gallium arsenide, aluminum gallium phosphide, tantalumpentoxide, polycrystalline silicon or amorphous silicon.

The optical reflector RE1 made in this manner reflects and returns partof the primary light passing through the wavelength converter FL back tosame with a high efficiency. The returned primary light is thenwavelength-converted by the wavelength converter FL and permitted topass through the optical reflector RE1 as secondary light. That is, bylocating the optical reflector RE1 adjacent to the emission end of thewavelength converter FL, it is possible to prevent leakage of theprimary light and to return part of the primary light passing throughthe wavelength converter FL. Therefore, the primary light can beefficiently converted in wavelength. The optical reflector RE1 alsofunctions to reflect ultraviolet rays which undesirably enter into theelement from the outside of the element. It is therefore prevented thatthe wavelength converter FL is excited by external turbulent light intoundesirable emission.

Next explained is a semiconductor light emitting element according tothe fiftieth embodiment of the invention.

FIG. 99 is a cross-sectional view schematically showing thesemiconductor light emitting element according to the fiftiethembodiment. Also the semiconductor light emitting element 2010C shownhere may have a gallium nitride compound semiconductor light emittinglayer. In this embodiment, the element has a wavelength converter FL, aoptical reflector RE1 and a light absorber AB along the path forextracting light. The same components as those of the light emittingelements shown in FIGS. 97 and 98 are labeled with common referencenumerals, and their explanation is omitted.

According to the embodiment, by combining the optical reflector RE1 andthe light absorber AB, further improved light emitting element isrealized. That is, the optical reflector RE1 made in this mannerreflects and returns part of the primary light passing through thewavelength converter FL back to same with a high efficiency. Thereturned primary light is then wavelength-converted by the wavelengthconverter FL and permitted to pass through the optical reflector RE1 assecondary light. That is, by locating the optical reflector RE1 adjacentto the emission side of the wavelength converter FL, it is possible toprevent leakage of the primary light and to return the unconvertedprimary light back to the wavelength converter FL. Therefore, theprimary light can be efficiently converted. The optical reflector RE1also functions to reflect ultraviolet rays which undesirably enter intothe element from the outside. It is therefore prevented that thewavelength converter FL is unnecessarily excited by external turbulentlight into undesirable emission.

In addition to this, by arranging the light absorber AB on the opticalreflector RE1, part of the primary light passing through the reflectorRE1 is absorbed and prevented from leakage to the outside. At the sametime, the spectrum of extracted light can be adjusted to improve thechromatic pureness. Additionally, the light absorber AB absorbsultraviolet rays entering from the exterior and prevents that suchexternal turbulent light excites the wavelength converter FL intoundesired emission.

Next explained is a semiconductor light emitting element according tothe sixtieth embodiment of the invention.

FIG. 100 is a cross-sectional view schematically showing thesemiconductor light emitting element according to the sixtiethembodiment. Also the semiconductor light emitting element 2010D shownhere may have a gallium nitride compound semiconductor light emittinglayer, and a wavelength converter FL, a optical reflector RE1 and alight absorber AB are arranged along the path for extracting light. Thesame components as those of the light emitting elements shown in FIGS.97 and 98 are labeled with common reference numerals, and theirexplanation is omitted.

The embodiment shown here further includes a second optical reflectorRE2 on one side of the light emitting layer 2020 nearer to thesubstrate. The optical reflector RE2 functions to reflect the primarylight emitted from the light emitting layer 2020 into the wavelengthconverter FL. Therefore, the primary light emitted from the lightemitting layer 2020 toward the substrate 2012 can be used effectively.When the reflector RE2 is not provided, the primary light from the lightemitting layer 2020 toward the substrate 2012 is absorbed in theinterposed layers or scattered at the bottom surface of the substrate2012, and cannot be converted efficiently in the wavelength converterFL. In the embodiment shown here, however, the optical reflector RE2reflects it and makes it enter into the wavelength converter FL. As aresult, primary light can be converted and extracted externally with ahigher efficiency.

The optical reflector RE2 may be a Bragg reflecting mirror having a highreflectance to primary light so that primary light emitted from thelight emitting layer 2020 toward the substrate 2012 can be returned backto the wavelength converter FL with a high reflectance. The Braggreflecting mirror may be made by alternately stacking thin films ofaluminum nitride (AIN) and indium nitride (InN), indium nitride andaluminum gallium arsenide, or indium nitride and aluminum galliumphosphide, for example.

Alternatively, the optical reflector RE2 may be a total reflectionmirror instead of a wavelength selective mirror. That is, by using areflecting mirror having a high reflectance to both the primary lightand the secondary light as the optical reflector RE2, any secondarylight departing from the wavelength converter FL toward the substrate2012 can be reflected and extracted efficiently. The total reflectionmirror may be a single-layer metal film, for example, having a highreflectance, instead of a Bragg reflector.

The location of the optical reflector RE2 is not limited to the positionshown in FIG. 100, but it may be located either along the boundary ofany adjacent two of the crystal layers 2012 through 2020 or on thebottom surface of the substrate 2012. Alternatively, one of the crystallayers 2014 through 2018 may be used and made as the optical reflectorRE2.

Next explained is a semiconductor light emitting element according tothe seventieth embodiment of the invention.

FIG. 101 is a cross-sectional view schematically showing thesemiconductor light emitting element according to the seventiethembodiment. Also the semiconductor light emitting element 2010E shownhere includes a wavelength converter FL, optical reflector RE1 and lightabsorber AB along the path for extracting light. Here again, the samecomponents as those of the light emitting element shown in FIGS. 97 and98 are labeled with common reference numerals, and their explanation isomitted.

The embodiment shown here further includes an optical reflector RE3which envelopes the light emitting element. The optical reflector RE3may be either a wavelength selective reflector or a total reflectionmirror having no wavelength selectivity.

When the optical reflector RE3 has a wavelength selectivity, it reflectsthe primary light emitted from the light emitting layer 2020, andprevents its leakage to the outside. The primary light respectivelyreflected in this manner finally enters into the wavelength converter FLand is converted to the secondary light. Therefore, the wavelengthconversion efficiency is improved. The wavelength selectivity can berealized by using a Bragg reflecting mirror.

When the optical reflector RE3 has no wavelength selectivity, itprevents external leakage of not only the primary light but also otherwavelength components including secondary light. The total reflectionmirror may be made of a metal film, for example. The total reflectionmirror results in limiting the light emitting path only to an openingwhere the optical reflector RE3 is not made. That is, by covering thesurfaces of the light emitting element 2010C with the optical reflectorRE3 to permit secondary light to be emitted only through a predeterminedopening, the optical radiation pattern can be readily controlled inaccordance with the configuration of the opening. For example, when theoptical reflector RE3 is configured to define a very small opening, alight emitting element as a point light source with a high brightnesscan be made easily. A point light source enables effective convergenceof light by means of an optical means including lenses, and ispractically advantageous in most cases.

Next explained is a semiconductor light emitting element according tothe eightieth embodiment of the invention.

FIG. 102 is a cross-sectional view schematically showing thesemiconductor light emitting element according to the eightiethembodiment. The semiconductor light emitting element 2010F shown herehas a second optical reflector RE4 which is provided adjacent to theoptical entry side of the wavelength converter FL. That is, the opticalreflector RE4, wavelength converter FL, optical reflector RE1 and lightabsorber AB are provided in this order along the path for extractinglight. Here again, the same components as those of the light emittingelement shown in FIGS. 97 through 101 are labeled with common referencenumerals, and their explanation is omitted.

The optical reflector RE4 used in the present embodiment has awavelength selectivity to pass the primary light emitted from the lightemitting layer 2020 and to reflect the secondary light emitted from thewavelength converter after conversion. That is, the optical reflectorRE4 has a low reflectance to the light with the wavelength of theprimary light and a high reflectance to the light with the wavelength ofthe secondary light. Such a wavelength selectivity can be realized byusing a Bragg reflecting mirror mentioned before, for example.

The wavelength converter FL functions to absorb primary light andrelease secondary light with a longer wavelength. Details thereof arethe same as explained with reference to the thirtieth embodiment.

The optical reflector RE1 is configured to exhibit a low reflectance tothe secondary light emitted from the wavelength converter and a highreflectance to the primary light. Also this type of wavelengthselectivity can be realized by using a Bragg reflecting mirror.

The light absorber AB is configured to exhibit a high opticalabsorptance to primary light and a low absorptance to secondary light.Structural details thereof may be the same as explained with referenceto the thirtieth embodiment.

According to the present embodiment, primary light emitted from thelight emitting layer 2020 passes through the optical reflector RE4, thenenters into the wavelength converter FL, and is converted into secondarylight. Part of the primary light passing through the wavelengthconverter FL without wavelength conversion is reflected by the opticalreflector RE1 back to the wavelength converter FL. Part of the primarylight not reflected by and passing through the optical reflector RE1 isabsorbed by the light absorber AB not to leak to the outside.

Part of the secondary light emitted from the wavelength converter FL andrunning toward the optical reflector RE1 passes through the opticalreflector RE1 and the light absorber AB, and can be extracted to theexterior. Part of the secondary light released from the wavelengthconverter FL and running toward the light emitting layer 2020 isreflected by the optical reflector RE4, passes through the wavelengthconverter FL, optical reflector RE1 and light absorber AB, and can beextracted to the outside.

If the optical reflector RE4 is not provided, secondary light releasedfrom the wavelength converter FL toward the light emitting layer 2020cannot be efficiently extracted to the outside because the most partthereof is absorbed in the layers 2012 through 2026, or scattered byinterfaces of these layers or by the surfaces of the substrate. Incontrast, according to the embodiment, the optical reflector RE4reflects secondary light released from the wavelength converter FLtoward the light emitting layer 2020 and makes it be efficientlyextracted to the outside.

The present embodiment may be combined with the sixtieth embodiment orthe seventieth embodiment to realize a more efficient semiconductorlight emitting element. When the optical reflector RE2 used in thesixtieth embodiment is added to the present embodiment, the primarylight released from the light emitting layer 2020 can be moreefficiently introduced into the wavelength converter FL for wavelengthconversion there. When the optical reflector RE3 used in the seventiethembodiment is added to the present embodiment, the emission aperture ofthe light emitting element is easily controlled and a point-sized lightsource can be made.

The above explanation with reference to FIGS. 97 through 102 has beenmade on gallium nitride semiconductor light emitting elements grown onsapphire substrates. However, the invention is not limited to thesespecific examples but similarly applicable to a gallium nitridesemiconductor light emitting element grown on a SiC substrate or anyother appropriate substrate, ensuring the same effects. Materials of thelight emitting layer and other layers are not limited to gallium nitridecompound semiconductors. Any other materials may be used as far as theyensure emission of a primary light which can be efficiently converted inthe wavelength converter FL. In the case where a fluorescent material isused to obtain visible light, the light emitting layer is preferablyconfigured to emit light with a wavelength in bands from blue toultraviolet rays. Usable materials of the light emitting layer of thistype are, ZnSe, ZnS, SiC and BN, for example, in addition to galliumnitride compound semiconductors.

Next explained are semiconductor light emitting devices according to theninetieth embodiment of the invention.

FIG. 103 is a roughly illustrated cross-sectional view of asemiconductor device according to the invention. The semiconductor lightemitting device 2100A shown here is a device called “LED (light emittingdiode) lamp” of a so-called “lead frame type”. The device 2100A includesa semiconductor light emitting element 2900 mounted on the bottom of acup of a lead frame 2110. The p-side electrode and the n-side electrodeof the light emitting element 2900 are connected to lead frames 2110 and2120 by wires 2130, 2130, respectively. Inner lead parts of the leadframes are molded in and protected by a resin 2140.

In the embodiment shown here, a wavelength converter FL is located onthe light emitting element 2900. Further, the resin 2140 functions as alight absorber AB which has an wavelength selectivity.

The wavelength converter FL functions to absorb primary light emittedfrom the semiconductor light emitting element 2900 and to releasesecondary light with a longer wavelength. Its structure may be the sameas the wavelength converter FL explained with reference to FIG. 97. Thatis, it may be made by dispersing a predetermined fluorescent material ina translucent medium.

The light absorber AB (resin 2140) has a wavelength selectivity to passthe secondary light and to absorb the primary light. It may be made bydispersing a predetermined light absorber in the resin 2140. Structuraldetails thereof may be the same as the light absorber AB explained withreference to FIG. 97. Absorbers usable for the ultraviolet primary lightare, for example, benzotriazole, cyanoacrylate, p-amino benzoic acid,benzophenone and cinnamic acid as mentioned before.

The semiconductor light emitting element 2900 is preferably one for ashort emission wavelength in order to increase the conversion efficiencyin the wavelength converter FL. The light emitting element of this typemay be one using gallium nitride compound semiconductors, ZnSe, ZnS, SiCor BN, for example, as the material of the light emitting layer 2020.

In the device shown here, since the wavelength converter FL is provided,primary light from the semiconductor light emitting element 2900 isconverted into desired visible light or infrared rays.

Moreover, since the light absorber AB is provided, the primary lightpassing through the wavelength converter FL is absorbed and preventedfrom leakage to the outside, and the spectrum of extracted light can beadjusted to improve the chromatic pureness. Additionally, the lightabsorber AB absorbs ultraviolet rays entering from the outside andprevents that such external turbulent light unnecessarily excites thewavelength converter FL into undesired emission.

The above explanation, with reference to FIG. 103 has been made on anLED lamp of a lead frame type. However, the invention is not limited tothese specific example but similarly applicable to an LED lamp of an SMD(surface mount device) type.

Next explained is a semiconductor light emitting device according to thetwentieth embodiment of the invention.

FIG. 104 is a roughly illustrated cross-sectional view of asemiconductor device according to the invention. The device 2100B shownhere is also a LED lamp of a lead frame type. In FIG. 104, the samecomponents as those of the light emitting device shown in FIG. 103 arelabeled with common reference numerals, and their explanation isomitted.

In the embodiment, the wavelength convertor FL is located on the lightemitting element 2900. The resin 2140 is composed of the inner mold part2140 a and the outer mold part 2140 b. The inner mold part 140 a islocated inside the cup region of the lead frame 110 and functions as thelight absorber AB having a wavelength selectivity. The inner mold part2140 a may be made of epoxy resin. The absorber dispersed therein may bebenzotriazole and so on as explained with reference to FIG. 103. Theouter mold part 2140 b is preferably made of a translucent material tothe secondary light.

A specific example of the fabricating the device is explained below. Afluorescent material having the desired wavelength conversion functiondispersed in a desired solvent or a coating material and coated on thesurface of the light emitting element 2900. A absorber having thewavelength selectivity is dispersed in a resin and molded into the cupregion of the lead frame 2110 to form the inner mold part 2140 a. Then,a optically transparent resin is applied around the inner mold part toform the outer mold part 2140 b.

Alternatively, a desired matrix such as solvent, coating material orresin mixed with the fluorescent material and the absorber may beapplied into the cup region of the lead frame 2110. By utilizing thedifference of the segregating speed between the fluorescent material andthe absorber, the fluorescent layer FL and the light absorber AB may bestacked on the light emitting element in this order. The fluorescentmaterials used in the invention segregates first because they have lagerspecific gravities than the light absorbers. The light absorber tends toremain in the matrix because of their high viscosity. By selecting thelight absorber so that its melting temperature is similar to the curingtemperature of the matrix, the absorber may be uniformly dispersed inthe matrix by performing the curing process.

Since the light absorber AB is provided, the primary light passingthrough the wavelength converter FL is absorbed and prevented fromleakage to the outside, and the spectrum of extracted light can beadjusted to improve the chromatic pureness. Additionally, the lightabsorber AB absorbs ultraviolet rays entering from the outside andprevents that such external turbulent light unnecessarily excites thewavelength converter FL into undesired emission.

Next explained is a semiconductor light emitting devices according tothe twenty-first embodiment of the invention.

FIG. 105 is a roughly illustrated cross-sectional view of asemiconductor device according to the invention. The device 2100C shownhere is also a LED lamp of a lead frame type. In FIG. 106, the samecomponents as those of the light emitting device shown in FIG. 105 arelabeled with common reference numerals, and their explanation isomitted.

The resin 2140 functions as the optical reflector RE1 having awavelength selectivity. For example, the resin 2140 is made of epoxyresin in which a optical reflector having a wavelength selectivity isdispersed. The reflector dispersed in the resin functions to reflect theprimary light and pass the secondary light in the light entering fromthe wavelength converter FL. If the primary light is of the ultravioletwavelength range, titanium oxide (TiO_(x)) or zinc oxide (ZnO_(x)) maybe employed to form the RE1 as explained above.

The optical reflector RE1 made in this manner reflects and returns partof the primary light passing through the wavelength converter FL back tosame with a high efficiency. The returned primary light is thenconverted by the wavelength converter FL and permitted to pass throughthe optical reflector RE1 as secondary light. That is, by locating theoptical reflector RE1 adjacent to the emission end of the wavelengthconverter FL, it is possible to prevent leakage of the primary light andto return part of the primary light passing through the wavelengthconverter FL. Therefore, the primary light can be efficiently convertedin wavelength. The optical reflector RE1 also functions to reflectultraviolet rays which undesirably enter into the element from theoutside of the element. It is therefore prevented that the wavelengthconverter FL is excited by external turbulent light into undesirableemission.

Next explained is a semiconductor light emitting devices according tothe twenty-second embodiment of the invention.

FIG. 106 is a roughly illustrated cross-sectional view of asemiconductor device according to the invention. The device 2100D shownhere is also a LED lamp of a lead frame type. In FIG. 106, the samecomponents as those of the light emitting device shown in FIG. 103 arelabeled with common reference numerals, and their explanation isomitted.

In the device shown here, the wavelength convertor FL is located on thelight emitting element 2900. The resin 2140 is composed of the innermold part 2140 a and the outer mold part 2140 b. The inner mold part2140 a is located inside the cup region of the lead frame 110 andfunctions as the optical reflector RE1 having a wavelength selectivity.

The inner mold part 2140 a may be made of epoxy resin. The reflectordispersed therein may be titanium oxide (TiO_(x)) and so on as explainedwith reference to FIG. 105. The outer mold part 2140 b is preferablymade of a translucent material to the secondary light.

A specific example of the fabricating the device may be essentially thesame as explained with reference to FIG. 106. A fluorescent materialhaving the desired wavelength conversion function dispersed in a desiredsolvent or a coating material and coated on the surface of the lightemitting element 2900. A reflector having the wavelength selectivity isdispersed in a resin and molded into the cup region of the lead frame2110 to form the inner mold part 2140 a. Then, a optically transparentresin is applied around the inner mold part to form the outer mold part2140 b.

Alternatively, a desired matrix such as solvent, coating material orresin mixed with the fluorescent material and the reflector may beapplied into the cup region of the lead frame 2110. By utilizing thedifference of the segregating speed between the fluorescent material andthe reflector, the fluorescent layer FL and the optical reflector RE1may be stacked on the light emitting element in this order.

By locating such an optical reflector RE1, various advantages asexplained with reference to FIG. 105 can be achieved as well.

Next explained is a semiconductor light emitting devices according tothe twenty-third embodiment of the invention.

FIG. 107 is a roughly illustrated cross-sectional view of asemiconductor device according to the invention. The device 2100E shownhere is also a LED lamp of a lead frame type. In FIG. 107, the samecomponents as those of the light emitting device shown in FIG. 106 arelabeled with common reference numerals, and their explanation isomitted.

In the device shown here, the wavelength convertor FL is located on thelight emitting element 2900. The details about the convertor FL may bethe same as described with reference to FIG. 103. Above the convertorFL, the light absorber AB is located and the resin 2140 buries the innerlead part.

The light absorber AB in the embodiment also has a wavelengthselectivity to absorb the primary light with a high efficiency and topass the secondary light. A dichroic filter or a ultraviolet-cut filtercan be employed as the absorber AB. The space between the light emittingelement and the absorber AB may be either filled with appropriatematerial such as resin or filled with appropriate gas.

By locating such an light absorber AB, various advantages as explainedwith reference to FIG. 103 can be achieved as well.

Next explained is a semiconductor light emitting devices according tothe twenty-forth embodiment of the invention.

FIG. 108 is a roughly illustrated cross-sectional view of asemiconductor device according to the invention. The device 2100F shownhere is also a LED lamp of a lead frame type. In FIG. 108, the samecomponents as those of the light emitting device shown in FIG. 103 arelabeled with common reference numerals, and their explanation isomitted.

In the device shown here, the wavelength convertor FL is located on thelight emitting element 2900. The details about the convertor FL may bethe same as described with reference to FIGS. 103 through 107. Above theconvertor FL, the optical reflector RE1 is located and the resin 2140buries the inner lead part.

The optical reflector RE1 in the embodiment also has a wavelengthselectivity to absorb the primary light with a high efficiency and topass the secondary light. A dichroic mirror can be employed as thereflector RE1. The Bragg reflector as explained above may also beemployed as the reflector RE1. The space between the light emittingelement and the reflector RE1 may be either filled with appropriatematerial such as resin or filled with appropriate gas.

By locating such an optical reflector RE1, various advantages asexplained with reference to FIG. 105 can be achieved as well.

Next explained is a semiconductor light emitting devices according tothe twenty-fifth embodiment of the invention.

FIG. 109 is a roughly illustrated cross-sectional view of asemiconductor device according to the invention. The device 2100G shownhere is also a LED lamp of a lead frame type. In FIG. 109, the samecomponents as those of the light emitting device shown in FIGS. 103through 108 are labeled with common reference numerals, and theirexplanation is omitted.

In the device shown here, the light emitting element 2900 a is asemiconductor light emitting element which emits light of the wavelengthrange of blue or violet. Generally, in the semiconductor elements ofthis wavelength range, the emission takes place by the energy transitionthrough the impurity level. As a result, the emission spectrum extendsto the ultraviolet wavelength range in most cases. That is, the emittedlight includes ultraviolet component to some extent in addition to thedesired blue or violet light. For example, LEDs made of the galliumnitride compound, zinc selenide, silicon carbide or boron nitride showthis phenomenon.

According to the embodiment, the inner mold part 2140 a functions as thelight absorber AB. That is, the light absorber AB absorbs theultraviolet component and passes the desired blue or violet light. As aresult, the leakage of the harmfull ultraviolet component is efficientlyprevented and the desired blue or violet light can be extractedsuccessfully. The details of the light absorber AB is as explainedabove. Instead of the inner mold part 2140 a, the outer mold part 2140 bmay be configured to function as the light absorber AB as well.

Next explained is a semiconductor light emitting devices according tothe twenty-sixth embodiment of the invention.

FIG. 110 is a roughly illustrated cross-sectional view of asemiconductor device according to the invention. The device 100H shownhere is also a LED lamp of a lead frame type. In FIG. 110, the samecomponents as those of the light emitting device shown in FIGS. 103through 109 are labeled with common reference numerals, and theirexplanation is omitted.

In the device shown here, the light emitting element 2900 a is also asemiconductor light emitting element which emits light of the wavelengthrange of blue or violet. The details about the element 2900 a may be thesame as described with reference to the FIG. 109. On the element 2900 a,the light absorber AB having a wavelength selectivity is located andmolded by the resin 2140.

The light absorber AB absorbs the ultraviolet component emitted from theelement 2900 a and passes the desired blue or violet light. A dichroicfilter or a UV (ultraviolet)-cut filter may be employed as the absorberAB. The space between the light emitting element and the reflector RE1may be either filled with appropriate material such as resin or filledwith appropriate gas.

By locating such a light absorber AB, various advantages as explainedwith reference to FIG. 109 can be achieved as well.

Next explained is a semiconductor light emitting devices according tothe twenty-seventh embodiment of the invention.

FIG. 111 is a roughly illustrated cross-sectional view of asemiconductor device according to the invention. The device 2100I shownhere is also a LED lamp of a lead frame type. In FIG. 111, the samecomponents as those of the light emitting device shown in FIGS. 103through 110 are labeled with common reference numerals, and theirexplanation is omitted.

In the device shown here, the light emitting element 2900 a is also asemiconductor light emitting element which emits light of the wavelengthrange of blue or violet. The inner mold part 2140 a functions as theoptical reflector RE1 having a wavelength selectivity. That is, thereflector RE1 reflects the ultraviolet component emitted from theelement 2900 a and passes the desired blue or violet light. As a result,the leakage of the harmful ultraviolet component is efficientlyprevented and the desired blue or violet light can be successfullyextracted. The details of the reflector RE1 is as explained withreference to FIG. 105. In addition to the inner mold part 2140 a, theouter mold part 2140 b may also be configured to function as thereflector RE1 as well.

Next explained is a semiconductor light emitting devices according tothe twenty-eighth embodiment of the invention.

FIG. 112 is a roughly illustrated cross-sectional view of asemiconductor device according to the invention. The device 2100J shownhere is also a LED lamp of a lead frame type. In FIG. 112, the samecomponents as those of the light emitting device shown in FIGS. 103through 111 are labeled with common reference numerals, and theirexplanation is omitted.

In the device shown here, the light emitting element 2900 a is also asemiconductor light emitting element which emits light of the wavelengthrange of blue or violet. On the element 2900 a, the optical reflectorRE1 having a wavelength selectivity is located and the resin 2140 ismolded.

The reflector RE1 reflects the ultraviolet component emitted from theelement 2900 a and passes the desired blue or violet light. A dichroicmirror or a UV (ultraviolet)-cut mirror may be employed as the reflectorRE. The space between the light emitting element and the reflector RE1may be either filled with appropriate material such as resin or filledwith appropriate gas.

By locating such an optical reflector RE1, various advantages asexplained with reference to FIG. 111 can be achieved as well.

With reference to FIGS. 103 through 112, the lead frame type LED lampsare exemplarily shown. However, the invention is not limited to thesespecific examples. In addition to these, the invention can beadvantageously applied to the LED lamps of SMD (surface mount device)type or any other various kinds of light emitting devices as well.

Next explained is a semiconductor light emitting device according to thetwenty-ninth embodiment of the invention.

FIG. 113 is a roughly illustrated cross-sectional view of asemiconductor device according to the twenty-ninth embodiment of theinvention. The semiconductor light emitting device 2100K shown here isalso an LED lamp of a lead frame type. In FIG. 113, the same componentsas those of the light emitting device shown in FIGS. 103 through 112 arelabeled with common reference numerals, and their explanation isomitted.

In the embodiment shown here, a wavelength converter FL and an opticalreflector RE1 are located adjacent to the emission end of thesemiconductor light emitting element 2900. The resin 2140 functions asan light absorber AB having a wavelength selectivity.

The wavelength converter FL functions to absorb primary light emittedfrom the semiconductor light emitting element 2900 and to releasesecondary light with a longer wavelength. Its structure may be the sameas the wavelength converter FL explained with reference to FIG. 97. Thatis, it may be made dispersing a predetermined fluorescent material in atranslucent medium.

The optical reflector RE1 has a wavelength selectivity to reflectprimary light emitted from the semiconductor light emitting element 2900and to pass secondary light after conversion by the wavelength converterFL. Here again, its structure may be the same as the optical reflectorRE1 explained with reference to FIG. 98.

The light absorber AB has a wavelength selectivity to pass secondarylight and to absorb primary light. It may be made by dispersing apredetermined light absorber in the resin 2140. Structural detailsthereof may be the same as the light absorber AB explained withreference to FIG. 97.

The semiconductor light emitting element 2900 is preferably one for ashort emission wavelength in order to increase the wavelength conversionefficiency in the wavelength converter FL. The light emitting element ofthis type may be one using gallium nitride compound semiconductors,ZnSe, ZnS, SiC or BN, for example, as the material of the light emittinglayer.

In the device shown here, since the wavelength converter FL is provided,primary light from the semiconductor light emitting element 2900 isconverted into desired visible light or infrared rays. Moreover, sincethe optical reflector RE1 is provided, part of the primary light whichleaks through the wavelength converter FL is reflected with a highefficiency and returned back to the wavelength converter FL. The primarylight returned back in this manner is wavelength-converted in thewavelength converter FL, and then passes through the optical reflectorRE1 as secondary light. That is, by locating the optical reflector RE1adjacent to the emission end of the wavelength converter FL, it ispossible to prevent leakage of the primary light and to return primarylight passing through the wavelength converter FL for wavelengthconversion once again. Therefore, primary light can be converted veryefficiently.

Furthermore, since the light absorber AB is provided, primary lightpassing through the optical reflector RE1 is absorbed and prevented fromleakage to the exterior, and the spectrum of extracted light can beadjusted to improve the chromatic pureness.

FIG. 114 is a cross-sectional schematic view of the second semiconductorlight emitting device according to the present embodiment. Thesemiconductor light emitting device 2150A shown here is a device called“surface mounted lamp (SMD lamp)”. The SMD lamp 2150A includes asemiconductor light emitting element 2900 mounted on a packaging surfaceof a packaging member and protected by a resin 2190. Also in the SMDlamp 2150A of a substrate type shown in FIG. 114, by providing thewavelength converter FL, optical reflector RE1 and light absorber AB,the same effects as explained with reference to FIG. 113 can beobtained. Although the light absorber AB is illustrated as being theresin 2190 itself, it may be another thin film stacked on the surface ofthe resin.

FIG. 115 is a cross-sectional schematic view of the third semiconductorlight emitting device according to the present embodiment. Thesemiconductor light emitting device 2200A shown here is a “surfaceemission type” semiconductor light emitting device. The surface emissiontype device 2200A includes semiconductor light emitting elements 2900mounted on lead frames 2210 and 2212, respectively, and molded in aresin 2240 within a cup of the reflection plate 2220.

Light emitted from each semiconductor light emitting element isreflected by the reflection plate 2220, and extracted as wide-spreadlight to the exterior.

Also in the surface emission type semiconductor light emitting device2200A shown in FIG. 115, by providing the wavelength converter FL,optical reflector RE1 and light absorber AB, the same effects as thoseof the semiconductor light emitting device explained with reference toFIG. 113 can be obtained.

FIG. 116 is a cross-sectional schematic view of the fourth semiconductorlight emitting device according to the present embodiment. Thesemiconductor light emitting device 2250A shown here is a device called“dome type”. The dome type device 2250A has a plurality of semiconductorelements 2900, e.g. five to ten elements 2900, which are mounted on alead frame 2260. These semiconductor light emitting elements areconnected, respectively, to terminals of the lead frame 2260 by wires(not shown), and are molded in an encapsulating resin 2290.

The dome type semiconductor light emitting device 2250 having a numberof semiconductor light emitting elements is advantageous in highluminance and in releasing uniformly spread light.

Also in the dome type semiconductor light emitting device 2250A, byusing the wavelength converter FL, optical reflector RE1 and opticalabsorber AB, the same effects as those of the semiconductor lightemitting device shown in FIG. 113 can be obtained.

FIG. 117 is a schematic view of the fifth semiconductor light emittingdevice according to the present embodiment. The semiconductor lightemitting device 2300A shown here is a device called “7 segment type”,and more particularly, “substrate type”. The central part thereof isillustrated here in a cross-sectional view. The “7 segment type lightemitting device” is a light emitting device for display of numerals.That is, a semiconductor light emitting element 2900 is mounted on asubstrate 2310. Light emitted from the semiconductor light emittingelement 2900 is reflected by a reflection plate 2320.

Also in the 7 segment type semiconductor light emitting device 2300Ashown in FIG. 117, by using the wavelength converter FL, opticalreflector RE1 and light absorber AB, the same effects as those of thesemiconductor light emitting device shown in FIG. 113 are obtained.

FIG. 118 is a schematic view of the sixth semiconductor light emittingdevice according to the present embodiment. Also the semiconductor lightemitting device 2350A shown here is a 7 segment type semiconductor lightemitting device, and more particularly, a device called “lead frametype”. The central part thereof is illustrated here in a cross-sectionalview. That is, the device includes a semiconductor light emittingelement 2900 mounted on a lead frame 2360 and connected appropriately bya wire. The semiconductor light emitting element 2900 is sealed by aresin 2390. Light emitted from the semiconductor light emitting element900 is reflected by a reflection plate 2370 and can be extracted to theexterior.

Also in the 7 segment type semiconductor light emitting device 2350Ashown in FIG. 118, by using the wavelength converter FL, opticalreflector RE1 and light absorber AB, the same effects as those of thesemiconductor light emitting device shown in FIG. 113 can be obtained.

FIG. 119 is a schematic view of the seventh semiconductor light emittingdevice according to the present embodiment. The semiconductor lightemitting device 2400A whose central part is shown here in across-sectional view is a semiconductor light emitting device called“LED array type”, “meter indicator type”, “level meter type” or “matrixtype”. The semiconductor light emitting device 2400A includes aplurality of semiconductor light emitting elements mounted inpredetermined intervals on a substrate or a lead frame 2410 andconnected to terminals by wires (not shown). These semiconductor lightemitting elements are molded in an encapsulating resin 2440.

The semiconductor light emitting device 2400A is compact and light, andhas the advantage of releasing highly luminous and uniform-spread lightbecause a number of semiconductor light emitting elements are mounted.

Also in the semiconductor light emitting device 2400A shown in FIG. 119,by using the wavelength converter FL, optical reflector RE1 and lightabsorber AB, the same effects as those of the semiconductor lightemitting device shown in FIG. 113 can be obtained. The wavelengthconverter FL is illustrated here as being mixed in the encapsulatingresin 2440; however, it may be a fluorescent layer stacked on surfacesor around the semiconductor light emitting elements.

If some wavelength converters FL are aligned to release different kindsof secondary light of different wavelengths, a distribution of emissioncolors can be made easily on the indicator. In this case, the presentinvention can realize it only by changing the material of thefluorescent layer while using identical materials and structure forsemiconductor elements, and therefore has the advantage that commondriving current or supply voltage may be applied to all semiconductorelements.

FIG. 120 is a schematic view of the eighth semiconductor light emittingdevice according to the present embodiment. The semiconductor lightemitting device 2450A shown here in a cross-sectional view is aso-called “can type” semiconductor light emitting device having asemiconductor light emitting element 2900 attached to an end of a stem2470. The semiconductor light emitting element 2900 is a laser element.A photodetector 2475 for monitoring purposes is located behind thesemiconductor light emitting element to monitor optical outputs from thesemiconductor light emitting element 2900. The head portion of the stem2470 is sealed by a can 2490, and laser light can be extracted through awidow 2492.

Also in the can type laser semiconductor light emitting device 2450Ashown in FIG. 120, by using the wavelength converter FL, opticalreflector RE1 and light absorber AB, the same effects as those of thesemiconductor light emitting device shown in FIG. 113 can be obtained.

Heretofore, semiconductor light emitting devices according to thetwenty-ninth embodiment of the invention, each using the wavelengthconverter FL, optical reflector RE1 and light absorber AB, wereexplained by way of specific examples shown in FIGS. 113 through 120.

Next explained is the thirtieth embodiment of the invention in form of asemiconductor light emitting device having a second optical reflectorRE2 as used in seventieth embodiment of the invention.

FIG. 121 is a schematic cross-sectional view showing the semiconductorlight emitting device according to the thirtieth embodiment of theinvention. The semiconductor light emitting device 2100L shown here is a“lead frame type” “LED lamp”. Also the semiconductor light emittingdevice 2100L shown here has the wavelength converter FL, opticalreflector RE1 and light absorber AB along the path for extracting lightfrom the semiconductor light emitting element 2900. Here again, the samecomponents as those of the light emitting device shown in FIG. 103 arelabeled with common reference numerals, and their explanation isomitted.

In this embodiment, a second optical reflector RE2 is provided under thesemiconductor light emitting element 2900. The optical reflector RE2functions to reflect primary light emitted from the semiconductor lightemitting element 2900 and to guide it into the wavelength converter FL.That is, the optical reflector RE2 makes part of the primary lightdeparting from the semiconductor light emitting element 2900 toward thelead frame 2110 be used effectively. In a device without the reflectorRE2, most of the primary light from the semiconductor light emittingelement 2900 toward the lead frame 2110 is randomly reflected by themounting surface of the element, and is not guided efficiently to thewavelength converter FL for wavelength conversion therein. In theembodiment, however, the optical reflector RE2 reflects the primarylight into the wavelength converter FL to ensure wavelength conversionof the primary light and extraction thereof with a high efficiency.

The optical reflector RE2 may be a Bragg reflecting mirror, for example,as explained before. That is, by using a Bragg reflecting mirror havinga high reflectance to primary light as the optical reflector RE2,primary light departing from the semiconductor light emitting element2900 toward the lead frame 2110 can be returned back to the wavelengthconverter FL with a high reflectance. The Bragg reflecting mirror may bemade by alternately stacking thin films of aluminum nitride (AIN) andindium nitride (InN); indium nitride and aluminum gallium arsenide; andindium nitride and aluminum gallium phosphide, for example.

Alternatively, the optical reflector RE2 may be a total reflectionmirror having no wavelength selectivity. When the optical reflector RE2is a reflection mirror exhibiting a high reflectance to both primarylight and secondary light, secondary light departing from the wavelengthconverter FL toward the lead frame 2110 can be reflected and extractedefficiently. The total reflection mirror may be made of a single-layeredmetal film, for example, having a high reflectance, instead of a Braggreflecting mirror.

The present embodiment is not limited to the LED lamp shown in FIG. 121,but similarly applicable also to various kinds of semiconductor lightemitting devices show in FIGS. 114 through 120 or any othersemiconductor devices using a semiconductor light emitting element,while ensuring similar effects.

Next explained is the thirty-first embodiment of the invention in formof a semiconductor light emitting device having a third opticalreflector RE3 around its semiconductor light emitting element, like theseventieth embodiment explained above.

FIG. 122 is a schematic cross-sectional view of the semiconductor lightemitting device according to the thirty-first embodiment. Thesemiconductor light emitting device 2100M shown here is a “lead frametype” “LED lamp”. Here again, the semiconductor light emitting device2100M has the wavelength converter FL, optical reflector RE1 and lightabsorber AB along the path for extracting light from the semiconductorlight emitting element 2900. Here again, the same components as those ofthe light emitting device shown in FIG. 113 are labeled with commonreference numerals, and their explanation is omitted.

The embodiment shown here further includes a third optical reflector RE3around the semiconductor light emitting element 2900. The opticalreflector RE3 may be either a wavelength selective reflector or a totalreflection mirror having no wavelength selectivity.

When the optical reflector RE3 has a wavelength selectivity, primarylight from the semiconductor light emitting element 2900 can bereflected and prevented from external leakage. Primary light reflectedagain and again is finally introduced into the wavelength converter FLad converted into secondary light therein. Therefore, the wavelengthconversion efficiency is improved. The wavelength selectivity can berealized by using a Bragg reflecting mirror as explained before.

When the optical reflector RE3 has no wavelength selectivity, itprevents leakage of not only primary light but also other opticalcomponents having wavelengths of secondary light, etc. Such a totalreflection mirror may be made of a metal film, for example. By makingthe total reflection mirror, it is possible to limit the path forreleasing light in the light emitting device 2100M to an opening made inthe optical reflector RE3. That is, when the optical reflector RE3covers surfaces of the light emitting device 2100M except the opening topermit secondary light to pass only through the opening, the radiationpattern of light can be controlled easily in accordance with theconfiguration of the opening. For example, when the opening of theoptical reflector RE3 is very small, the semiconductor light emittingdevice is readily made as a point-sized light source. Such a point-sizedlight source is practically advantageous in most cases because light canbe effectively collected by an optical system including lenses amongothers.

Here again, the embodiment is not limited to the LED lamp shown in FIG.122 but similarly applicable also to various kinds of semiconductorlight emitting devices explained with reference to FIGS. 114 through 120and any other semiconductor, light emitting devices using semiconductorlight emitting elements, while ensuring similar effects.

Next explained is the thirty-second embodiment of the invention.

In this embodiment, a fourth optical reflector RE4 is interposed betweenthe semiconductor light emitting element 2900 and the wavelengthconverter FL, like the eighteenth embodiment explained before.

FIG. 123 is a schematic cross-sectional view of the semiconductor lightemitting device according to the thirty-second embodiment. Thesemiconductor light emitting device 100N shown here is a “Lead frametype” “LED lamp” having the optical reflector RE4, wavelength converterFL, optical reflector RE1 and light absorber AB located in this orderalong the path for extracting light from the semiconductor lightemitting element 2900. Here again, the same components as those of thelight emitting device shown in FIG. 113 are labeled with commonreference numerals, and their explanation is omitted.

The optical reflector RE4 used in the present embodiment has awavelength selectivity to pass primary light from the semiconductorlight emitting element 2900 and to reflect secondary light released fromthe wavelength converter FL after conversion. That is, the opticalreflector RE4 has a low reflectance to light with the wavelength ofprimary light and a high reflectance to light with the wavelength ofsecondary light. The wavelength selectivity can be realized by using aBragg reflecting mirror, for example, as explained before.

The wavelength converter FL functions to absorb primary light and torelease secondary light having a longer wavelength. Details thereof arethe same as already explained with reference to the thirteenthembodiment.

The optical reflector RE1 is configured to exhibit a low reflectance tosecondary light from the wavelength converter FL and a high reflectanceto primary light. Here again, the wavelength selectivity can be realizedby using a Bragg reflecting mirror.

The light absorber AB is configured to exhibit a high opticalabsorptance to primary light and a low absorptance to secondary light.Here again, details thereof may be the same as explained with referenceto the thirteenth embodiment.

According to the present embodiment, primary light emitted from thesemiconductor light emitting element 2900 passes through the opticalreflector RE4, then enters into the wavelength converter FL, and isconverted into secondary light. Part of the primary light, which passesthrough the wavelength converter FL without being converted inwavelength, is reflected by the optical reflector RE1 back to thewavelength converter FL. Part of the primary light passing even throughthe optical reflector RE1 is absorbed in the light absorber AB andprevented from external leakage.

Optical components running toward the optical reflector RE1 among thesecondary light released from the wavelength converter FL pass throughthe optical reflector RE1 and light absorber AB, and can be extracted tothe exterior. Optical components running toward the semiconductor lightemitting element 2900 among the secondary light released from thewavelength converter FL are reflected by the optical reflector RE4, thenpass through the wavelength converter FL, optical reflector RE1 andlight absorber AB, and can be extracted to the exterior.

In a device without the optical reflector RE4, secondary light releasedfrom the wavelength converter FL toward the semiconductor light emittingelement 2900 is absorbed by the semiconductor light emitting element2900, or randomly reflected by the mounting surface of the semiconductorlight emitting element 2900, and cannot be extracted effectively. In thepresent embodiment, however, since the optical reflector RE4 isprovided, secondary light released from the wavelength converter FLtoward the semiconductor light emitting element 2900 is reflected by theoptical reflector RE4, and can be efficiently extracted to the exterior.

The instant embodiment may be combined with the thirtieth embodiment orthirty-first embodiment to realize a more efficient semiconductor lightemitting device. That is, by adding the optical reflector RE2 used inthe thirtieth embodiment to the structure of the present embodiment,primary light emitted from the semiconductor light emitting element 2900can be introduced into the wavelength converter FL for more efficientwavelength conversion therein. When the optical reflector RE3 used inthe thirty-first embodiment is added to the structure of the presentembodiment, a point-sized light source can be made easily by controllingthe emission pattern of the light emitting, device.

Next explained is the thirty-third embodiment of the invention in formof an image display device having a combination of a semiconductor lightemitting element, wavelength converter, optical reflector and lightabsorber.

FIG. 124 is a schematic cross-sectional view of an exemplary structureof the image display device according to the embodiment. The imagedisplay device 2500A shown here includes a light source section 2520,luminance adjuster 2530 and converter 2550.

The light source section 2520 includes a semiconductor light emittingelement 2900 with a predetermined emission spectrum as its light source,and an optical guide plate 2522 for uniformly spreading light from thesemiconductor light emitting element 2900 to irradiate the luminanceadjuster.

The luminance adjuster 2530 is configured to adjust opticaltransmittance by means of a liquid crystal, for example. That is, theluminance adjuster 2530 includes a liquid crystal layer 2536 interposedbetween polarizing plates 2531 and 2539. When a predetermined voltage isapplied across the pixel electrode 2534 and an opposite electrode 2538,the liquid crystal layer 2D36 is controlled in orientation of itsmolecules and controls the optical transmittance in cooperation with theupper and lower polarizing plates 2531 and 2539. Each pixel electrode2534 formed on a translucent substrate 2532 is supplied with apredetermined voltage via a switching element 2535. The switchingelement 2535 may be a metal-insulator-metal (MIM) bonded element or athin film transistor (TFT) made of hydrogenated amorphous silicon orpolycrystalline silicon, for example.

The converter 2550 includes wavelength converters FL1 through FL3,optical reflectors RE1 through RE3 and light absorbers AB1 through AB3under the translucent substrate 2542. The wavelength converters FL maybe partitioned for individual pixels by a black matrix made of a lightscreen material. The wavelength converters FL may be located over thetranslucent substrate 2542.

In the image display device 2500A, light from the light source section2520 is adjusted in quantity of light for individual pixels in theluminance adjuster 2330 in response to the voltage applied to the liquidcrystal layer 2536, and enters into the wavelength converters FL1through FL3. In the wavelength converters FL1 to FL3, the incidentprimary light is converted into secondary light with predeterminedwavelengths depending upon the natures of respective fluorescentmaterials. For example, the light may be converted to red light in FL1,to green light in FL2 and to blue light in FL3, respectively.

Secondary light released from the wavelength converters FL1 through FL3enters into the optical reflectors RE1 through RE3. Each opticalreflector has a wavelength selectivity to reflect primary light and topass only secondary light.

Secondary light passing through the optical reflectors RE1 to RE3 entersinto the light absorbers AB1 through AB3. Each of the light absorbersAB1 to AB3 has a wavelength selectivity to pass specific secondary lightand to absorb primary light. They may be formed as color filters sothat, for example, AB1 passes red light, AB2 passes green light and AB3passes blue light.

According to the invention, since the semiconductor light emittingelement is used as the light source, the photoelectric conversionefficiency is higher than those of conventional cathode fluorescenttubes, and the power consumption can be reduced. Additionally, as aresult of employing the novel structure configured to excite thefluorescent materials by light from the highly efficient semiconductorlight emitting element, the power consumption of the entire imagedisplay device can be reduced.

Especially, in the present invention, by providing the opticalreflectors RE and light absorbers AB in addition to the wavelengthconverters, the conversion efficiency is further improved. Moreover,when the fourth optical reflector RE4 as explained with reference toFIG. 102 or FIG. 123 is provided adjacent to incident ends of thewavelength converters FL1 to FL3 in the image display device 2500A,secondary light released from the wavelength converters FL1 through FL3can be reflected and extracted to the exterior with a higher efficiency.

In a practically prepared device, namely, a 10.4 inch TFT liquid crystaldisplay device using a conventional cathode fluorescent tube as itslight source, the power consumption was about 9 Watt. In contrast, inthe image display device according to the invention using an ultravioletLED and a fluorescent material, the power consumption is about 4 Watts,which is less than a half of the power consumption of the conventionalliquid crystal display device. As a result, the invention can elongatethe life of batteries of portable electronic apparatuses such asnote-type computers or terminal apparatuses of various kinds ofinformation network systems.

Additionally, according to the invention, since the wavelengthconverters FL can be located nearest to the surface of the image displayscreen, the visual angle is improved significantly.

It is further possible to simplify the circuit and to reduce the drivingvoltage as compared with conventional cathode fluorescent tubes. Cathodefluorescent tubes required a stabilizing circuit and an inverter toapply a high voltage therethrough. In the present invention, however,the semiconductor light emitting element used as the light sourcepromises a sufficient emission intensity with a d.c. voltage as small as2 to 3.5 V, approximately, and the stabilizing circuit and the invertercircuit need not be used. Therefore, the circuit for driving the lightsource can be simplified remarkably, and the driving voltage can bereduced.

Moreover, according to the invention, the life of the light source canbe largely elongated than conventional ones. Conventional cathodefluorescent tubes are subject to a rapid decrease in luminance andfurther to no emission after a predetermined life time due to sputteringor other like phenomenon at the electrode portion. In the presentinvention, however, the semiconductor light emitting element used as thelight source maintains the original luminance without substantialdeterioration even after a long use as long as tens of thousands hours,and its life is approximately eternal. Therefore, the image displaydevice according to the invention has a remarkably longer life ascompared with conventional devices.

Additionally, in the image display device according to the invention,the rising time for operation is very short. The time after powering thepower source to driving the light source for its normal luminance isremarkably short as compared with conventional cathode fluorescenttubes. That is, the light source operates quickly.

The present invention improves the reliability as well. Conventionalcathode fluorescent tubes have a structure confining a gas within aglass tube. Therefore, they are liable to break with shocks orvibrations. In the present invention, however, since the semiconductorlight emitting element used as the light source is a solid statecomponent, the durability against shocks or vibrations is much higher.As a result, the invention significantly improves the reliability ofvarious types of portable electronic apparatuses using image displaydevices.

Additionally, the present invention does not use harmful mercury. Manyof conventional cathode fluorescent tubes contained a predeterminedamount of mercury in the glass tube. The present invention, however,need not use harmful mercury.

Next explained is a image display device according to the thirty-forthembodiment of the invention.

FIG. 125 is a schematic cross-sectional view of the modified imagedisplay device according to the thirty-forth embodiment of theinvention. Here again, the image display device 2500B includes the lightsource section 2520, luminance adjuster 2530 and converter 2550. Theimage display device 2500B, however, is different from the image displaydevice 2500A in location of the converter 2550 which is located betweenthe light source 2520 and the luminance adjuster 2530. The samecomponents of the device shown here as those of the image display device2500A are labeled with common reference numerals, and their explanationis omitted.

In the image display device 2500B, primary light emitted from thesemiconductor light emitting element 2900 enters into the wavelengthconverters FL1 through FL3 via the optical guide plate 2522. Theincident primary light is converted into secondary light havingpredetermined wavelengths in respective wavelength converters, andenters into the optical reflectors RE1 through RE3. Then, primary lightcomponents are reflected, and secondary light components pass them andenter into the light absorbers AB1 through AB3. Also in the lightabsorbers AB1 to AB3, primary light components are absorbed, andsecondary light passes therethrough, and explained before.

Also the image display device 2500B shown in FIG. 125 promises the sameeffects as those of the image display device 2500A explained above. Inthe image display device 2500B, primary light, such as ultraviolet rays,emitted from the semiconductor light emitting element 2900 iswavelength-converted into secondary light with a longer wavelength, andthen enters into the luminance adjusters. Therefore, this versionovercomes the problem that the switching elements 2535 and the liquidcrystal layer 2536 are exposed to and deteriorated by ultraviolet raysas primary light.

In the above-explained thirteenth through thirty-forth embodiments withreference to FIGS. 97 through 125, the light emitting elements, thelight emitting devices and image display device having a combination ofa wavelength converter, a light absorber and a optical reflector aredisclosed.

Next explained are the exemplary products, such as illuminators,projectors or purifiers, which include the light emitting deviceexplained above.

FIGS. 126A through 126C are schematic diagrams showing an novelilluminator according to an embodiment of the invention. FIG. 126A is aperspective view of the entirely of the illuminator 4100, FIG. 126B is across-sectional view, and FIG. 126C is a schematic plan view of a wiringboard used therein.

FIG. 126D is a schematic diagram showing the electrical circuit of theilluminator 4100.

FIG. 127 is a schematic diagram showing a conventional fluorescent lampsystem. The system 4900 comprises a fluorescent lamp 4910 and a powersupply 4920. The fluorescent lamp 4910 has a glass tube 4911 and afluorescent material is coated onto the inner surface of the tube 4911.A mixed gas 4912 containing a mercury vapor and a inert gas such asargon (Ar) is sealed inside the tube 4911. The power supply 4920 isconnected to the electrodes 4915, 4915 which are located at the oppositeends of the tube 4911. The power supply 4920 generates a alternativevoltage having a high frequency. The voltage is supplied to theelectrodes 4915, 4915 and the mercury vapor generates a glow dischargewhich generates the ultraviolet rays. The emitted UV rays are absorbedin by the fluorescent material 4913 and converted to a visible lightwhich is emitted through the glass tube 4911 to the outside.

However, the fluorescent system as shown in FIG. 127 requires the powersupply 4920 to be equipped with a circuitry of increasing voltage andgenerating high frequency to supply the high frequency voltage to thefluorescent lamp. As a result, the power supply must have a complicatedstructure, which increases the cost, deteriorates the reliability andshorten the life of the system.

Another problem is that the starting speed is slow and the light poweris unstable just after the starting because the conventional systemutilizes the glow discharge of the mercury vapor. Further, the outputpower tends to decrease especially at the lower temperature because thestate of the discharge is affected by the ambient temperature.

Besides, when the conventional fluorescent lamp is used, it is hard todownsize the system, to improve the life and to improve the mechanicaldurability against the mechanical shock or vibration. It is alsonecessary to prevent the environmental pollution by the mercury.

Another conventional technique widely used for an illuminator is aelectric light bulb. However, the conventional light bulb has the glassbulb which seals a hot filament inside. This classical construction alsorequires many improvements about, for example, power consumption,efficiency, the heat generation, life, mechanical reliability, size,weight, and so on.

In contrast to these conventional technique, the novel illuminator 4100according to the invention has drastically improved construction. Asshown in FIGS. 126A through 126D, the illuminator 4100 includes a wiringboard 110 contained in shells 120A and 120B. The shells 4120A and 4120Bmay be made of a resin, for example. The shell 4120A is a translucentcover, and the shell 4120B is used also as a base for attachment to aceiling, for example.

The wiring board 4110 supports an arrangement of semiconductor lightemitting devices 130 for emitting white light. Each semiconductor lightemitting device 4130 includes a light emitting diode (LED) for emittingultraviolet rays and a fluorescent member as explained later in greaterdetail. The semiconductor light emitting devices 4130 preferably have“three waveform type” white emission characteristics in which theintensity reaches peaks in red, green and blue wavelength bands, forexample.

FIG. 128 is a schematic cross-sectional view of a semiconductor lightemitting device 4130 suitable for use in the present embodiment. Thesemiconductor light emitting device 4130 includes at least asemiconductor light emitting element 4132 and a fluorescent element (awavelength converter) 4136. The semiconductor light emitting element4132 is mounted on a packaging member 4134 such as lead frame. Thefluorescent element 4136 is disposed on a path for extracting light fromthe semiconductor light emitting element 4132. The semiconductor lightemitting element 4132 may be sealed in a resin 4138, for example.

The semiconductor light emitting element 4132 releases ultraviolet rays,and the fluorescent element 4136 absorbs the ultraviolet rays, convertsthem in wavelength, and release visible light or infrared rays of apredetermined wavelength to the exterior.

The wavelength of light released from the fluorescent element can beadjusted by selecting an appropriate material therefor. Exemplaryfluorescent materials for absorbing ultraviolet rays from thesemiconductor light emitting element 4132 and for efficiently releasingsecondary light are Y₂O₂S:Eu or La₂O₂S:(Eu,Sm) for releasing red light;(Sr, Ca, Ba, Eu)₁₀(PO₄)₆·C₁₂ for releasing blue light; and 3(Ba, Mg, Eu,Mn)_(O)·8Al₂O₃ for releasing green light. By mixing these fluorescentmaterials by an appropriate ratio, almost all colors in visible bandscan be made.

Most of these fluorescent materials exhibit absorption peaks inwavelength bands around 330 nm. Therefore, in order to ensure efficientwavelength conversion by using these fluorescent materials, thesemiconductor light emitting element 4132 preferably emits ultravioletrays in a wavelength band near 330 nm. The semiconductor light emittingelement 4132 having these characteristics may be obtained by using GaNcontaining boron (B) as its light emitting layer, and its preferablestructure will be explained later in greater detail.

The fluorescent element 4136 may be provided in a location distant fromthe semiconductor light emitting element 4132 along the path foremitting light therefrom or may be stacked on the surface of thesemiconductor light emitting element 4132. Alternatively the fluorescentelement 4136 may be disposed or contained within the semiconductor lightemitting element 4132.

Returning back to FIGS. 126A through 126D, semiconductor light emittingdevices 4130 are arranged in predetermined intervals on the majorsurface of the wiring board 4110 in accordance with required conditions,such as quantity of illumination light, size, power, and so on. In orderto ensure compact and dense packaging on the substrate 4110,semiconductor light emitting devices 4130 are preferably configured as“surface mounted (SMD)” lamps. By miniaturizing individual light sourcesin this manner, light from the light sources can be collected bycombining optical reflectors with individual light sources, and a highlyefficient and bright illuminator can be realized.

As to mutual connection of semiconductor light emitting devices 4130,4130 packaged on the substrate 4110, it is preferable to make units Ueach containing a predetermined number of serially connectedsemiconductor light emitting devices 4130 and to connect these units Uin parallel as exemplarily shown in FIG. 126D. In the figure, theelement denoted by the numeral 4800 is a power supply.

If this manner of connection is used, the power source voltage anddriving current need not be set high, and, even when a trouble occurs inone or more of the semiconductor light emitting devices 4130, adverseaffection to the other semiconductor light emitting devices 4130, suchas changes in driving voltage, can be reduced. That is, even when anyone or more of the units fall in malfunctions, the other units canoperate normally. Therefore, unlike the conventional fluorescent lamps,the illuminator shown here is not damaged totally, and is much moreadvantageous in reliability. However, the present invention is notlimited to this, all of the semiconductor light emitting devices 4130 onthe wiring board 4110 may be connected in series or in parallel.

Although the above-explained example uses semiconductor light emittingdevices 4130 for white emission, the invention is not limited to it. Forexample, semiconductor light emitting devices for ultraviolet emissionmay be provided on the wiring board, combining a fluorescent elementstacked on an inner wall surface of a resin cover 4120A, so as to absorbultraviolet rays, convert them in wavelength and release white light tothe exterior.

In order to ensure interchangeability with conventional fluorescentlamps, it is convenient to provide a converter circuit for converting anRF driving voltage to be applied to a fluorescent lamp into a d.c.voltage and for supplying it to the semiconductor light emitting device4130. Such a converter circuit may be provided to the supply 4800 shownin the FIG. 126D. The illuminator according to the embodiment is usablein wide applications, such as street lamps, spot light for theinspection of semiconductor wafers, mask aligning machine or other lightsources of various kinds of manufacturing equipments, light sources forplant cultivation, in addition to home-use or office-use room lamps.

According to estimation by the Inventor, semiconductor light emittingdevices 4130 arranged in four lines each containing 66 devices, forexample, will be sufficient to obtain a quantity of light correspondingto a conventional 40 W fluorescent lamp.

The illuminator according to the invention is lower in powerconsumption, longer in life, more easily reduced in size and weight, andmechanically much stronger against shocks and vibrations thanconventional fluorescent lamps. Moreover, the problem of environmentalpollution by mercury can be overcome.

Next explained is the second example of the applied products.

FIG. 129 is a schematic diagram showing a flashing device for a cameraaccording to the invention. The camera 4150 shown here includes a lens4152, finder 4154 and a semiconductor light emitting device 4130according to the invention as its flash. The semiconductor lightemitting device 4130 releases white light having a predeterminedwavelength distribution by means of a semiconductor light emittingelement and a fluorescent element as explained with reference to FIG.128. Depending on the material of the fluorescent element 4136 used inthe semiconductor light emitting device 4130, it is applicable also toenhancement of a specific emission wavelength or to infrared camera. Thesemiconductor light emitting device 4130 is connected to a pulsegenerator 4158, and behaves as a flash when supplied with a pulsatingdriving current.

The flash device according to the invention is lower in powerconsumption and longer in life as compared with conventional cameraflashing devices using bulbs. Additionally, using the characteristics ofthe semiconductor light emitting element, the flashing device can beused for special applications, such as ultra-high speed cameras.

Next explained is the third example of the applied products.

FIG. 130 is a schematic diagram showing a lamp according to theinvention. The lamp unit 4200 shown here includes a semiconductor lightemitting device 4130 near the focal point of a concave mirror 4210.Within the semiconductor light emitting device 4130, ultraviolet raysemitted from a semiconductor light emitting element iswavelength-converted by a fluorescent element, and released to theexterior as white light, for example. The light is collected andreleased toward a predetermined direction by the concave mirror 4210.The focal power can be improved by concentrating the fluorescentsubstance behaving as the light source near the focal point of theconcave mirror within the semiconductor light emitting device 130.

The lamp unit 4200 according to the invention is applicable to car-bornehead lamps or flash lamps, for example. The semiconductor light emittingdevice 4130 shown here is readily miniaturized as compared withconventional bulbs. Therefore, the semiconductor light emitting devices4130 for different emission colors can be located adjacent to the focalpoint of the concave mirror 4210. As a result, a plurality of emissioncolors can be made with a single lamp 4200. For example, a head lamp anda fog lamp can be incorporated in a common lamp unit. It is alsopossible to combine a back lamp and a stop lamp.

Instead of using the semiconductor light emitting device 4130, asemiconductor light emitting element 4132 for ultraviolet emission canbe provided so that, after the ultraviolet rays are reflected directlyby the concave mirror 4210, the light be wavelength-converted by afluorescent element. In this case, the fluorescent element may bestacked on the reflecting surface of the concave mirror 4210, or may belocated at the emission window of the lamp unit.

The device according to the invention is lower in power consumption,longer in life and much higher in mechanical strength against vibrationand shocks than conventional lamp units using bulbs. Moreover, since thelight source can be made small, the focal power is increased remarkably,and it is especially advantageous for illuminating a distant object witha high luminance.

Next explained is the fourth example of the applied products.

FIG. 131 is a schematic diagram showing a read-out device according tothe invention. The read-out device 4250 shown here includes asemiconductor light emitting device 4130A for emitting red light, asemiconductor light emitting device 4130B for emitting green light and asemiconductor light emitting device 4130C for emitting blue light. Thesesemiconductor light emitting devices 4130A through 4130C can beconfigured to emit light of their respective colors by changing thematerial of the fluorescent element 4136 contained therein.

Red light, green light and blue light from the semiconductor lightemitting devices 4130A through 4130C are irradiated onto a manuscript,not shown, and reflected rays of these different-colored rays aredetected by photodetectors 4260A through 4260C, respectively. Thephotodetectors 4260A through 4260C may be photosensitive elements orCCDs (charge coupled devices), for example. The read-out deviceaccording to the invention may be incorporated into a facsimile machine,scanner copy machine to read out information from a manuscript andconvert it into electric signals.

The device according to the invention is lower in power consumption,much longer in life and much higher in mechanical strength againstvibration and shocks than conventional read-out devices usingfluorescent lamps.

Next explained is the fifth example of the applied products.

FIG. 132 is a schematic diagram showing a projector according to theinvention. The projector 4300 shown here includes a semiconductor lightemitting device 4130 near a focal point of an concave mirror 4310, and aprojecting lens 4320 in front of them. Light released from thesemiconductor light emitting device 4130 is collected by the concavemirror 4310, and the transmission pattern of a manuscript drawn onto atranslucent sheet is projected onto a screen 4342 by the projecting lens4320.

The projector according to the invention is lower in power consumptionand generated heat, much longer in life, easier for reducing in size andweight, and much higher in mechanical strength against vibration andshocks than conventional read-out devices using bulbs.

Next explained is the sixth example of the applied products.

FIG. 133 is a schematic diagram showing a purifier according to theinvention. The purifier 4350 shown here includes an ozone generator 4370and a semiconductor light emitting element 4132 disposed along apurifying circuit 4360. When water 4355A is supplied to the purifyingcircuit 4360, it is sterilized and purified by ultraviolet rays from thesemiconductor light emitting element 4132, and discharged as clean water4345B. If ozone is solved into water by the ozone generator 4370 priorto irradiation of ultraviolet rays, the sterilizing and purifyingeffects is improved because of the sterilization and purification byozone and generation of active oxygen by irradiation of ultravioletrays.

The purifier 4350 according to the invention is also useful for airpurification. When air is supplied to the purifying circuit 4360,ultraviolet rays are irradiated to the air from the semiconductor lightemitting device 4132 to sterilize and purify the air. When a heater, notshown, is added to heat the air and discharge hot air, the sterilizingeffect of the purifier can be increased. The purifier 4350 according tothe invention is applicable for sterilizing and purifying interiors ofmedical appliances storage cases, refrigerators, and so forth.

The purifier according to the invention is higher in intensity ofultraviolet rays and purifying ability, lower in power consumption, muchlonger in life, and much higher in mechanical strength againstvibrations and shocks than conventional purifiers using ultravioletfluorescent lamps. Moreover, the purifier can operate for itspredetermined stable output immediately after the semiconductor lightemitting element 4132 is turned on. Additionally, since the purifier canbe miniaturized as a whole, it can be set in any location and especiallyuseful in aquariums for decorative fish and home baths to purify water.

Next explained is the seventh embodiment of the invention.

FIG. 134 is a schematic diagram of a ultraviolet irradiator according tothe seventh embodiment of the invention. The ultraviolet irradiator 4400shown here includes a semiconductor light emitting element 4132 near thefocal point of a concave mirror 4410. Ultraviolet rays emitted from thesemiconductor light emitting element 132 are reflected and collected bythe concave mirror 4410, and irradiated on a target 4440 with a highirradiation intensity. In this manner, the ultraviolet irradiator 4400can be used for resin molding, sunburning and disinfection, for example.If a BGaN (boron gallium nitride) compound semiconductor light emittingelement, explained later, is used, the ultraviolet irradiator 4400 canbe used as physiotherapic instruments for generating ultraviolet raysnear 300 nm which promote creation of vitamin D in human bodies.

The ultraviolet irradiator according to the invention is higher inintensity of ultraviolet rays, lower in power consumption, much longerin life and much higher in mechanical strength against vibrations orshocks than conventional ultraviolet irradiators using ultravioletfluorescent lamps. Moreover, since the invention can miniaturize thelight source remarkably, the focal power is increased, and theultraviolet irradiation density can be increased remarkably.

Next explained is the eighth example of the applied products.

FIG. 135 is a schematic diagram showing a display device according tothe invention. The display device 4450 shown here includes asemiconductor light emitting element 4130 for emitting ultraviolet raysand a display panel 4460. On the back surface of the display panel 4460,characters and figures are drown by a plurality of fluorescent elementsdifferent in emission color. Ultraviolet rays emitted from thesemiconductor light emitting element 4132 are converted in wavelength bythe fluorescent elements on the back surface of the display panel 4460and represent patterns of characters and figures.

Alternatively, a semiconductor light emitting device 4130 may be usedinstead of the semiconductor light emitting element 4132 for ultravioletemission. In this case, white light or other visible light emitted fromthe semiconductor light emitting device 4130 can be used as back lightto display characters or figures on the display panel.

The display device 4450 according to the invention can be used in wideapplications, such as car-borne indicator lamps, display lamps of toys,alarm lamps and emergency lamps, for example.

The display device according to the invention is higher in displaybrightness, lower in power consumption, much longer in life and muchhigher in mechanical strength against vibrations and shocks thanconventional display devices using fluorescent lamps or bulbs.

Next explained is the ninth example of the applied products.

FIG. 136 is a schematic diagram showing a semiconductor light emittingdevice according to the invention. The semiconductor light emittingdevice 4500 shown here includes a semiconductor light emitting element4132 for emitting ultraviolet rays, first optical reflector 4510,wavelength converter 4520, second optical reflector 4530 and lightabsorber 4540 formed in this order.

The first optical reflector 4510 has a wavelength selectivity to passultraviolet rays from the semiconductor light emitting element 4132 andto reflect visible light or other secondary light emitted from thewavelength converter 520 after wavelength conversion. That is, the firstoptical reflector 4510 has a low reflectance to ultraviolet rays fromthe semiconductor light emitting element 4132 and a high reflectance tolight with a wavelength of the secondary light from the wavelengthconverter 4520.

The wavelength selectivity can be made by using a Bragg reflectingmirror, for example. That is, by alternately stacking two kinds of tinfilms different in refractive index, a reflecting mirror having a highreflectance to light in a particular wavelength band can be made. Forexample, when the wavelength of primary light is λ and thephotorefractive index of the thin film layer is n, by alternatelystacking two kinds of thin films each having the thickness of λ/(4n), areflecting mirror having a very high reflectance to primary light can bemade. These two kinds of thin films preferably have a large differencein photorefractive index. Appropriate combinations are, for example,silicon oxide (SiO₂) and titanium oxide (TiO₂); aluminum nitride (AIN)and indium nitride (InN); and a thin film made of any one of thesematerials and a thin film of aluminum gallium arsenide, aluminum galliumphosphide, tantalum pentoxide, polycrystalline silicon or amorphoussilicon.

The wavelength converter 4520 functions to absorb ultraviolet rays fromthe semiconductor light emitting element 4132 and to release secondarylight with a longer wavelength. The wavelength converter 4520 may be alayer made of a predetermined medium containing a fluorescent element.The fluorescent element absorbs ultraviolet rays emitted from the lightemitting element 4132 and is excited thereby to release secondary lightwith a predetermined wavelength. For example, if the ultraviolet raysemitted from the light emitting element 4132 have the wavelength ofabout 330 nm, the wavelength converter 4520 may be configured so thatthe secondary light wavelength-converted by the fluorescent element hasa predetermined wavelength in the visible band or infrared band. Thewavelength of the secondary light can be adjusted by selecting anappropriate material as the fluorescent element. Appropriate fluorescentmaterials absorbing primary light in the ultraviolet band andefficiently releasing secondary light are, for example, Y₂O₂S:Eu orLa₂O₂S:(Eu,Sm) for mission of red light, (Sr, Ca, Ba, Eu)10(PO₄)₆·C₁₂for emission of blue light, and 3(Ba, Mg, Eu, Mn)O·8Al₂O₃ for emissionof green light. By mixing these fluorescent materials by an appropriateratio, substantially all colors in the visible band can be expressed.

Most of these fluorescent materials have their absorption peaks in thewavelength band of about 300 to 380 nm. Therefore, in order to ensureefficient wavelength conversion by the flourescent materials, thesemiconductor light emitting element 4132 is preferably configured toemit ultraviolet rays in the wavelength band near 330 nm.

Next explained is the second optical reflector 4530. The opticalreflector 4530 is a reflective mirror having a wavelength selectivity,and functions to reflect ultraviolet rays and pass secondary light inthe light entering from the wavelength converter 4520. That is, theoptical reflector 4530 behaves as a cut-off filter or a band pass filterwhich reflects light with the wavelength of the ultraviolet rays andpasses light with the wavelength of the secondary light. It may be aBragg reflecting mirror, for example, as explained before.

The optical reflector 4530 made in this manner reflects and returnsultraviolet rays passing through the wavelength converter 4520 back tosame with a high efficiency. The returned ultraviolet rays are thenwavelength-converted by the wavelength converter 452Q and permitted topass through the optical reflector 4530 as secondary light. That is, bylocating the optical reflector 4530 adjacent to the emission end of thewavelength converter 4520, it is possible to prevent leakage of theultraviolet rays and to return part of the ultraviolet rays passingthrough the wavelength converter 520. Therefore, the ultraviolet rayscan be efficiently converted in wavelength. The optical reflector 4530also functions to reflect ultraviolet rays which undesirably enter intothe element from the exterior. It is therefore prevented that thewavelength converter 4520 is excited by external turbulent light intoundesirable emission.

Next explained is the light absorber 4540. The light absorber 4540 has awavelength selectivity to absorb ultraviolet rays with a high efficiencyand to pass secondary light. That is, the light absorber 4540 hasabsorption characteristics in which the absorptance is high to lightwith the wavelength of the ultraviolet rays, and low to light with thewavelength of the secondary light. The light absorber 4540 with suchcharacteristics can be made of an absorber dispersed in a translucentmedium. Absorbers usable here are, for example, cadmium red or red oxidefor red secondary light, and cobalt blue or ultramarine blue for bluesecondary light.

By using the light absorber 4540, part of ultraviolet rays passingthrough the optical reflector 4530 is absorbed and prevented fromleakage to the exterior. At the same time, the spectrum of extractedlight can be adjusted to improve the chromatic pureness. Additionally,the light absorber 4540 absorbs ultraviolet rays entering from theexterior and prevents that such external turbulent light excites thewavelength converter 4520 into undesired emission.

In the device shown here, ultraviolet rays emitted from thesemiconductor light emitting element 4132 enter into the wavelengthconverter 4520 through the first optical reflector 4510 andwavelength-converted into secondary light. Part of the ultraviolet rayspassing through the wavelength converter 4320 without beingwavelength-converted therein is reflected by the second opticalreflector 4530 back to the wavelength converter 520. Part of theultraviolet rays passing even through the optical reflector 4530 isabsorbed by the light absorber 4540 and prevented from external leakage.

Light components going toward the second optical reflector 4510 in thesecondary light from the wavelength converter 4520 pass through theoptical reflector 4530 and the light absorber 4540, and can be extractedto the exterior. Light components going toward the semiconductor lightemitting element 4132 in the secondary light from the wavelengthconverter 4520 are reflected by the first optical reflector 4510, thenpass through the optical reflector 4530 and the light absorber 4540, andcan be extracted to the exterior.

In a device without the first optical reflector 45310, secondary lightemitted from the wavelength converter 4520 toward the semiconductorlight emitting element 4132 is absorbed or randomly reflected by thesemiconductor light emitting element 4132, and cannot be extractedeffectively. In contract, in the device according to the invention, thefirst optical reflector 4510 reflects the secondary light emitted fromthe wavelength converter 520 toward the semiconductor light emittingelement 4132, and makes it be extracted efficiently. That is, light isreciprocated between two optical reflectors until it iswavelength-converted. Therefore, most of light is finallywavelength-converted and extracted. Thus, the invention realizes ahighly efficient light emitting device having a high extractionefficiency.

Next explained are details of the semiconductor light emitting element4132 suitable for use in the invention to emit ultraviolet rays.

FIG. 137 is a schematic diagram showing a cross-sectional aspect of thesemiconductor light emitting element 4132 suitable for use in theinvention. The semiconductor light emitting element 4132 used here is alight emitting diode (LED) for emission in the ultraviolet wavelengthband. As illustrated in FIG. 137, the semiconductor light emittingelement 4132 includes semiconductor layers 5002 through 5008 stacked ona sapphire substrate 5001. Metal organic chemical vapor deposition(MOCVD), for example, may be used for crystalline growth of thesesemiconductor layers. Appropriate thicknesses and growth temperatures ofrespective semiconductor layers are as follows.

GaN buffer layer 5002 0.05 μm  550° C. n-GaN contact layer 5003 4.0 μm1100° C. n-AlGaN cladding layer 5004 0.2 μm 1100° C. n-BGaN active layer5005 0.5 μm 1200° C. p-AlGaN first cladding layer 5006 0.05 μm 1100° C.p-AlGaN second cladding layer 5007 0.2 μm 1100° C. p-GaN contact layer5008 0.05 μm 1100° C.

Electrodes 5009 and 5010 for introducing electric current are formed onthe n-GaN contact layer 5003 and p-GaN contact layer 5008, respectively.The semiconductor light emitting element 4132 is different fromconventional elements in using a gallium nitride compound semiconductorcontaining boron (B) as its active layer 5005 and using AlGaN as layersadjacent to the active layer 5005. Development of crystals containingboron has been progressed mainly on BN. SiC was used as the substratecrystal and a high crystalline growth temperature as high asapproximately 1300° C. was required. However, for incorporating B intoGaN, there was the problem that B has a low solubility to GaN crystaland a large lattice mismatch with SiC used as the substrate. Therefore,no BGaN tertiary mixed crystal with a high quality in flatness of thecrystalline surface morphology, for example, could be obtained.

An excellent feature of the semiconductor light emitting element 4132shown here lies in promising growth of a high-quality BGaN crystal byusing AlGaN containing Al highly resistant to heat as the underlyinglayer of GBaN. That is, even when the growth temperature is raised to1200° C. relatively high for growth of gallium nitride compounds afterAlGaN is grown under 1100° C., the surface of the crystal is maintainedsmooth, and growth of good-quality smooth BGaN crystal is ensured.

According to experiments by the Inventor, when the growth temperaturewas raised further, surface roughness became apparent probably due todropping of N from the surface of AlGaN, and lattice mismatching withAlGaN increased. That is, smoothness of the surface of the grown BGaNlayer degraded. As the concentration of B increased. Smoothness of thecrystal surface tended to degrade as the concentration B increased, andthe mixture ratio (X) of B in B_(x)Ga_(1-x)N crystal with acceptablysmooth surface was not higher than 0.1. Incorporation of B into a mixedcrystal with a higher concentration is still difficult.

However, the mixed crystal ratio the Inventor obtained was confirmed tobe sufficient for a light emitting element for ultraviolet bands and itswavelength was confirmed to be within 365 to 300 nm.

Another advantage of the structure shown here lies in that a lightemitting portion containing BGaN can be grown on the relatively thickn-GaN contact layer 5003. In order to make the element structure shownin FIG. 137, it is necessary to expose the n-type contact layer 5003 byetching the semiconductor layer upon making the n-side electrode 5009.For example allowance in processing accuracy during the etching process,the n-type contact layer 5003 is preferably grown relatively thick.However, BGaN mixed crystal is difficult to grow thick, and hencedegrades the production yield in the etching process. Therefore, BGaNmixed crystal is not suitable for use as the n-type contact layer.

BGaN mixed crystal has a mixture ratio of B which is in lattice matchingwith a 6H-type SiC substrate. When it is grown on an electricallyconductive SiC substrate, the etching process for making the electrodeis not necessary, and thick crystal need not be made. However, thecrystalline grown itself is difficult because the ratio of B in themixed crystal is as high as 0.2, and the SiC substrate becomes opaque towavelengths of ultraviolet rays. Therefore, it does not simplycontribute to improvements of element characteristics.

For the above-explained reasons, the structure of the semiconductorlight emitting element 4132 according to the invention, in which theBGaN light emitting layer is stacked on the GaN/AlGaN layers,facilitates growth of thick and smooth GaN/AlGaN layers without the needfor lattice matching conditions, and is very effective to realize LEDhaving BGaN as its light emitting layer.

Based on the structure shown in FIG. 137, a sample LED was prepared bymaking a semiconductor multi-layered structure which includes aB_(x)Ga_(1-x)N active layer 5005 with the mixture ratio (X) of B being0.05, p-Al_(z)Ga_(1-x)N first cladding layer 5006 with the mixture ratio(Y) of Al being 0.3, n-Al_(z)Ga_(1-z)N cladding layer 1004 andp-Al₂Ga_(1-z)N cladding layer 5007 with the mixture ratio (Z) of Albeing 0.2, and by processing it into chips of the size 350 μm×350 μm. Asa result ultraviolet emission with emission spectral peaks ofapproximately 330 nm was obtained. The emission intensity responsive tothe driving current of 20 mA was approximately 10 μW.

FIG. 138 is a graph showing the relation between concentration ofsilicon and photoluminescence (PL) emission intensity when silicon (Si)is doped into BGaN. The abscissa indicates concentration of silicon inBGaN, and the ordinate indicates PL emission intensity in arbitraryunit. It is known from the graph that emission intensity of LED changeswith concentration of silicon. That is, as the concentration of siliconincreases, emission intensity suddenly increases from near 1E16 cm⁻³,maximizes near approximately 1E18 to 1E20 cm⁻³, and suddenly decreaseswith higher concentrations of silicon. According to the Inventor'sexperiment, even when the mixture ratio of B was changed, this tendencyof changes in emission intensity was the same. In the layer structureshown in FIG. 137, when silicon was doped into the BGaN active layer5005 by 1E19 cm⁻³, the emission wavelength remained 330 nm, and emissionintensity responsive to 20 mA was improved to approximately 2 mW. As aresult of an additional experiment by changing concentration of siliconin the active layer, concentrations of silicon ranging from 1E17 cm⁻³ to1E21 cm were confirmed to be practically appropriate for improvingcharacteristics and for making a stacked structure.

FIG. 139 is a diagram showing a schematic cross-sectional aspect ofultraviolet emission type semiconductor light emitting element accordingto another embodiment of the invention. The semiconductor light emittingelement 4132B shown here has a multi-layered structure grown on a6H-type SiC substrate 5101. The semiconductor light emitting element4132B is substantially the same as the element explained with referenceto FIG. 137 in thicknesses and growth temperatures of respective layers,but different therefrom in the GaN buffer layer 5102 being doped withn-type impurities and in the n-side electrode 5109 being formed on thebottom surface of the SiC substrate 5101. For growth of the crystals,metal organic chemical vapor deposition (MOCVD), for example, may beused. As explained before, when the 6H-type SiC substrate 1101 is used,the element 4132B becomes opaque to light in ultraviolet wavelengthbands, and part of light radiated toward the substrate cannot beextracted to the exterior of the light emitting element. However, sincethe effective lattice mismatch ratio of the 6H-type SiC substrate withGaN is 3.4%, which is smaller than 13.8% of a sapphire substrate, thendensity of dislocation and other various crystallographic defects causedby lattice mismatch can be decreased. Thus, the quality of the crystallayer underlying the BGaN active layer 5105 is improved, which resultsin improving the crystallographic quality of the BGaN layer 5105 as welland in improving emission characteristics of the light emitting element.That is, an advantage of employment of the 6H-type SiC substrate 5101 isan improvement of emission characteristics by improvement of thecrystalline property.

Based on the structure shown in FIG. 139, LED was prepared by making amulti-layered structure which includes a B_(x)Ga_(1-x)N active layer5105 with the mixture ratio (X) of B being 0.05, p-Al_(z)Ga_(1-x)N firstcladding layer 5106 with the mixture ratio (Y) of Al being 0.3,n-Al_(z)Ga_(1-z)N cladding layer 5104 and p-Al_(z)Ga_(1-z)N claddinglayer 5107 with the mixture ratio (Z) of Al being 0.2, and by processingit into chips of the size 350 μm×350 μm. As a result ultravioletemission with emission spectral peaks of approximately 330 nm wasobtained. With an element prepared by doping silicon into theB_(x)Ga_(1-x)N active layer 5105 so that the concentration of silicon inthe crystal be 1E19 cm⁻³, emission intensity responsive to the drivingcurrent of 20 mA was approximately 1.3 mW.

FIG. 140 is a cross-sectional schematic view showing a modified versionof the semiconductor light emitting element 4132B shown in FIG. 139. Inthe semiconductor light emitting element 4132C shown here, the n-sideelectrode 5109 is made by etching the semiconductor multi-layeredstructure of the semiconductor light emitting element 4132B from the topsurface to expose the n-GaN contact layer 5103. Here again, influencesgiven to the BGaN active layer important for element characteristics arethe same, and its usefulness is great.

Above-explained embodiments of the invention are not limited toillustrated structures or proposed manufacturing methods. Althoughexplanation has been made as using BGaN mixed crystal as the lightemitting layer, any BInAlGaN compound material may be used other thanBGaN tertiary compounds, as far as a heterojunction for confinement ofinjected carriers is formed.

Also the contact layer forming the p-side electrode is not limited tothe GaN layer, any material selected from InAlGaN compounds will satisfyits characteristics, and materials having an absorption loss to emissionfrom the active layer will sufficiently satisfy the characteristicsprovided the layer is made thin. Moreover, although explanation has beenmade on LED, the invention is applicable also to gallium nitridecompound semiconductor lasers (LDs).

Also in other respects, the invention can be modified or changed invarious modes without departing from the concept of the invention.

While the present invention has been disclosed in terms of the preferredembodiment in order to facilitate better understanding thereof, itshould be appreciated that the invention can be embodied in various wayswithout departing from the principle of the invention. Therefore, theinvention should be understood to include all possible embodiments andmodification to the shown embodiments which can be embodied withoutdeparting from the principle of the invention as set forth in theappended claims.

What is claimed is:
 1. A semiconductor light emitting device comprising:a packaging member; a semiconductor light emitting element mounted onthe packaging member, the semiconductor light emitting element includinga first semiconductor layer of a first conduction type, a light emittinglayer located on the first semiconductor layer for emitting primarylight having a first wavelength, and a second semiconductor layer of asecond conduction type, the light emitting layer containing a materialselected from the group consisting of gallium nitride, zinc selenide,silicon carbide and boron nitride; and a layer of fluorescent materialabsorbing the primary light emitted from the light emitting layer and toemit secondary light having a second wavelength different from the firstwavelength, the layer of fluorescent material including an adhesivematerial which binds the fluorescent material, wherein the layer offluorescent material includes a material selected from the groupconsisting of inorganic polymer, rubber material, farinaceous materialand protein, which binds the fluorescent material.
 2. The semiconductorlight emitting device according to claim 1, wherein the fluorescentmaterial is dispersed on a solvent.
 3. The semiconductor light emittingdevice according to claim 1, further comprising a resin molded so thatthe light emitting element and the layer of fluorescent material arecovered.
 4. The semiconductor light emitting device according to claim3, wherein a refractive index of fluorescent material is between arefractive index of the surface of the light emitting element and arefractive index of the resin.
 5. The semiconductor light emittingdevice according to claim 1, wherein the layer of fluorescent materialis coated on a top surface and on a side surface of the light emittingelement.
 6. The semiconductor light emitting device according to claim1, wherein the packaging member is a selected one from the groupconsisting of lead frame, stem and substrate.
 7. The semiconductor lightemitting device according to claim 1, wherein the light emitting layercontains a gallium nitride compound semiconductor and the secondwavelength is longer than the first wavelength.
 8. The semiconductorlight emitting device according to claim 1, wherein the light emittinglayer contains a gallium nitride compound semiconductor includingindium.
 9. The semiconductor light emitting device according to claim 1,wherein the light emitting layer contains a material selected from thegroup consisting of zinc selenide, silicon carbide, and boron nitride,and the second wavelength is longer than the first wavelength.
 10. Thesemiconductor light emitting device according to claim 1, wherein thefirst wavelength is not longer than 380 nm.
 11. A semiconductor lightemitting device comprising: a packaging member; a semiconductor lightemitting element mounted on the packaging member to emit primary lighthaving a first wavelength; and a layer containing a fluorescent materialto absorb the primary light emitted from the light emitting element andto emit secondary light having a second wavelength different from thefirst wavelength, wherein the layer is provided between the packagingmember and the light emitting element and the layer includes an adhesivematerial which fixes the light emitting element to the packaging member.12. The semiconductor light emitting device according to claim 11,wherein the packaging member is selected one from the group consistingof lead frame, stem and substrate.
 13. The semiconductor light emittingdevice according to claim 11, wherein the layer includes a materialselected from the group consisting of resin materials, rubber materials,organic materials, inorganic materials, farinaceous materials, proteinmaterials, tar materials and metal solders.
 14. The semiconductor lightemitting device according to claim 11, wherein a part of the primarylight is output to outside directly without passing through thefluorescent material.
 15. The semiconductor light emitting deviceaccording to claim 11, wherein the light emitting element has a lightemitting layer containing a gallium nitride compound semiconductor andthe second wavelength is longer than the first wavelength.
 16. Thesemiconductor light emitting device according to claim 11, wherein thelight emitting layer contains a gallium nitride compound semiconductorincluding indium.
 17. The semiconductor light emitting device accordingto claim 11, wherein the light emitting element has a light emittinglayer made of a material selected from the group consisting of ZnSe,ZnSSe, ZnS, BN and SiC, and the second wavelength is longer than thefirst wavelength.
 18. The semiconductor light emitting device accordingto claim 11, wherein the first wavelength is not longer than 380 nm. 19.The semiconductor light emitting device according to claim 11, whereinthe second wavelength is in a range of a visible region.
 20. Thesemiconductor light emitting device according to claim 11, wherein thesecondary light has at least three wavelength peaks each of whichsubstantially corresponds to red, green and blue, respectively.
 21. Asemiconductor light emitting device comprising: a packaging member; asemiconductor light emitting element mounted on the packaging member toemit primary light having a first wavelength; a wire connecting thepackaging member and the semiconductor light emitting element, the wirebeing connected on a first side of the light emitting element; and alayer containing a fluorescent material to absorb the primary lightemitted from the light emitting element and to emit secondary lighthaving a second wavelength different from the first wavelength, thelayer being provided on a second side of the light emitting element, thesecond side being opposite to the first side wherein a part of theprimary light is output to outside directly without passing through thefluorescent material.
 22. The semiconductor light emitting deviceaccording to claim 21, wherein the packaging member is selected one fromthe group consisting of lead frame, stem and substrate.
 23. Thesemiconductor light emitting device according to claim 21, wherein thelayer includes an adhesive which fixes the light emitting element to thepackaging member.
 24. The semiconductor light emitting device accordingto claim 21, wherein the layer includes a material selected from thegroup consisting of resin materials, rubber materials, organicmaterials, inorganic materials, farinaceous materials, proteinmaterials, tar materials and metal solders.
 25. The semiconductor lightemitting device according to claim 21, wherein the light emittingelement has a light emitting layer containing a gallium nitride compoundsemiconductor and the second wavelength is longer than the firstwavelength.
 26. The semiconductor light emitting device according toclaim 21, wherein the light emitting layer contains a gallium nitridecompound semiconductor including indium.
 27. The semiconductor lightemitting device according to claim 21, wherein the light emittingelement has a light emitting layer made of a material selected from thegroup consisting of ZnSe, ZnSSe, ZnS, BN and SiC, and the secondwavelength is longer than the first wavelength.
 28. The semiconductorlight emitting device according to claim 21, wherein the firstwavelength is not longer than 380 nm.
 29. The semiconductor lightemitting device according to claim 21, wherein the second wavelength isin a range of a visible region.
 30. The semiconductor light emittingdevice according to claim 21, wherein the secondary light has at leastthree wavelength peaks each of which substantially corresponds to red,green and blue, respectively.